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FEATURES
APPLICATIONS
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
BO_OUTZ
OUT1
OUT2
OUT3
OUT4
OUT5
OUT6
OUT7
OUT8
GND
BO
V
IN
5V
OUT
SCLK
NCS
MOSI
RST
R
DELAY
EN1
NC
PWP PACKAGE
(TOP VIEW)
NC No internal connection
DESCRIPTION/ORDERING INFORMATION
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
Electrical Applicances
Eight Low-Side Drivers With Internal Clamp
for Inductive Loads and Current Limiting for
Air Conditioning Units
Self Protection
Ranges
Seven Outputs are Rated at 150 mA and
Dishwashers
Controlled Through Serial Interface
Refrigerators
One Output Rated at 150 mA and
Microwaves
Controlled Through Serial Interface and
Washing Machines
Dedicated Enable Pin
General-Purpose Interface Circuit Allowing
5-V
5% Regulated Power Supply With
Microcontroller Interface to Relays, Electric
Motors, LEDs, and Buzzers
200-mA Load Capability at V
IN
Max of 18 V
Internal Voltage Supervisory for Regulated
Output
Serial Communications for Control of Eight
Low-Side Drivers
Enable/Disable Input for OUT1
5-V or 3.3-V I/O Tolerant for Interface to
Microcontroller
Programmable Power On-Reset Delay Before
RST Asserted High, Once 5 V Is Within
Specification (6 ms Typ)
Programmable Deglitch Timer Before RST Is
Asserted Low (40
s Typ)
Programmable Brown-Out Feature
Thermal Shutoff for Self Protection
The power supply provides regulated 5-V output to power the system microcontroller and drive eight low-side
switches. The brown-out detection output (BO_OUTZ) warns the system if there is a temporary drop in the
supply voltage, so the system can prevent potentially hazardous situations.
A serial communications interface controls the eight low-side outputs; each output has an internal snubber circuit
to absorb the inductive load at turn OFF. Alternatively, the system can use a fly-back diode to V
IN
to help
recirculate the energy in an inductive load at turn OFF.
ORDERING INFORMATION
T
A
PACKAGE
ORDERABLE PART NUMBER
TOP-SIDE MARKING
Reel of 2000
TPIC9202PWPR
40
C to 125
C
PowerPADTM PWP
IC9202
Tube of 70
TPIC9202PWP
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright 20052006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
www.ti.com
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
PINOUT CONFIGURATION
NO.
NAME
I/O
DESCRIPTION
1
BO_OUTZ
O
Brown-out indicator
2
OUT1
O
Low-side output 1
3
OUT2
O
Low-side output 2
4
OUT3
O
Low-side output 3
5
OUT4
O
Low-side output 4
6
OUT5
O
Low-side output 5
7
OUT6
O
Low-side output 6
8
OUT7
O
Low-side output 7
9
OUT8
O
Low-side output 8
10
GND
I
Ground
11
NC
No connection
12
EN1
I
Enable/disable for OUT1
13
R
DELAY
O
Power-up reset delay
14
(1)
RST
I/O
Power-on reset output (open drain)
15
MOSI
I
Serial data input
16
NCS
I
Chip select
17
SCLK
I
Serial clock for data synchronization
18
5V
OUT
O
Regulated output
19
V
IN
I
Unregulated input voltage source
20
BO
I
Brown-out input threshold setting
(1)
Terminal 14 can be used as an input or an output.
2
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OUT1 at
150 mA
OUT2 at 150 mA
OUT3 at 150 mA
OUT4 at 150 mA
OUT5 at 150 mA
OUT6 at 150 mA
OUT7 at 150 mA
OUT8 at 150 mA
Gate Drive
and Control
Voltage
Supervisor
Comp
Bandgap
Ref
V
ref
+
V
ref
1.2 V
Comp
Gate Control
for Outputs
1 Through 8
EN1
NCS
SCLK
MOSI
718 V
V
IN
R
DELAY
5 V
5 k
RST
R
DELAY
BO_OUTZ
OUT8
OUT8
OUT7
OUT7
OUT6
OUT6
OUT5
OUT5
OUT4
OUT4
OUT3
OUT3
OUT2
OUT2
OUT1
OUT1
EN1
NCS
SCLK
MOSI
V
IN
BO
Serial
Register
Parallel
Register
Enables
OUT1
GND
GND
10 V
20
(2 W)
I
const
PMOS
Optional, dependent
on heat-management
implementation
(see Note A)
5V
OUT
RST
100 k
100 k
100 k
50 k
Recommended
6 V
BO_OUTZ
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
FUNCTIONAL BLOCK DIAGRAM
A.
