White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com

WED2ZL361MV

White Electronic Designs

DESCRIPTION

The WEDC SyncBurst - SRAM family employs high-

speed, low-power CMOS designs that are fabricated

using an advanced CMOS process. WEDCs 32Mb

SyncBurst SRAMs integrate two 1M x 18 SRAMs into a

single BGA package to provide 1M x 36 configuration. All

synchronous inputs pass through registers controlled

by a positive-edge-triggered single-clock input (CLK).

The NBL or No Bus Latency Memory utilizes all the band-

width in any combination of operating cycles. Address,

data inputs, and all control signals except output en-

able and linear burst order are synchronized to input

clock. Burst order control must be tied High or Low.

Asynchronous inputs include the sleep mode enable

(ZZ). Output Enable controls the outputs at any given

time. Write cycles are internally self-timed and initiated

by the rising edge of the clock input. This feature elimi-

nates complex off-chip write pulse generation and pro-

vides increased timing flexibility for incoming signals.

1Mx36 Synchronous Pipeline Burst NBL SRAM

FIG. 1

LOCK

IAGRAM

ONFIGURATION

(TOP VIEW)

Address Bus
(SA

- SA

)

DQa, DQb
DQPa, DQPb

DQc, DQd
DQPc, DQPd

DQa

- DQd

DQPa

- DQPd

1M x 18

CLK
CKE
ADV
LBO
CS1
CS2
CS2
OE
WE
ZZ

CLK
CKE

ADV

LBO

CE1
CE2
CE2

CLK
CKE
ADV
LBO
CS1
CS2
CS2
OE
WE
ZZ

BWd

BWa

BWc

BWb

FEATURES

n Fast clock speed: 166, 150, 133, and 100MHz
n Fast access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns
n Fast OE access times: 3.5ns, 3.8ns, 4.2ns, and 5.0ns
n Single +3.3V ± 5% power supply (V

)

n Snooze Mode for reduced-standby power
n Individual Byte Write control
n Clock-controlled and registered addresses, data

I/Os and control signals

n Burst control (interleaved or linear burst)
n Packaging:

119-bump BGA package

n Low capacitive bus loading

ADV

DQP

CLK

CKE

DQP

LBO

N C

Z Z

December 2002 Rev. 2

ECO #15834

White Electronic Designs Corporation Westborough MA (508) 366-5151

WED2ZL361MV

White Electronic Designs

FUNCTION DESCRIPTION

The WED2ZL361MV is an NBL SSRAM designed to

sustain 100% bus bandwidth by eliminating turnaround

cycle when there is transition from Read to Write, or vice

versa. All inputs (with the exception of OE, LBO and ZZ)

are synchronized to rising clock edges.
All read, write and deselect cycles are initiated by the

ADV input. Subsequent burst addresses can be inter-

nally generated by the burst advance pin (ADV). ADV

should be driven to Low once the device has been dese-

lected in order to load a new address for next operation.
Clock Enable (CKE) pin allows the operation of the chip

to be suspended as long as necessary. When CKE is

high, all synchronous inputs are ignored and the inter-

nal device registers will hold their previous values. NBL

SSRAM latches external address and initiates a cycle

when CKE and ADV are driven low at the rising edge of

the clock.
Output Enable (OE) can be used to disable the output at

any given time. Read operation is initiated when at the

rising edge of the clock, the address presented to the

address inputs are latched in the address register, CKE

is driven low, the write enable input signals WE are

driven high, and ADV driven low. The internal array is

read between the first rising edge and the second ris-

ing edge of the clock and the data is latched in the out-

put register. At the second clock edge the data is driven

out of the SRAM. During read operation OE must be

driven low for the device to drive out the requested data.

URST

EQUENCE

ABLE

NOTE 1: LBO pin must be tied to High or Low, and Floating State

must not be allowed.

Write operation occurs when WE is driven low at the

rising edge of the clock. BW[d:a] can be used for byte

write operation. The pipe-lined NBL SSRAM uses a

late-late write cycle to utilize 100% of the bandwidth. At

the first rising edge of the clock, WE and address are

registered, and the data associated with that address

is required two cycle later.
Subsequent addresses are generated by ADV High for

the burst access as shown below. The starting point of

the burst seguence is provided by the external address.

The burst address counter wraps around to its initial

state upon completion. The burst sequence is deter-

mined by the state of the LBO pin. When this pin is low,

linear burst sequence is selected. And when this pin is

high, Interleaved burst sequence is selected.
During normal operation, ZZ must be driven low. When

ZZ is driven high, the SRAM will enter a Power Sleep

Mode after 2 cycles. At this time, internal state of the

SRAM is preserved. When ZZ returns to low, the SRAM

operates after 2 cycles of wake up time.

