ChipFind - документация

Электронный компонент: UC3849

Скачать:  PDF   ZIP

Document Outline

Secondary Side Average Current Mode Controller
UC1849
UC2849
UC3849
FEATURES
Practical Secondary Side Control
of Isolated Power Supplies
1MHz
Operation
Differential AC Switching Current
Sensing
Accurate Programmable
Maximum Duty Cycle
Multiple Chips Can be
Synchronized to Fastest
Oscillator
Wide Gain Bandwidth Product
(70MHz, Acl>10) Current Error
and Current Sense Amplifiers
Up to Ten Devices Can Easily
Share a Common Load
DESCRIPTION
The UC1849 family of average current mode controllers accurately accom-
plishes secondary side average current mode control. The secondary side
output voltage is regulated by sensing the output voltage and differentially
sensing the AC switching current. The sensed output voltage drives a volt-
age error amplifier. The AC switching current, monitored by a current sense
resistor, drives a high bandwidth, low offset current sense amplifier. The
outputs of the voltage error amplifier and current sense amplifier differential-
ly drive a high bandwidth, integrating current error amplifier. The sawtooth
waveform at the current error amplifier output is the amplified and inverted
inductor current sensed through the resistor. This inductor current down-
slope compared to the PWM ramp achieves slope compensation, which
gives an accurate and inherent fast transient response to changes in load.
The UC1849 features load share, oscillator synchronization, undervoltage
lockout, and programmable output control. Multiple chip operation can be
achieved by connecting up to ten UC1849 chips in parallel. The SHARE bus
and CLKSYN bus provide load sharing and synchronization to the fastest
oscillator respectively. The UC1849 is an ideal controller to achieve high
power, secondary side average current mode control.
7/95
BLOCK DIAGRAM
UDG-94110
Pin numbers refer to 24-pin packages.
PARAMETER TEST
CONDITIONS
MIN
TYP
MAX
UNITS
Current Sense Amplifier
Ib
0.5
3
A
Vio
T
A
= +25C
3
mV
Over Temperature
5
mV
Avo
60
90
dB
GBW (Note 2)
Acl = 1, R
IN
= 1k, CC = 15pF, f = 200kHz (Note 1)
4.5
7
MHz
Vol
Io = 1mA, Voltage above VEE
0.5
V
Voh
Io = 0mA
3.8
V
Io =
-
1mA
3.5
V
CMRR
-
0.2 < Vcm < 8V
80
dB
PSRR
10V < VCC < 20V
80
dB
Current Error Amplifier
Ib
0.5
3
A
Vio
3
20
mV
2
UC1849
UC2849
UC3849
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20V
Output Current Source or Sink . . . . . . . . . . . . . . . . . . . . . .0.3A
Analog Input Voltages . . . . . . . . . . . . . . . . . . . . . . .
-
0.3V to 7V
ILIM, KILL, SEQ, ENBL, RUN . . . . . . . . . . . . . . . .
-
0.3V to 7 V
CLKSYN Current Source . . . . . . . . . . . . . . . . . . . . . . . . .12mA
RUN Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15mA
SEQ Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
RDEAD Current Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . .20mA
Share Bus Voltage (voltage with respect to GND) . . .0V to 6.2V
ADJ Voltage (voltage with respect to GND) . . . . . .0.9V to 6.3V
VEE (voltage with respect to GND) . . . . . . . . . . . . . . . . .
-
1.5V
Storage Temperature . . . . . . . . . . . . . . . . . . .
-
65C to +150C
Junction Temperature . . . . . . . . . . . . . . . . . . .
-
65C to +150C
Lead Temperature (Soldering, 10 sec.) . . . . . . . . . . . . .+300C
All voltages with respect to VEE except where noted; all currents
are positive into, negative out of the specified terminal.
Consult Packaging Section of Databook for thermal limitations
and considerations of packages.