The resistor and Zener diode are required if there is insufficient thermal management allocation.
3
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DETAILED DESCRIPTION
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
The 5-V regulator is powered from V
IN
, and the regulated output is within 5 V
5% over the operating conditions.
The open-drain power-on reset (RST) pin remains low until the regulator exceeds the set threshold, and the
timer value set by the capacitor on the reset delay (R
DELAY
) pin expires. If both of these conditions are satisfied,
RST is asserted high. This signifies to the microcontroller that serial communications can be initiated to the
TPIC9202.
The serial communications is an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller. A single register controls all the outputs (one bit per output). The default value is zero (OFF). If
an output requires pulse width modulation (PWM) function, the register must be updated at a rate faster than the
desired PWM frequency. OUT1 can be controlled by serial input from the microcontroller or with the dedicated
enable (EN1) pin. If EN1 is pulled low or left open, the serial input through the shift register controls OUT1. If
EN1 is pulled high, OUT1 always is turned on, and the serial input for OUT1 is ignored.
The brown-out (BO) input is a resistor divided from the input supply and is used to determine if the supply
voltage drops to undesired levels. If the input drops below the programmed value, BO_OUTZ is pulled low, and
all outputs are disabled. Once the input supply line returns to the minimum desired level, the outputs are
enabled to the previous programmed states.
If RST is asserted, all outputs are turned OFF internally, and the input register is reset to all zeroes. The
microcontroller must write to the register to turn the outputs ON again.
4
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Absolute Maximum Ratings
(1)
Dissipation Ratings
Recommended Operating Conditions
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
MIN
MAX
UNIT
V
IN
24
V
I(unreg)
Unregulated input voltage
(2) (3)
V
BO
24
EN1, MOSI, SCLK, and NCS
7
V
I(logic)
Logic input voltage
(2) (3)
V
RST and R
DELAY
7
V
O
Low-side output voltage
OUT1OUT8
16.5
V
OUTn = ON and shorted to V
IN
I
LIMIT
Output current limit
(4)
350
mA
with low impedance
JA
Thermal impedance, junction to ambient
(5)
33
C/W
JC
Thermal impedance, junction to top of package
(5)
20
C/W
JP
Thermal impedance, junction to thermal pad
(5)
1.4
C/W
P
D
Continuous power dissipation
(6)
3.7
W
ESD
Electrostatic discharge
(7)
2
kV
T
A
Operating ambient temperature range
40
125
C
T
stg
Storage temperature range
65
125
C
T
lead
Lead temperature
Soldering, 10 s
260
C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to GND.
(3)
Absolute negative voltage on these pins must not go below 0.5 V.
(4)
Not more than one output should be shorted at a time, and duration of the short circuit should not exceed 1 ms.
(5)
The thermal data is based on using 1-oz copper trace with JEDEC 51-5 test board for PWP.
(6)
The data is based on ambient temperature of 25
C max.
(7)
The Human Body Model is a 100-pF capacitor discharged through a 1.5-k
resistor into each pin.
