vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 1 of 13
VI Chip Bus Converter Module
PRELIMINARY
Product Description
The VI Chip Bus Converter Module (BCM) is a high
efficiency (>95%), narrow input range Sine Amplitude
Converter (SAC) operating from a 330 to 365 Vdc
primary bus to deliver an isolated low voltage secondary.
The off-line BCM provides an isolated 10.3 -11.4 V
distribution bus and is ideal for use in silver boxes and
PFC front ends. Due to the fast response time and low
noise of the BCM, the need for limited life aluminum
electrolytic or tantalum capacitors at the input of POL
converters is reduced--or eliminated--resulting in
savings of board area, materials and total system cost.
The BCM achieves a power density of 876 W/in
3
in
a VI Chip package compatible with standard pick-and-
place and surface mount assembly processes. The VI
Chip package provides flexible thermal management
through its low Junction-to-Case and Junction-to-Board
thermal resistance. Owing to its high conversion
efficiency and safe operating temperature range, the
BCM does not require a discrete heat sink in typical
applications. Low junction to case and junction to lead
thermal impedances assure low junction temperatures
and long life in the harshest environments.
Parameter
Values
Unit
Notes
+In to -In
-1.0 to 400
Vdc
+In to -In
500
Vdc
For 100 ms
PC to -In
-0.3 to 7.0
Vdc
+Out to -Out
-0.5 to 16.0
Vdc
Isolation voltage
4,242
Vdc
Input to Output
Output current
24.1
A
Continuous
Peak output current
32.7
A
For 1 ms
Output power
240
W
Continuous
Peak output power
360
W
For 1 ms
Case temperature
208
C
During reflow
Operating junction temperature
(1)
-40 to 125
C
T - Grade
-55 to 125
C
M - Grade
Storage temperature
-40 to 150
C
T - Grade
-65 to 150
C
M - Grade
352 V to 11.0 V VI Chip Converter
240 Watt (360 Watt for 1 ms)
High density up to 876 W/in
3
Small footprint 210 W/in
2
Low weight 0.5 oz (14 g)
ZVS/ZCS isolated sine
amplitude converter
Typical efficiency 95%
125C operation
<1 s transient response
>2.6 million hours MTBF
No output filtering required
B352F110T24
Vin = 330 - 365 V
Vout = 10.3 - 11.4 V
Iout = 21.8 A
K = 1/32
Rout = 15.0 m max
Actual size
VI Chip
TM
BCM
Bus Converter Module
BCM
Output Power
Designator
(=P
OUT
/10)
B
352
F
110
T
24
Bus Converter
Module
Input Voltage
Designator
Product Grade Temperatures (C)
Grade
Storage
Operating
T
-40 to150
-40 to125
M
-65 to150
-55 to125
Configuration
(Figure 15)
Output Voltage
Designator
(=V
OUT
x10)
Part Numbering
Absolute Maximum Ratings
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 2 of 13
VI Chip Bus Converter Module
PRELIMINARY
Specifications
Parameter
Min
Typ
Max
Unit
Note
Input voltage range
330
352
365
Vdc
Input dV/dt
1
V/s
Input undervoltage turn-on
325
Vdc
Input undervoltage turn-off
275
Vdc
Input overvoltage turn-on
370
Vdc
Input overvoltage turn-off
395
Vdc
Input quiescent current
1.2
mA
PC low
Inrush current overshoot
0.2
A
Using test circuit in Figure 25; See Figure 1
Input current
0.7
Adc
Input reflected ripple current
610
mA p-p
Using test circuit in Figure 25; See Figure 4
No load power dissipation
4.9
7.0
W
Internal input capacitance
0.25
F
Internal input inductance
5
nH
Recommended external input capacitance
2
F
200 nH maximum source inductance; See Figure 25
Input
(Conditions are at 352 Vin, full load, and 25C ambient unless otherwise specified)
Figure 1-- Inrush transient current at full load and 352 Vin with PC
enabled
Figure 2-- Output voltage turn-on waveform with PC enabled at full load
and 352 Vin
Figure 3-- Output voltage turn-on waveform with input turn-on at full
load and 352 Vin
Figure 4-- Input reflected ripple current at full load and 352 Vin
Input Waveforms
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 3 of 13
