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Электронный компонент: SA16B3

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SA12B5
SA16B3 / SA16B6
April 1999 - Ed: 1
12-BIT (SA12) OR 16-BIT (SA16) DUAL
SCHOTTKY DIODE ARRAYS
REVERSE VOLTAGE : V
RRM
= 7.5 V
FORWARD VOLTAGE V
F
< 1.3 V
FEATURES
SO-16
Provides impedance matching, and minimizes
distortion.
Lowers EMI / RFI radiation.
Eliminates negative voltage : minimizes risk of
latch-up for sensitive ICs.
Saves valuable space on board.
BENEFITS
SCHOTTKY ARRAYS
Application Specific Discretes
A.S.D.
TM
Any electronic equipment where
suitable bus
termination is required to avoid signal reflections
and distortions :
PCs
Workstations
High frequency processor boards
Dataline interface
MAIN APPLICATIONS
Dedicated to bus termination, the Schottky arrays
SA12B5, SA16B3 and SA16B6 minimise stray
emissions from PCB tracks. They provide suitable
termination by avoiding signal reflexions and
distortions.
DESCRIPTION
SO-20
SSOP20
- MIL STD 883C - Method 3015-6 - class 3
- IEC1000-4-2 level 4
COMPLIES WITH FOLLOWING STANDARD :
1/5
FUNCTIONAL DIAGRAM (SO-20 and SSOP20)
FUNCTIONAL DIAGRAM (SO-16)
V
SS
V
SS
V
CC
V
CC
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
1
20
10
V
SS
V
CC
V
CC
11
V
SS
2
19
3
18
4
17
5
16
6
15
7
14
8
13
9
12
Symbol
Parameter and test conditions
Value
Unit
P
Power dissipation
SO-20
SO-16 and SSOP20
1250
850
mW
V
OP
Maximum operating voltage (V
CC
- V
SS
)
7.5
V
V
PP
Maximum electrostatic discharge
MIL STD 883C - Method 3015-6 / IEC1000-4-2 contact
8
kV
T
op
Operating temperature range (see note 1)
-40 to +85
C
T
stg
Storage temperature range
-55 to +150
C
T
L
Maximum lead temperature for soldering during 10s
260
C
T
j
Maximum junction temperature
150
C
Note1: withinthe Top range, the SAxx keepon operating. The impacts of the ambient temperature are givenby derating curves on thefollowingpage.
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25
C)
Symbol
Parameter and test conditions
Typ.
Max.
Unit
I
R
Leakage current @ V
RRM
= 7.5 V
5
A
V
F
Forward voltage
(see note 2)
IPP = 18 mA
I
PP
= 50 mA
1.05
1.3
V
C
d
Capacitance
V
bias
= 0V, F = 1MHz
16
pF
Note 2: for both pull-up and pull-down schotty diodes.
ELECTRICAL CHARACTERISTICS (T
amb
= 25
C)
Symbol
Parameter
Packages
Value
Unit
R
th(j-a)
Junction to ambient
SO-16 and SSOP20
SO-20
140
100
C/W
THERMAL RESISTANCE
SA12B5 / SA16B3 / SA16B6
2/5
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
1E-4
1E-3
1E-2
1E-1
1E+0
Ipp(A)
Tj=25
C
Tj=85
C
tp=2.5
s
Tj=-40
C
Vcl(V)
Fig1-1: Clamping forward voltage versus peak
pulse current (typical values, low level).
0
25
50
75
100
125
1E-2
1E-1
1E+0
1E+1
1E+2
Tj(
C)
IR(
A)
VR=7.5V
Fig 2: Leakage current versus junction tempera-
ture (typical values).
0
25
50
75
100
125
0.0
0.2
0.4
0.6
0.8
1.0
1.2
IFSM[Tj] / IFSM[Tj=25
C]
Tj(
C)
Fig 4: Non repetitive surge peak forward current
versus initial junction temperature.
0
1
2
3
4
5
6
7
0.1
1.0
5.0
Ipp(A)
Tj=25
C
tp=2.5
s
Vcl(V)
Fig1-2: Clamping forward voltage versus peak
pulse current (typical values, high level).
1
10
100
1000
1
2
5
10
tp(
s)
IFSM(A)
Tj initial =25
C
Fig 3: Non repetitive surge peak forward current
versus pulse duration (rectangular waveform).
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
16
18
20
22
24
26
28
30
Vi/o-gnd(V)
Ci/o(pF)
Vcc=5V
F=1MHz
Vosc=30mV
Fig 5: Capacitance between input or output and
ground versus applied voltage (typical values).
SA12B5 / SA16B3 / SA16B6
3/5
TYPICAL APPLICATION
VCC
P
High speed
memory
Bus
SAxxBx
PACKAGE MECHANICAL DATA
SO-16
9
8
1
16
D (1)
M
F (1)
b
e3
e
A
a2
G
L
C
c1
b1
a1
E
S
(1) Do not include mold
flash or protr usions. Mold
flash or protr usions shall
not exceed 0.15mm
(0.006inches)
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.75
0.069
a1
0.1
0.20 0.004
0.008
a2
1.6
0.063
b
0.35
0.46 0.014
0.018
b1
0.19
0.25 0.007
0.010
C
0.5
0.020
c1
45
(typ.)
D
9.8
10
0.386
0.394
E
5.8
6.2
0.228
0.244
e
1.27
0.050
e3
8.89
0.350
F
3.8
4.0
0.150
0.158
G
4.6
5.3
0.181
0.209
L
0.5
1.27 0.020
0.050
M
0.75
0.030
S
8
(typ.)
Weight : 0.160g
Type
Package
Marking
SA12B5
SO16
SA12B5
SA16B3
SO20
SA16B3
SA16B6
SSOP20
SA16B6
MARKING
SA12B5 / SA16B3 / SA16B6
4/5
PACKAGE MECHANICAL DATA
SO-20
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ. Max. Min.
Typ. Max.
A
2.35
2.65 0.092
0.104
A1
0.10
0.20 0.004
0.008
B
0.33
0.51 0.013
0.020
C
0.23
0.32 0.009
0.013
D
12.6
13.0 0.484
0.512
E
7.40
7.60 0.291
0.299
e
1.27
0.050
H
10.0
10.65 0.394
0.419
h
0.25
0.75 0.010
0.029
L
0.50
1.27 0.020
0.050
K
8
(max)
SSOP20
L
b1
a1
E
S
b
e
A
a2
11
10
1
20
D
F
REF.
DIMENSIONS
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
2.00
0.079
A1
0.25
0.010
A2
1.51
2.00 0.059
0.079
b
0.25
0.30
0.35 0.010 0.012 0.014
c
0.10
0.35 0.004
0.014
D
7.05
8.05 0.278
0.317
E
7.60
8.70 0.299
0.343
E1
5.02
6.10
6.22 0.198 0.240 0.245
e
0.65
0.026
k
0
10
0
10
L
0.25
0.50
0.80 0.010 0.020 0.031
Weight : 0.520g
Weight : 0.180g
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implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
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SA12B5 / SA16B3 / SA16B6
5/5