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Электронный компонент: CXA1977R

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1
CXA1977R
48 pin LQFP (Plastic)
E94326-PS
10-bit 20MSPS A/D Converter
Description
The CXA1977R is a 10-bit 20MSPS 2-step parallel
type A/D converter for video signal processing.
This A/D converter operates on +5V power
supplies. The analog signal can be converted to the
digital signal by using this IC in conjunction with the
Sample-and-hold IC.
Features
Maximum operating speed : 20MSPS (Min.)
Resolution
: 10-bit
Low power dissipation
: 160mW (Typ.)
Wide-band analog input
: 10MHz
Low input capacitance
: 50pF (Typ.)
Built-in digital correction
(Compensation within 16LSB)
TTL input
TTL output
Output code : binary/2'S complement/1'S complement
Block Diagram
Function
10-bit 20MSPS 2-step parallel type A/D converter
Structure
Bipolar silicon monolithic IC
Applications
High resolution video signal processing
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
36
35
34
31
32
33
40
39
38
37
41
42
43
44
45
46
47
48
2
3
4
5
6
7
8
9
10
11
12
1
N.C.
N.C.
VINL
VINH
N.C.
AV
CC
N.C.
AGND
DV
CC
2
UNDER
OVER
DGND1
PS
ENABLE
CLK
MINV
LINV
N.C.
DV
CC
3
DGND2
DGND1
DV
CC
1
DGND1
N.C.
N.
C.
VR
EF
BS
VR
EF
B
VR
EF
3
VR
EF
2
VR
EF
1
VR
EF
T
VR
EF
T
S
N.
C.
N.
C.
DV
CC
3
DV
CC
3
(
L
SB)
D
0
D1
D2
D3
D4
DG
ND1
N.
C.
D5
D6
D7
D8
(
M
SB)
D
9
MATRIX
CORRECTION
H-COMPARATOR
OVER/UNDER
OUTPUT BUFFER
FINE OUTPUT
BUFFER
COARSE OUTPUT
BUFFER
L
-
C
O
M
PAR
AT
O
R
L
-
E
NCO
RDE
R
C
L
K BU
F
F
E
R
H-ENCODER
2
CXA1977R
Absolute Maximum Ratings (Ta = 25C)
Supply voltage
DVcc1
0 to +6
V
DVcc2
0 to +6
V
DVcc3
0 to +6
V
AVcc
0 to +6
V
Analog input voltage
VINH
AGND to AVcc + 0.3
V
VINL
AGND to AVcc + 0.3
V
Reference voltage
VREFT
AGND to AVcc + 0.3
V
VREFB
AGND to AVcc + 0.3
V
Digital input voltage
CLK
DGND1 0.5 to DVcc1
V
MINV
DGND1 0.5 to DVcc1
V
LINV
DGND1 0.5 to DVcc1
V
PS
DGND1 0.5 to DVcc1
V
ENABLE
DGND1 0.5 to DVcc1
V
Digital output voltage
Vo
DGND1 0.5 to +3.6
V
(Vo: The voltage is applied to the output pin for high impedance output.)
Storage temperature
Tstg
65 to 150
C
Allowable power dissipation
P
D
950
mW
(On a fiber-glass epoxy board: 40mm
40mm, t = 0.8mm)
Recommended Operating Conditions
Min.
Typ.
Max.
Unit
Supply voltage
DVcc1
+4.6
+5
+5.25
V
DVcc2
+4.6
+5
+5.25
V
DVcc3
+4.6
+5
+5.25
V
AVcc
+4.6
+5
+5.25
V
AGND
0
V
DGND1
0
V
DGND2
0
V
Analog input voltage
VINH
+2
+4
V
VINL
+2
+4
V
Reference voltage
VREFT
+3.9
+4
+4.1
V
VREFB
+1.9
+2
+2.1
V
Digital input voltage
V
IH
+2
V
V
IL
+0.8
V
Clock width
t
PWH
25
ns
t
PWL
24
ns
Operating temperature
Topr
20
+85
C
3
CXA1977R
Pin Description
This input can invert
output form of D0 to
D8. In open
condition, this pin
turns to high level
input. (For details,
refer to the Output
Formula Chart.)
Digital output
D0 (LSB) to
D9 (MSB)
Underflow output
This input can invert
output form of D9
(MSB). In open
condition, this pin
turns to high level
input. (For details,
refer to the Output
Formula Chart.)