RECOMMENDED OPERATING CONDITIONS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8V to20V
Sink/Source Output Current . . . . . . . . . . . . . . . . . . . . . .250mA
Timing Resistor (RT) . . . . . . . . . . . . . . . . . . . . . . . . .1k to 200k
Timing Capacitor (CT) . . . . . . . . . . . . . . . . . . . . . .75pF to 2nF
CONNECTION DIAGRAMS
DIL-24, SOIC-24, TSSOP-24 (Top View)
J or N, DW, PW Packages
PLCC-28 (Top View)
Q Package
ELECTRICAL CHARACTERISTICS
Unless otherwise stated these specifications apply for T
A
=
-
55
C to
+
125
C for
UC1849;
-
40
C to
+
85
C for UC2849; and 0
C to
+
70
C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =
4530
, RDEAD = 511
, R
CLKSYN
= 1k, T
A
= T
J
.
3
PARAMETER TEST
CONDITION
MIN
TYP
MAX
UNITS
Current Error Amplifier (cont.)
Avo
60
90
dB
GBW (Note 2)
Acl = 1, R
IN
= 1k, CC=15pF, f=200kHz (Note 1)
4.5
7
MHz
Vol
I
O
= 1mA, Voltage above VEE
0.5
V
Voh
I
O
= 0mA
3.8
V
I
O
=
-
1mA
3.5
V
CMRR
-
0.2 < Vcm < 8V
80
dB
PSRR
10V < VCC < 20V
80
dB
Voltage Error Amplifier
Ib
0.5
3
A
Vio
2
5
mV
Avo
60
90
dB
GBW (Note 2)
f = 200kHz
4.5
7
MHz
Vol
I
O
= 175
A, Volts above VEE
0.3
0.6
V
Voh
ILIM > 3V
2.85
3
3.15
V
Voh - ILIM
Tested ILIM = 0.5V, 1.0V, 2.0V
-
100
100
mV
CMRR
-
0.2 < Vcm < 8V
80
dB
PSRR
10V < VCC < 20V
80
dB
2X Amplifier and Share Amplifier
V offset (b; y = mx + b)
20
mV
GAIN (m; y = mx + b)
Slope with AV
OUT
= 1V and 2V
1.98
2.02
V
GBW (Note 2)
100
kHZ
R
SHARE
VCC = 0, V
SHARE
/I
SHARE
200
k
Total Offset
Negative supply is VEE, GND Open, VAO = GND
-
75
0
75
mV
Vol
VAO = Voltage Amplifier Vol, Volts above VEE
0.2
0.45
0.6
V
Voh
I
O
= 0mA, ILIM = 3V, VAO = Voltage Amp Voh
5.7
6
6.3
V
I
O
=
-
1mA, ILIM = 3V, VAO = Voltage Amp Voh
5.7
6
6.3
V
Adjust Amplifier
Vio
40
60
80
mV
gm
I
OUT
=
-
10
A to 10
A, V
OUT
= 3.5V, C
ADJ
= 1
F
-
1
mS
Vol
I
OUT
= 0
0.9
1
1.1
V
I
OUT
= 50
A
0.85
1
1.15
V
Voh
I
OUT
= 0, V
SHARE
= 6.5V
5.7
6
6.3
V
I
OUT
=
-
50
A
, V
SHARE
= 6.5V
5.7
6
6.3
V
Oscillator
Frequency
450
500
550
kHz
Max Duty Cycle
80
85
90
%
OSC Ramp Amplitude
2
2.5
2.8
V
Clock Driver/SYNC (CLKSYN)
Vol
0.02
0.2
V
Voh
3.6
V
R
CLKSYN
= 200
3.2
V
I
SOURCE
25
mA
R
CLKSYN
VCC = 0, V
CLKSYN
/I
CLKSYN
10
k
V
TH
1.5
V
UC1849
UC2849
UC3849
ELECTRICAL CHARACTERISTICS
Unless otherwise stated these specifications apply for T
A
=
-
55
C to
+
125
C for
UC1849;
-
40
C to
+
85
C for UC2849; and 0
C to
+
70
C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF, RT =
4530
, RDEAD = 511
, R
CLKSYN
= 1k, T
A
= T
J
.