(Interleaved Burst, LBO = High)

Case 1 Case 2 Case 3 Case 4
A1

LBO Pin High

First Address

Fourth Address

Case 1 Case 2 Case 3 Case 4
A1

LBO Pin High

First Address

Fourth Address

(Linear Burst, LBO = Low)

White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com

WED2ZL361MV

White Electronic Designs

TRUTH TABLES

YNCHRONOUS

RUTH

ABLE

RITE

RUTH

ABLE

CEx

ADV WE

BWx

CKE CLK

Address Accessed

Operation

N/A

Deselect

N/A

Continue Deselect

External Address

Begin Burst Read Cycle

Next Address

Continue Burst Read Cycle

External Address

NOP/Dummy Read

Next Address

Dummy Read

External Address

Begin Burst Write Cycle

Next Address

Continue Burst Write Cycle

N/A

NOP/Write Abort

Next Address

Write Abort

Current Address

Ignore Clock

NOTES:

1. X means Dont Care.

2. The rising edge of clock is symbolized by ( )

3. A continue deselect cycle can only be entered if a deselect cycle is executed first.

4. WRITE = L means Write operation in WRITE TRUTH TABLE.

WRITE = H means Read operation in WRITE TRUTH TABLE.

5. Operation finally depends on status of asynchronous input pins (ZZ and OE).

6. CEx refers to the combination of CE

, CE

and CE

BWa

BWb

BWc

BWd

Operation

Read

Write Byte a

Write Byte b

Write Byte c

Write Byte d

Write All Bytes

Write Abort/NOP

NOTES:

1. X means Dont Care.

2. All inputs in this table must meet setup and hold time around the rising edge of

CLK ( ).

White Electronic Designs Corporation Westborough MA (508) 366-5151

WED2ZL361MV

White Electronic Designs

BSOLUTE

AXIMUM

ATINGS

ECOMMENDED

DC O

PERATING

ONDITIONS

OLTAGE

EFERENCED

= 0V, T

= 0°C

+70°C; C

OMMERCIAL

= -40°C

+85°C; I

NDUSTRIAL

*Stress greater than those listed under Absolute Maximum Ratings: may cause permanent damage to the device. This is a stress

rating only and functional operation of the device at these or any other conditions greater than those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum rating condtions for extended periods may affect reliability.

NOTES:

1. All voltages referenced to V

(GND)

2. ZZ pin has an internal pull-up, and input leakage = ± 10µA.

DC C

HARACTERISTICS

NOTES:

1. I

is specified with no output current and increases with faster cycle times.

increases with faster cycle times and greater output loading.

2. Typical values are measured at 3.3V, 25°C, and 10ns cycle time.

BGA C

APACITANCE

NOTES:

1. This parameter is sampled.

Description

SymbolConditions

Typ

Max

Units

Notes

Control Input Capacitance

= 25°C; f = 1MHz

Input/Output Capacitance (DQ)

= 25°C; f = 1MHz

Address Capacitance

= 25°C; f = 1MHz

Clock Capacitance

= 25°C; f = 1MHz

166

150

133

100

Description

Symbol

Conditions

Typ

MHz MHz MHz MHz

Units Notes

Power SupplyI

Device Selected; All Inputs

; Cycle

840

800

760

640

1, 2

Current: Operating

Time = T

CYC

MIN; V

= MAX; Output Open

Power SupplyI

Device Deselected; V

= MAX; All Inputs

+ 0.2

Current: Standbyor V

- 0.2; All Inputs Static; CLK Frequency = 0;

Power SupplyI

Device Selected; All Inputs

; Cycle

Current: Current

Time = T

CYC

MIN; V

= MAX; Output Open;

- 0.2V

Clock Running

Device Deselected; V

= MAX; All Inputs

240

220

180

160

Standby Current

+ 0.2 or V

- 0.2; Cycle Time = T

CYC

MIN; ZZ

Voltage on V

Supply Relative to V

-0.3V to +4.6V

(DQx)

-0.3V to +4.6V

(Inputs)

-0.3V to +4.6V

Storage Temperature (BGA)

-65°C to +150°C

Short Circuit Output Current

100mA

Description

SymbolConditions

Min

Max

Units

Notes

Input High (Logic 1) Voltage

2.0

+0.5

Input Low (Logic 0) Voltage

-0.3

0.8

Input Leakage Current

0V £ V

£ V

-5

µA

Output Leakage Current

Output(s) Disabled, 0V £ V

£ V

-5

µA

Output High Voltage

= -4.0mA

2.4

Output Low Voltage

= 8.0mA

0.4

Supply Voltage

3.135

3.465

White Electronic Designs Corporation (508) 366-5151 www.whiteedc.com

WED2ZL361MV

White Electronic Designs

AC C

HARACTERISTICS

NOTES:

1. All Address inputs must meet the specified setup and hold times for all rising clock (CLK) edges when ADV is sampled low and CEx is

sampled valid. All other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected.

2. Chip enable must be valid at each rising edge of CLK (when ADV is Low) to remain enabled.

3. A write cycle is defined by WE low having been registered into the device at ADV Low. A Read cycle is defined by WE High with ADV Low.