T
A
25
C
DERATING FACTOR
T
A
= 125
C
PACKAGE
POWER RATING
ABOVE T
A
= 25
C
POWER RATING
PWP
3787 mW
30.3 mW/
C
757 mW
MIN
MAX
UNIT
V
IN
7
18
V
I(unreg)
Unregulated input voltage
V
BO (as seen by external resistor network)
0
18
V
I(logic)
Logic input voltage
EN1, RST, and R
DELAY
, MOSI, SCLK, and NCS
0
5.25
V
T
A
Operating ambient temperature
40
125
C
5
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Electrical Characteristics
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
T
A
= 40
C to 125
C, V
IN
= 7 V to 18 V (unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN TYP
(1)
MAX
UNIT
Supply Voltage and Current
V
IN
(2)
Input voltage
7
18
V
Enable = low, OUT1OUT8 = OFF
3
I
IN
Input supply current
mA
Enable = high, OUT1OUT8 = ON
5
Logic Inputs (MOSI, NCS, SCLK, and EN1)
V
IL
Logic input low level
I
IL
= 100
A
0.8
V
V
IH
Logic input high level
I
IL
= 100
A
2.4
V
Reset (RST)
V
OL
Logic level output
I
OL
= 1.6 mA
0.4
V
V
OH
(3)
Logic level output
5-k
pullup to V
CC
V
CC
0.8
V
V
H
Disabling reset threshold
5-V regulator ramps up
4.25
4.5
V
V
L
Enabling reset threshold
5-V regulator ramps down
3.3
3.75
V
V
HYS
Threshold hysteresis
0.12
0.5
V
Reset Delay (R
DELAY
)
I
OUT
Output current
18
28
48
A
t
DW
Reset delay timer
C = 47 nF
3
6
ms
t
UP
Reset capacitor to low level
C = 47 nF
45
s
Output (OUT1OUT8)
V
OL
Output ON
I
OUTn
= 150 mA
0.4
0.7
V
I
OH
Output leakage
V
OH
= Max of 16.5 V
2
A
Regulator Output (5V
OUT
)
I
5VOUT
= 5 mA to 200 mA, V
IN
= 7 V to 18 V,
5V
OUT
Output supply
4.75
5
5.25
V
C
5V
= 1
F
Limit output short circuit
I
5Vout
5 V = 0 V
200
mA
current
Brown-Out (BO) Input
Threshold for brown-out
1.3
V
BOV
thes
V
IN
reduced until BO_OUTZ goes low
detection
Brown-Out Detection Output (BO_OUTZ)
V
OL
Logic level output
I
OL
= 100
A
0.4
V
V
OH
(3)
Logic level output
Pullup to V
CC
V
CC
0.8
V
Thermal Shutdown
T
SD
Thermal shutdown
150
C
T
HYS
Hysteresis
20
C
(1)
All typical values are at T
A
= 25
C.
(2)
There are external high-frequency noise-suppression capacitors and filter capacitors on V
IN
.
(3)
V
CC
is the pullup resistor voltage.
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Output Control Register
ENABLE TRUTH TABLE
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
MSB
LSB
IN8
IN7
IN6
IN5
IN4
IN3
IN2
IN1
0
0
0
0
0
0
0
0
INn = 0 = Output OFF
INn = 1 = Output ON
To operate the output in PWM mode, the output control register must be updated at a rate twice the desired
PWM frequency of the output. Maximum PWM frequency is 5 kHz. The register is updated every 100
s.
SERIAL INPUT
EN1
OUT1
FOR OUT1
Open
H
On
Open
L
Off
L
H
On
L
L
Off
H
H
On
H
L
On
7
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Serial Communications Interface
IN1
LSB
IN7
IN6
IN5
IN4
IN3
IN2
IN8
MSB
XXX
T1
T5
T8
T2
T4
T3
T1
NCS
SCLK
MOSI
1
2
3
4
5
6
7
8
T7
T6
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
The serial communications are an 8-bit format, with data transfer synchronized using a serial clock from the
microcontroller (see
Figure 1
). A single register controls all the outputs. The signal gives the instruction to control
the output of TPIC9202.
The NCS signal enables the SCLK and MOSI data when it is low. After NCS is set to low for T1, synchronization
clock and data begin to transmit and, after the 8-bit data has been transmitted, NCS is set high again to disable
SCLK and MOSI and to transfer the serial data to the control register. SCLK must be held low when NCS is
high.
Figure 1. Serial Communications
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Timing Requirements
Reset Delay (R
DELAY
)
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
T
A
= 40
C to 125
C, V
IN
= 7 V to 18 V (unless otherwise stated)
PARAMETER
MIN
TYP
MAX
UNIT
f
SPI
SPI frequency
4
kHz
T1
Delay time, NCS falling edge to SCLK rising edge
10
ns
T2
Delay time, NCS falling edge to SCLK falling edge
80
ns
T3
Pulse duration, SCLK high
60
ns
T4
Pulse duration, SCLK low
60
ns
T5
Delay time, last SCLK falling edge to NCS rising edge
80
ns
T6
Setup time, MOSI valid before SCLK edge
10
ns
T7
Hold time, MOSI valid after SCLK edge
10
ns
T8
Time between two words for transmitting
170
ns
The R
DELAY
output provides a constant current source to charge an external capacitor to approximately 6.5 V.