PARAMETER TEST
CONDITION
MIN
TYP
MAX
UNITS
VREF Comparator
Turn-on threshold
4.65
V
Hysteresis
0.4
V
VCC Comparator
Turn-on Threshold
7.9
8.3
8.7
V
Hysteresis
0.4
V
KILL Comparator
Voltage Threshold
3
V
Sequence Comparator
Voltage Threshold
2.5
V
SEQ SAT
I
O
= 10mA
0.25
V
Enable Comparator
Voltage Threshold
2.5
V
RUN SAT
I
O
= 10mA
0.25
V
Reference
VREF
T
A
= 25
C
4.95
5
5.05
V
VREF
VCC = 15V
4.9
5.1
V
Line Regulation
10 < VCC < 20
3
15
mV
Load Regulation
0 < Io < 10mA
3
15
mV
Short Circuit I
VREF = 0V
30
60
90
mA
Output Stage
Rise Time
C
L
= 100pF
10
20
ns
Fall Time
C
L
= 100pF
10
20
ns
Voh
VCC > 11V, I
O
=
-
10mA
8.0
8.4
8.8
V
I
O
=
-
200mA
7.8
V
Vol
I
O
= 200mA
3.0
V
I
O
= 10mA
0.5
V
Virtual Ground
V
GND
-VEE
VEE is externally supplied, GND is floating
0.2
0.75
V
and used as Signal GND.
Icc
Icc (run)
21
30
mA
4
UC1849
UC2849
UC3849
Note 1: If a closed loop gain greater than 1 is used, the possible GBW will increase by a factor of ACL
+
10; where ACL is the
closed loop gain.
Note 2: Guaranteed by design. Not 100% tested in production.
Note 3: Unless otherwise specified all voltages are with respect to GND. Currents are positive into, negative out of the
specified terminal.
ELECTRICAL CHARACTERISTICS (cont)
Unless otherwise stated these specifications apply for T
A
=
-
55
C to
+
125
C
for UC1849;
-
40
C to
+
85
C for UC2849; and 0
C to
+
70
C for UC3849; VCC = 12V, VEE = GND, Output no load, CT = 345pF,
RT = 4530
, RDEAD = 511
, R
CLKSYN
= 1k, T
A
= T
J
.
PIN DESCRIPTIONS
ADJ: The output of the transconductance (gm =
-
1mS)
amplifier adjusts the control voltage to maintain equal
current sharing. The chip sensing the highest output cur-
rent will have its output clamped to 1V. A resistor divider
between VREF and ADJ drives the control voltage (VA+)
for the voltage amplifier. Each slave unit's ADJ voltage
increases (to a maximum of 6V) its control voltage (VA+)
until its load current is equal to the master. The 60mV
input offset on the gm amplifier guarantees that the unit
sensing the highest load current is chosen as the mas-
ter. The 60mV offset guarantees by design to be greater
than the inherent offset of the gm amplifier and the buffer
amplifier. While the 60mV offset represents an error in
current sharing, the gain of the current and 2X amplifiers
reduces it to only 30mV. This pin needs a 1
F capacitor
to compensate the amplifier.
CA-: The inverting input to the current error amplifier.
This amplifier needs a capacitor between CA- and CAO
to set its dominant pole.
CAO: The output of the current error amplifier which is
internally clamped to 4V. It is internally connected to the
inverting input of the PWM comparator.
CS-, CS+: The inverting and non-inverting inputs to the
current sense amplifier. This amplifier is not internally
compensated so the user must compensate externally to
attain the highest GBW for the application.