3-state control.
Turns to enable
when low is input.
In open condition,
this pin turns to high
level input.
Pin No.
Symbol
I/O
Pin voltage
Equivalent circuit
Description
5
8
12
46
1
200k
D4
D9
DGND1
DGND2
DV
CC
2
D0 to
D5 to
UNDER
OVER
16
17
45
47
ENABLE
PS
MINV
LINV
400k
20
21
23
24
15
16
17
100k
100k
DGND2
DV
CC
1
DGND1
1 to 5
8 to 12
46
47
15
45
6, 14,
16, 48
18
25
26
17
44
20
21
23
ENABLE
MINV
LINV
AGND
DGND2
D0 to D9
O
TTL
UNDER
OVER
DV
CC
1
DV
CC
2
DGND1
DV
CC
3
O
O
--
+5V
(typ.)
--
GND
--
+5V
(typ.)
GND
--
--
TTL
I
I
I
Overflow output
Digital power supply
Digital ground
Digital power supply
Digital negative
power supply
Analog negative
power supply
4
CXA1977R
Power save input.
Power save
condition is entered
when high level is
input. In open
condition, this pin
turns to high level
input.
24
PS
I
TTL
Clock input
22
CLK
I
TTL
ENABLE
PS
MINV
LINV
400k
20
21
23
24
15
16
17
100k
100k
DGND2
DV
CC
1
DGND1
22
20k
15
16
17
30k
30k
DV
CC
1
DGND1
DGND2
CLK
VREFT
VREF1
VREF2
VREF3
VREFB
VREFTS
AGND
VREFBS
130
130
29
30
35
34
31
32
33
44
Reference voltage
sense (Top)
Reference voltage
force (Top)
Reference voltage
force (Bottom)
Reference voltage
sense (Bottom)
29
VREFTS
--
30
VREFT
I
31
VREF1
--
32
VREF2
--
33
VREF3
--
34
VREFB
I
35
VREFBS
--
+4V
+3.5V
+3.0V
+2.5V
+2V
Pin No.
Symbol
I/O
Pin voltage
Equivalent circuit
Description
5
CXA1977R
Analog input
(Lower comparator
input)
39
VINL
I
+2V to +4V
42
44
39
VINL
AV
CC
VREF
AGND
11.2k
11.2k
Analog input
(Upper comparator
input)
Analog power supply
Open.
Not connected to
internal circuit, but
connection to DGND
(digital ground) is
recommended.
Open.
Not connected to
internal circuit, but
connection to AGND
(analog ground) is
recommended.
40
VINH
I
+2V to +4V
42
AV
CC
--
--
+5V (Typ.)
7, 13,
19, 27
N.C.
--
--
28, 36,
37, 38,
41, 43
N.C.
--
42
44
VINH
AV
CC
VREF
AGND
40
26k
26k
Pin No.
Symbol
I/O
Pin voltage
Equivalent circuit
Description
6
CXA1977R
Item
Symbol
Min.
Typ.
Max.
Unit
Measurement conditions
Resolution
n
V
IN
= +2 to +4V
Electrical Characteristics
(Ta = 25C, DV
CC
1, 2, 3, AV
CC
= +5V, AGND, DGND1, 2 = 0V, V
REFB
= +2V, V
REFT
= +4V)
DC characteristics
Integral linearity error
Differential linearity error
Analog input
Analog input current
Analog input capacitance
Analog input band width
Reference voltage input
Reference current
Reference resistance
Offset voltage
Reference voltage
Digital input
Digital input voltage
Digital input current
Digital input characteristics
Switching characteristics
Maximum operating speed
Clock pulse width
Sampling delay
Output delay time
3-state output disable time
3-state output enable time
V
IN
= +2 to +2.5V
V
IN
= +2.5 to +4V
V
IN
= +4V
V
IN
= +3V + 0.07Vrms
1dB
E
IL
E
DL1
E
DL2
I
IN
C
IN
BW
I
REF
R
REF
E
OT
E
OB
V
REF1
V
REF2
V
REF3
V
IH
V
IL
I
IH1
I
IL1
I
IH2
I
IL2
Fc
t
PWH
t
PWL
t
SH
t
SL
t
DLH
t
DHL
t
PHZ
t
PLZ
t
PZH
t
PZL
2
3
DV
CC
1
= 5.25V
V
IH
= 2.7V
V
IL
= 0.5V
V
IH
= 2.7V
V
IL
= 0.5V
4
4
CL = 20pF
6
5
7
10
10
10
bit
2.0
+2.0
LSB
0.8
+0.8
LSB
1
+2
1
LSB
0
60
A
50
pF
10
MHz
16
10
7
mA
120
200
280
1
10
25
mV
1
10
25
mV
3.5
V
3.0
V
2.5
V
2
V
0.8
V
10
+10
A
200
0
A
10
+10
A
20
0
A
2
pF
20
MSPS
25
ns
24
ns
2
1
5
ns
15
1
2
ns
10
30
ns
10
30
ns
250
ns
400
ns
500
ns
500
ns
7
CXA1977R
1
+1 < E
DL
2
+2 (LSB) is two and under.