The external capacitor is selected to provide a delay time, based on the current equation for a capacitor,
I = C(
v/
t) and a 28-
A typical output current.
Therefore, the user should select a 47-nF capacitor to provide a 6-ms delay at 3.55 V.
I = C(
v/
t)
28
A = C
(3.55 V/6 ms)
C = 47 nF
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APPLICATION INFORMATION
TPIC9202
MCU/DSP
MOSI
SCLK
NCS
BO_OUTZ
RST
5V
5% at 200 mA
OUT
EN1
R
DELAY
Buzzer Driver
Relay Driver
Relay Driver
Relay Driver
Relay Driver
Fan Driver
Fan Driver
Fan Driver
8 Outputs
Brown Out
DC Input 7 V to 18 V
GND
Filters
AC
Water
Supply
Valve
Water
Outlet
Softener
Supply
Driver
5V
OUT
RST
Power
Switch
M
Cover
Switch
Temperature
Sensor
(Optional)
Optical
Sensor
Water-Level
Sensor
Volume
Sensor
Keypad
Display
(LED/LCD/VFD)
Controller
Regulator
POR/SYS
TPIC9202
+
-
~
~
LED LED
Brown-Out
Detect
V
IN
BO
BO_OUTZ
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
Figure 2. Typical Application
Figure 3. Washing-Machine Application
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PCB Layout
Application Using a Multilayer PCB
Package Thermal Pad
Solder Pad (Land Pattern)
Thermal Via's
Package Outline
Power Pad
Package Solder Pad
Package Solder Pad
(Bottom Trace)
Thermal Via
Component Traces
Thermal Isolation
Power Plane Only
1.5748 mm
0.0 0.071-mm Board Base
and Bottom Pad
0.5246 0.5606-mm
Power Plane
(1-oz Cu)
1.0142 1.0502-mm
Ground Plane
(1-oz Cu)
1.5038 1.5748-mm
Component Trace
(2-oz Cu)
2 Plane
4 Plane
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
APPLICATION INFORMATION (continued)
To maximize the efficiency of this package for application on a single layer or multi-layer PCB, certain guidelines
must be followed when laying out this part on the PCB.
The following information is to be used as a guideline only.
For further information, see the PowerPAD concept implementation document.
In a multilayer board application, the thermal vias are the primary method of heat transfer from the package
thermal pad to the internal ground plane (see
Figure 4
and
Figure 5
).
The efficiency of this method depends on several factors: die area, number of thermal vias, thickness of copper,
etc. (see the PowerPADTM Thermally Enhanced Package Technical Brief, literature number
SLMA002
).
Figure 4. Package and PCB Land Configuration for a Multilayer PCB
Figure 5. Multilayer Board (Side View)
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Application Using a Single-Layer PCB
Use as Much Copper Area
as Possible for Heat Spread
Package Thermal Pad
Package Outline
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
APPLICATION INFORMATION (continued)
In a single-layer board application, the thermal pad is attached to a heat spreader (copper areas) by a low
thermal-impedance attachment method (solder paste or thermal conductive epoxy). With either method, it is
advisable to use as many copper traces as possible to dissipate the heat.
CAUTION:
If the attachment method is not implemented correctly, the functionality of the product can not be
assured. Power-dissipation capability is adversely affected if the device is incorrectly mounted on
the circuit board.
Figure 6. Layout Recommendations for a Single-Layer PCB
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Recommended Board Layout
SMOC = Solder Mask Over Copper
SMO = Solder Mask Opening
3,7 SMO
0,65
0,27 ( 20)
1,2(
20)
0,33
( 8)
5,85
6,5 SMOC
6,92
4,52
3,4SMOC
2,4SMO
1
1
TPIC9202
MICROCONTROLLER POWER SUPPLY
AND MULTIPLE LOW-SIDE DRIVER
SLIS116B MAY 2005 REVISED JUNE 2006
APPLICATION INFORMATION (continued)
Figure 7. Recommended Board Layout for PWP
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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TPIC9202PWP
ACTIVE
HTSSOP
PWP
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
TPIC9202PWPG4
ACTIVE
HTSSOP
PWP
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
TPIC9202PWPR
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
TPIC9202PWPRG4
ACTIVE
HTSSOP
PWP
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
12-Sep-2006
Addendum-Page 1
IMPORTANT NOTICE
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Applications
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amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless www.ti.com/lpw
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2006, Texas Instruments Incorporated
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