CLKSYN: The clock and synchronization pin for the
oscillator. This is a bidirectional pin that can be used to
synchronize several chips to the fastest oscillator. Its
input synchronization threshold is 1.4V. The CLKSYN
voltage is 3.6V when the oscillator capacitor (CT) is
being discharged, otherwise it is 0V. If the recommended
synchronization circuit is not used, a 1k or lower value
resistor from CLKSYN to GND may be needed to
increase fall time on CLKSYN pin.
CSO: The output of the current sense amplifier which is
internally clamped to 4V.
ENBL: The active low input with a 2.5V threshold
enables the output to switch. SEQ and RUN are driven
low when ENBL is above its 2.5V threshold.
GND: The signal ground used for the voltage sense
amplifier, current sense amplifier, current error amplifier,
voltage reference, 2X amplifier, and share amplifier. The
output sink transistor is wired directly to this pin.
KILL: The active low input with a 3.0V threshold stops
the output from switching. Once this function is activated
RUN must be cycled low by driving KILL above 3.0V and
either resetting the power to the chip (VCC) or resetting
the ENBL signal.
ILIM: A voltage on this pin programs the voltage error
amplifier's Voh clamp. The voltage error amplifier output
represents the average output current. The Voh clamp con-
sequently limits the output current. If ILIM is tied to VREF, it
defaults to 3.0V. A voltage less than 3.0V connected to
ILIM clamps the voltage error amplifier at this voltage and
consequently limits the maximum output current.
OSC: The oscillator ramp pin which has a capacitor (CT)
to ground and a resistor (RDEAD) to the RDEAD pin pro-
grams its maximum duty cycle by programming a mini-
mum dead time. The ramp oscillates between 1.2V to
3.4V when an RDEAD resistor is used. The maximum
duty cycle can be increased by connecting RDEAD to
OSC which changes the oscillator ramp to vary between
0.2V and 3.5V. In order to guarantee zero duty cycle in
this configuration VEE should not be connected to GND.
The charge time is approximately T
CHARGE
= R
T
C
T
when the RDEAD resistor is used.
The dead time is approximately T
DISCHARGE
= 2
RDEAD
C
T
.
1
T
CHARGE
+ T
DISCHARGE
T
CHARGE
T
CHARGE
+ T
DISCHARGE
The C
T
capacitance should be increased by approxi-
mately 40pF to account for parasitic capacitance.
OUT: The output of the PWM driver. It has an upper
clamp of 8.5V. The peak current sink and source are
250mA. All UVLO, SEQ, ENBL, and KILL logic either
enable or disable the output driver.
RDEAD: The pin that programs the maximum duty cycle
by connecting a resistor between it and OSC. The maxi-
mum duty cycle is decreased by increasing this resistor
value which increases the discharge time. The dead
time, the time when the output is low, is 2
RDEAD
C
T
. The C
T
capacitance should be increased by approxi-
mately 40pF to account for parasitic capacitance.
RT: This pin programs the charge time of the oscillator
ramp. The charge current is
VREF
2
R
T
The charge time is approximately T
CHARGE
R
T
C
T
when the RDEAD resistor is used.
The dead time is approximately T
DISCHARGE
2
RDEAD
C
T
.
RUN: This is an open collector logic output that signifies
when the chip is operational. RUN is pulled high to VREF
through an external resistor when VCC is greater than
8.4V, VREF is greater than 4.65V, SEQ is greater than
2.5V, and KILL lower than 3.0V. RUN connected to the
VA+ pin and to a capacitor to ground adds an RC rise
time on the VA+ pin initiating a soft start.
SEQ: The sequence pin allows the sequencing of startup
for multiple units. A resistor between VREF and SEQ and
a capacitor between SEQ and GND creates a unique RC
rise time for each unit which sequences the output start-
up.
SHARE:The nearly DC voltage representing the average
output current. This pin is wired directly to all SHARE
pins and is the load share bus.