Both cases must meet setup and hold times.

UTPUT

OAD

(A)

UTPUT

OAD

(B)

(

FOR

LZC

, t

LZOE

, t

HZOE

AND

HZC

)

Dout

Zo=50

RL=50

VL=1.5V

30pF*

Dout

353

5pF*

+3.3V

3.9

*Including Scope and Jig Capacitance

AC T

EST

ONDITIONS

= 0°C

+70°C, V

= 3.3V ± 5%; C

OMMERCIAL

= -40°C

+85°C, V

= 3.3V ± 5%; I

NDUSTRIAL

Parameter

Value

Input Pulse Level

0 to 3.0V

Input Rise and Fall Time (Measured at 20% to 80%)

1.0V/ns

Input and Output Timing Reference Levels

1.5V

Output Load

See Output Load (A)

Symbol

166MHz

150MHz

133MHz

100MHz

Parameter

Min

Max

Min

Max

Min

Max

Min

Max

Units

Clock Time

C Y C

6.0

6.7

7.5

10.0

Clock Access Time

3.5

3.8

4.2

5.0

Output enable to Data Valid

3.5

3.8

4.2

5.0

Clock High to Output Low-Z

LZC

1.5

Output Hold from Clock High

1.5

Output Enable Low to output Low-Z

LZOE

0.0

Output Enable High to Output High-Z

HZOE

3.0

3.5

Clock High to Output High-Z

HZC

3.0

3.5

Clock High Pulse Width

2.2

2.5

3.0

Clock Low Pulse Width

2.2

2.5

3.0

Address Setup to Clock High

A S

1.5

CKE Setup to Clock High

C E S

1.5

Data Setup to Clock High

1.5

Write Setup to Clock High

1.5

Address Advance to Clock High

A D V S

1.5

Chip Select Setup to Clock High

C S S

1.5

Address Hold to Clock high

0.5

CKE Hold to Clock High

CEH

0.5

Data Hold to Clock High

0.5

Write Hold to Clock High

0.5

Address Advance to Clock High

ADVH

0.5

Chip Select Hold to Clock High

CSH

0.5

White Electronic Designs Corporation Westborough MA (508) 366-5151

WED2ZL361MV

White Electronic Designs

SNOOZE MODE

SNOOZE MODE is a low-current, power-down mode

in which the device is deselected and current is re-

duced to I

. The duration of SNOOZE MODE is dic-

tated by the length of time Z is in a HIGH state. After the

device enters SNOOZE MODE, all inputs except ZZ

become gated inputs and are ignored. ZZ is an asyn-

chronous, active HIGH input that causes the device to

enter SNOOZE MODE.

When ZZ becomes a logic HIGH, I

is guaranteed

after the setup time t

is met. Any READ or WRITE

operation pending when the device enters SNOOZE

MODE is not guaranteed to complete successfully.

Therefore, SNOOZE MODE must not be initiated until

valid pending operations are completed.

NOOZE

ODE

SNOOZE MODE TIMING DIAGRAM

SUPPLY

CLOCK

ALL INPUTS

(except ZZ)

Output (Q)

ZZI

RZZ

RZZI

HIGH-Z

DESELECT or READ Only

ISB2Z

DON'T CARE

Description

Conditions

SymbolMin

Max

Units

Notes

Current during SNOOZE MODE

ZZ ³ V

ZZ active to input ignored

2(t

)

ZZ inactive to input sampled

RZZ

2(t

)

ZZ active to snooze current

ZZI

2(t

)

ZZ inactive to exit snooze current

RZZI

FIG. 2

White Electronic Designs Corporation Westborough MA (508) 366-5151

WED2ZL361MV

White Electronic Designs

OMMERCIAL

EMP

ANGE

(0°C

70°C)

Part Number

Configuration

Clock

(ns)

(MHz)

WED2ZL361MV35BC

1M x 36

3.5

166

WED2ZL361MV38BC

1M x 36

3.8

150

WED2ZL361MV42BC

1M x 36

4.2

133

WED2ZL361MV50BC

1M x 36

5.0

100

PACKAGE DIMENSION: 119 BUMP PBGA

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

1.90 (0.075)

MAX

0.711 (0.028)

MAX

1.27 (0.050)

TYP

1.27 (0.050) TYP

17.00 (0.669) TYP

A1
CORNER

20.32 (0.800)

TYP

23.00 (0.905)

TYP

7.62 (0.300)

TYP

RDERING

NFORMATION

NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.

NDUSTRIAL

EMP

ANGE

(-40°C

+85°C)

Part Number

Configuration

Clock

(ns)

(MHz)

WED2ZL361MV35BCI

1M x 36

3.5

166

WED2ZL361MV38BCI

1M x 36

3.8

150

WED2ZL361MV42BCI

1M x 36

4.2

133

WED2ZL361MV50BCI

1M x 36

5.0

100

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