1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
EDI7F332MV
Sept, 2002
Rev. 0
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
White Electronic Designs
2Mx32 and 2x2Mx32 Densities
Based on AMD - AM29LV017B Flash Device
Fast
Read
Access
Time
-
90ns
3.3V-Only
Reprogramming
Sector
Erase
Architecture
Uniform sectors of 64 Kbytes each
Any combination of sectors can be erased
Supports full chip erase
Sector
Protection
Hardware method that disables any
combination of sector from write or erase
operations
Embedded
Erase
Algorithms
Automatically preprograms and erases the chip
or any combination of sectors
Embedded
Program
Algorithms
Automatically programs and verifi es data at
specifi ed address
FIG. 1 BLOCK DIAGRAMS
EDI7F332MV-BNC: 2Mx32, 80 PIN SIMM
EDI7F2332MV-BNC: 2x2Mx32, 80 PIN SIMM
2Mx32 FLASH MODULE
FEATURES
A0-A20
G#
DQ0-DQ7
DQ8-DQ15
DQ16-DQ23
DQ24-DQ31
2M x 8
2M x 8
2M x 8
2M x 8
E0#
W0#
W1#
W2#
W3#
A0-A20
G#
DQ0-DQ7
DQ8-DQ15
DQ16-DQ23
DQ24-DQ31
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
2M x 8
E1#
E0#
W0#
W1#
W2#
W3#
Data Polling and Toggle Bit feature for detection of
program or erase cycle completion
Low
Power
Dissipation
30mA per Device Active Write Current
5A per Device CMOS Standby Current
Typical Endurance >100,000 Cycles
Single 3.0V 10% Supply
CMOS and TTL Compatible Inputs and Outputs
Commercial and Industrial Temperature Range
Package
80 Pin SIMM (JEDEC)
DESCRIPTION
The EDI7F332MV and EDI7F2332MV are organized as
one and two banks of 2Mx32 respectively. The modules are
based on AMDs AM29LV017B- 2Mx8 Flash device in TSOP
packages which are mounted on an FR4 substrate.
Both modules offer access times between 90 and 120ns
allowing for operation of high-speed microprocessors
without wait states.
3
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
EDI7F332MV
Sept, 2002
Rev. 0
White Electronic Designs Corp. reserves the right to change products or specifi cations without notice.
White Electronic Designs
ORDERING INFORMATION
PACKAGE NO. 370: 80 PIN SIMM (JEDEC)
PACKAGE NO. 369: 80 PIN SIMM (JEDEC)
ORDERING INFORMATION
J1
J3
P1
0.050 TYP.
0.250
J2-1
J2-2
J2-3
4.655 MAX.
0.250
2.245
0.062 R
0.062 R
0.850
MAX.
0.400
MAX.
0.125
MIN.
4.384
2.192
0.120
R2
4.150
+
+
J1
J3
153
P1
J2-1
J2-2
J2-3
4.655 MAX.
0.250
2.245
0.062 R
0.062 R
0.850
MAX.
0.050 TYP.
0.250
0.400
4.384
2.192
0.170
MAX.
0.125
0.225
MIN.
MIN.
R1
4.150
+
+
Note: To order an Industrial grade product substitute the letter C
in the Suffi x with the letter I.
Note: To order an Industrial grade product substitute the letter C
in the Suffi x with the letter I.
ALL DIMENSIONS ARE IN INCHES
Part Number
Speed (ns)
Package
EDI7F332MV90BNC
90
369
EDI7F332MV100BNC
100
369
EDI7F332MV120BNC
120
369
Part Number
Speed (ns)
Package
EDI7F2332MV90BNC
90
370
EDI7F2332MV100BNC
100
370
EDI7F2332MV120BNC
120
370
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