VA+, VA-: The inverting and non-inverting inputs to the
voltage error amplifier.
VAO: The output of the voltage error amplifier. Its Voh is
clamped with the ILIM pin.
5
UC1849
UC2849
UC3849
(1) Frequency
(2) Maximum Duty Cycle
PIN DESCRIPTIONS (cont.)
6
CIRCUIT BLOCK DESCRIPTION:
PWM Oscillator:The oscillator block diagram with exter-
nal connections is shown in Figure 1. A resistor (R
T
) con-
nected to pin RT sets the linear charge current;
2.5V
R
T
.
The timing capacitor (C
T
) is linearly charged with the
charge current forcing the OSC pin to charge to a 3.4V
threshold. After exceeding this threshold, the RS flip-flop
is set driving CLKSYN high and RDEAD low which dis-
charges C
T
. This discharge time with the RC time delay
of 2
C
T
RDEAD is the minimum output low time. OSC
continues to discharge until it reaches a 1.2V threshold
and resets the RS flip-flop which repeats the charging
sequence as shown in Figure 2. Equations to approxi-
mate frequency and maximum duty cycle are listed
under the OSC pin description. Figure 3 and 4 graphs
show measured variation of frequency and maximum
duty cycle with varying RT, CT, and RDEAD component
values.
As shown in Figure 5, several oscillators are synchro-
nized to the highest free running frequency by connect-
ing 100pF capacitors in series with each CLKSYN pin
and connecting the other side of the capacitors together
forming the CLKSYN bus. The CLKSYN bus is then
pulled down to ground with a resistance of approximately
10k. Referring to Figure1, the synchronization threshold
is 1.4V. The oscillator blanks any synchronization pulse
that occurs when OSC is below 2.5V. This allows units,
once they discharge below 2.5V, to continue through the
UC1849
UC2849
UC3849
Figure 2. Oscillator and PWM Output Waveform
Figure 1. Oscillator Block with External Connections
UDG-94111-1
UDG-94112
VCC: The input voltage of the chip. The chip is opera-
tional between 8.4V and 20V.
VEE: The negative supply to the chip which powers the
lower voltage rail for all amplifiers. The chip is operational
if VEE is connected to GND or if GND is floating. When
voltage is applied externally to VEE, GND becomes a vir-
tual ground because of an internal diode between VEE
and GND. The GND current flows through the forward
biased diode and out VEE. GND is always the signal
ground from which the voltage reference and all amplifier
inputs are referenced.
VREF: The reference voltage equal to 5.0V.
PIN DESCRIPTIONS (cont.)
I
RT
7
current discharge and subsequent charge cycles whether
or not other units on the CLKSYN bus are still synchro-
nizing. This requires the frequency of all free running
oscillators to be within 40% of each other to guarantee
synchronization.
Grounds, Voltage Sensing and Current Sensing: The
voltage is sensed directly at the load. Proper load sharing
requires the same sensed voltage for each power supply
connected in parallel. Referring to Figure 6, the positive
sense voltage (VSP) connects to the voltage error ampli-
fier inverting terminal (VA-), the return lead for the on-
chip reference is used as the negative sense (VSM). The
current is sensed across the shunt resistor, R
S
.
Figure 6 shows one recommended voltage and current
sensing scheme when VEE is connected to GND. The
signal ground is the negative sense point for the output
voltage and the positive sense point for the output cur-
rent. The voltage offset on the current sense amplifier is
not needed if VEE is separated from GND. VEE is the
negative supply for the current sense amplifier. When it is
separated from GND, it extends the current sense ampli-
fier's common mode input voltage range to include VEE
which is approximately
-
0.7V below ground. The resistor
R
ADJ
is used for load sharing. The unit which is the mas-
ter will force V
ADJ
to 1.0V. Therefore, the regulated volt-
age being sensed is actually
R
ADJ
R1
+
R
ADJ
VSM = 0V, V
ADJ
= 1V (master), VREF = 5V
R
ADJ
R1
+
R
ADJ
Figure 3. Output Frequency
Figure 4. Maximum Duty Cycle
Figure 5. Oscillator Synchronization
Connection Diagram
UDG-94113
Figure 6. Voltage and Current Sense VEE Tied to GND
UDG-94114
VSP
-
VSM = (VREF
-
V
ADJ
)
(
)
+
V
ADJ
VSP = 4
(
)
+ 1V
UC1849
UC2849
UC3849
CIRCUIT BLOCK DESCRIPTION (cont.)