VI Chip Bus Converter Module
PRELIMINARY
Specifications
(continued)
Parameter
Min
Typ
Max
Unit
Note
Output voltage
10.3
11.4
Vdc
No load
9.99
11.1
Vdc
Full load
Output power
0
240
W
330 - 365 V
IN
Rated DC current
0
24.1
Adc
P
OUT
240 W
Peak repetitive power
360
W
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
Current share accuracy
5
10
%
See Parallel Operation on page 9
Efficiency
Half load
94.5
95.6
%
See Figure 5
Full load
94.7
95.8
%
See Figure 5
Internal output inductance
1.1
nH
Internal output capacitance
31
F
Effective value
Load capacitance
1,000
F
Output overvoltage setpoint
11.6
Vdc
Output ripple voltage
No external bypass
240
300
mV p-p
See Figures 7 and 9
10 F bypass capacitor
14
mV p-p
See Figure 8
Short circuit protection set point
30.0
Adc
Module will shut down
Average short circuit current
0.12
A
Effective switching frequency
3.3
3.5
3.7
MHz
Fixed, 1.75 MHz per phase
Line regulation
K
0.0309
1/32
0.0316
VOUT = KV
IN
at no load
Load regulation
R
OUT
11.0
15.0
m
Transient response
Voltage overshoot
46
mV
100% load step; See Figures 10 and 11
Response time
200
ns
See Figures 10 and 11
Recovery time
1
s
See Figures 10 and 11
Output overshoot
Input turn-on
0
mV
No output filter; See Figure 3
PC enable
0
mV
No output filter; See Figure 2
Output turn-on delay
From application of power
800
ms
No output filter; See Figure 3
From release of PC pin
250
ms
No output filter
Output (Conditions are at 352 Vin, full load, and 25C ambient unless otherwise specified)
Efficiency vs. Output Power
80
82
84
86
88
90
92
94
96
98
100
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Efficiency (%)
Figure 5-- Efficiency vs. output power at 352 Vin
Power Dissipation
3
4
5
6
7
8
9
10
11
12
13
0
24
48
72
96
120
144
168
192
216
240
Output Power (W)
Power Dissipation (W)
Figure 6--Power dissipation as a function of output power
Output Waveforms
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 4 of 13
VI Chip Bus Converter Module
PRELIMINARY
Specifications
(continued)
Figure 8--Output voltage ripple at full load and 352 Vin with 10 F
ceramic external bypass capacitor and 20 nH of distribution inductance.
Figure 7-- Output voltage ripple at full load and 352 Vin; without any
external bypass capacitor.
Ripple vs. Output Power
56
76
96
116
136
156
176
196
216
236
0
20
40
60
80
100 120 140 160 180 200 220 240
Output Power (W)
Output Ripple (mV)
Figure 9-- Output voltage ripple vs. output power at 352 Vin without any
external bypass capacitor.
Figure 10-- 0 -21.8 A load step with 2 F input capacitor and no
output capacitor.
Figure 11-- 21.8- 0 A load step with 2 F input capacitance.
vicorpower.com
800-735-6200
VI Chip Bus Converter Module
B352F110T24
Rev. 1.1
Page 5 of 13
VI Chip Bus Converter Module
PRELIMINARY
Parameter
Min
Typ
Max
Unit
Note
Primary control (PC)
DC voltage
4.8
5.0
5.2
Vdc
Module disable voltage
2.4
2.5
Vdc
Module enable voltage
2.5
2.6
Vdc
Current limit
2.4
2.5
2.9
mA
Source only
Enable delay time
250
ms
Disable delay time
20
s
See Figure 12, time from PC low to output low
Auxiliary Pins
(Conditions are at 48 Vin, full load, and 25C ambient unless otherwise specified)
Figure 12-- V
OUT
at full load vs. PC disable
Figure 13-- PC signal during fault
Specifications
(continued)
Parameter
Min
Typ
Max
Unit
Note
MTBF
MIL-HDBK-217F
2.6
Mhrs
25C, GB
Isolation specifications
Voltage
4,242
Vdc
Input to Output
Capacitance
500
pF
Input to Output
Resistance
10
M
Input to Output
Agency approvals (pending)
cTVus
UL/CSA 60950, EN 60950
CE Mark
Low Voltage Directive
Mechanical parameters
See mechanical drawing, Figures 15
Weight
0.50 / 14
oz / g
Dimensions
Length
1.26 / 32
in / mm
Width
0.87 / 22
in / mm
Height
0.25 / 6,2
in / mm
General
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