8
UC1849
UC2849
UC3849
The ADJ pin voltage on the slave chips will increase forc-
ing their load currents to increase to match the master.
The AC frequency response of the voltage error amplifier
is shown in Figure 7.
Startup and Shutdown: Isolated power up can be
accomplished using the UCC1889. Application Note U-
149 is available for additional information.
The UC1849 offers several features that enhance startup
and shutdown. Soft start is accomplished by connecting
RUN to VA+ and a capacitor to ground. The resulting RC
rise time on the VA+ pin initiates a soft start. It can also
be accomplished by connecting RUN to ILIM. When RUN
is low it will command zero load current, guaranteeing a
soft start. The undervoltage lockout (UVLO) is a logical
AND of ENBL < 2.5V, SEQ > 2.5V, VCC > 8.4V and
VREF > 4.65V. The block diagram shows that the thresh-
olds are set by comparators. By placing an RC divider on
the SEQ pin, the enabling of multiple chips can be
sequenced with different RC time constants. Similarly,
different RC time constants on the ENBL pins can
sequence shutdown. The UVLO keeps the output from
switching; however the internal reference starts up with
VCC less than 8.4V. The KILL input shuts down the
switching of the chip. This can be used in conjunction
with an overvoltage comparator for overvoltage protec-
tion. In order to restart the chip after KILL has been initi-
ated, the chip must be powered down and then back up.
A pulse on the ENBL pin also accomplishes this without
actually removing voltage to the VCC pin.
Load Sharing: Load sharing is accomplished similar to
the UC1907. The sensed current for the UC1849 has an
AC component that is amplified and then averaged. The
voltage error amplifier output is the current command
signal representing the average output load current. The
ILIM pin programs the upper clamp voltage of this ampli-
fier and consequently the maximum load current. A gain
of 2 amplifier connected between the voltage error ampli-
fier output and the share amplifier input increases the
current share resolution and noise margin. The average
current is used as an input to a source only load share
buffer amplifier. The output of this amplifier is the current
share bus. The IC with the highest sensed current will
have the highest voltage on the current share bus and
consequently act as the master. The 60mV input offset
guarantees that the unit sensing the highest load current
is chosen as the master.
The adjust amplifier is used by the remaining (slave) ICs
to adjust their respective references high in order to bal-
ance each IC's load current. The master's ADJ pin will be
at its 1.0V clamp and connected back to the non-invert-
ing voltage error amplifier input through a high value
resistor. This requires the user to initially calculate the
control voltage with the ADJ pin at 1.0V.
VREF can be adjusted 150mV to 300mV which compen-
sates for 5% unit to unit reference mismatch and external
resistor mismatch. R
ADJ
will typically be 10 to 30 times
larger than R1. This also attenuates the overall variation of
the ADJ clamp of 1V 100mV by a factor of 10 to 30, con-
tributing only a 3mV to 10mV additional delta to VREF.
Refer to the UC3907 Application Note U-130 for further
information on parallel power supply load sharing.
Current Control Loop: The current sense amplifier (CSA)
is designed specifically for the task of sensing and amplify-
ing the inductor ripple current at frequencies up to 1MHz.
The CSA's input offset voltage (VIO) is trimmed to less
than 1mV to minimize error of the average current signal.
This amplifier is not internally compensated allowing the
user to optimally choose the zero crossing bandwidth.
1
2
R
INV
C
COMP
R
INV
is the input resistance at the inverting terminal CS-
C
COMP
is the capacitance between CS- and CSO.
Although it is only unity gain stable for a GBW of 7MHz,
the amplifier is typically configured with a differential gain
of at least 10, allowing the amplifier to operate at 70MHz
with sufficient phase margin. A closed loop gain of 10
attenuates the output by 20.8dB.
1
11
to the inverting terminal assuring stability. The amplifier's
gain fed back into the inverting terminal is less than unity
m
Figure 7. AC Frequency Response of the Voltage
Error Amplifier
CIRCUIT BLOCK DESCRIPTION (cont.)
(3)
Frequency (0dB) =
20.8 = 20log
9
at 7MHz, where the phase margin begins to roll off. See
Figure 8 for typical Bode plot.
The gain of the differential current sense amplifier
(CS
GAIN
) is calculated by knowing the maximum load
current. The maximum voltage across the shunt resistor
(R
S
) divided by R
S
is the maximum load current. By
amplifying the voltage across RS, V
RS
, to be equal to the
voltage error amplifier Voh, the current control loop keeps
the load from exceeding its current limit. Voh is set at
3.0V if ILIM is connected to VREF. The maximum current
limit clamp can be reduced by reducing the voltage at
ILIM to less than 3.0V as described in the ILIM pin
description.
V
RS
Max I
LOAD
V
ILIM
V
RS
.
The current error amplifier (CEA) also needs its loop
compensated by the user with the same criteria as the
current sense amplifier. This amplifier is essentially the
same wide bandwidth amplifier without the input offset
voltage trim. The zero crossing can also be approximate-
ly calculated with Equation 3. The gain bandwidth of the
current loop is optimized by matching the inductor
downslope (Vo/L) to the oscillator ramp slope (Vs
fs).
Subharmonic oscillation problems are avoided by keep-
ing the amplified inductor downslope less than the oscil-
lator ramp slope.
The following equation determines the current error
amplifier gain (GCA):
Vs
fs
(Vo/L)
R
S
CS
GAIN
where CS
GAIN
and R
S
are defined by equations
4 and 5,
Vs is the oscillator peak to peak voltage,
fs is the oscillator frequency,
Vo is the output voltage,
and L is the inductance.
Additional Information about average current mode con-
trol can be found in Unitrode Application Note U-140.
Design Example: Figure 9 is an open loop test that lets
the user test the circuit blocks discussed without having
to build an entire control loop. The pulse width can be
varied by either the V
ADJ
or the VI
SENSE
inputs. Figure 10
shows an isolated power supply using the UC1849 sec-
ondary side average current mode controller.
UC1849
UC2849
UC3849
CIRCUIT BLOCK DESCRIPTION (cont.)
m
-
Figure 8. Current Sense Amplifier and Current Error
Amplifier Bode Plot
(5) CS
GAIN
=
(6)
GCA = ;
(4) R
S
=
Figure 9. Open Loop Circuit
UDG-94115-1
10
UNITRODE INTEGRATED CIRCUITS
7 CONTINENTAL BLVD. MERRIMACK, NH 03054
TEL. 603-424-2410 FAX 603-424-3460
Figure 10. UC1849 Application Diagram
UC1849
UC2849
UC3849
UDG-94116-1
IMPORTANT NOTICE
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue
any product or service without notice, and advise customers to obtain the latest version of relevant information
to verify, before placing orders, that information being relied on is current and complete. All products are sold
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those
pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL
APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO
BE FULLY AT THE CUSTOMER'S RISK.
In order to minimize risks associated with the customer's applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other
intellectual property right of TI covering or relating to any combination, machine, or process in which such
semiconductor products or services might be or are used. TI's publication of information regarding any third
party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright
1999, Texas Instruments Incorporated