2
CLK input
3
MINV, LINV, ENABLE, and PS inputs
4
Refer to Timing Diagram (1)
5
Refer to Timing Diagram (2)
6
The load is a bi-state totem-pole output delay time test load circuit.
7
The load is a 3-state output test load circuit.
8
When PS and ENABLE inputs are in high level.
Digital output
Digital output voltage
V
OH
V
OL
Leak current during output off
Dynamic characteristics
Differential gain error
Differential phase error
SNR
Power supply
DV
CC
1 current
DV
CC
2 current
DV
CC
3 current
AV
CC
current
Power dissipation Pd = A + B
A = (I
DVCC
1 + I
DVCC
2 + I
DVCC
3
+ I
AVCC
)
5V
B = | I
REF
|
2V
I
OZ
I
OH
= 300A
I
OL
= +500A
DV
CC
1, 2 = 5.25V, V
O
= 3.6V
DV
CC
1, 2 = 4.6V
2.7
3.4
0.5
20
75
0.5
0.3
V
V
A
55
53
52
49
%
deg
dB
dB
dB
dB
NTSC 40IRE mod. ramp,
Fc = 14.3MSPS
Fc = 20MSPS
FIN = 1kHz
Fc = 20MSPS
FIN = 1MHz
Fc = 20MSPS
FIN = 2MHz
Fc = 20MSPS
FIN = 7.5MHz
8
During power save
AV
CC
= +5V
8
During power save
8
During power save
DV
CC
3 = +5V
8
During power save
DV
CC
2 = +5V
8
During power save
DV
CC
1 = +5V
DG
DP
SNR
mA
6.0
4.3
0.05
0
8.1
0.34
0.5
0
87
37
9.9
7.3
0.16
0
14.7
0.55
3.2
20
160
59
14.0
12.0
0.30
27
21.1
1.13
6.0
50
239
98
mA
mA
mA
mA
mA
mA
A
mW
mW
I
DVCC
1
I
DVCC
2
I
DVCC
3
I
AVCC
Pd
Item
Symbol
Min.
Typ.
Max.
Unit
Measurement conditions
8
CXA1977R
Bi-state Totem-pole Output Delay Time Test Load Circuit
3-state Output Test Load Circuit
Note 1) C
L
includes probe capacitance and parasitic capacitance in Test Board.
Note 2) All diodes are IS2076.
Error Rate Test Circuit
Test point
Output from the IC under test
C
L
= 20pF
Note 1)
C
L
Test point
Output from the IC under test
C
L
= 20pF
Note 1)
C
L
1k
V
CC
3.9k
S1
S2
Note 2)
SG1
CXA1977R
SG2
DIVIDER
LATCH
ADDER
A + B
= C
LATCH
A > C
COMPA-
RATOR
COUNTER
A
C
C
(F
C
/2) 1kHz
F
C
CLK
F
C
/2
A
B
(Threshold level)
DIP SW
V
IN
Test condition
t
PZL
t
PZH
t
PLZ
t
PHZ
S1
Close
Open
Close
S2
Open
Close
Close
9
CXA1977R
Notes on Operation
1. Analog ground (AGND)
Keep analog ground surface on PCB as wide as possible with impedance and resistance as low as
possible.
2. Digital ground (DGND1, DGND2)
Upon mounting to PCB keep ground surface as wide as possible with impedance and resistance as low as
possible.
Moreover, a common analog and digital ground immediately near ADC will help obtain characteristics
smoothly.
3. Digital positive power supply (DVcc1, DVcc2, DVcc3)
Connect to the digital ground with a ceramic capacitor over 0.1F and as close to the pins as possible.
Insert a ceramic capacitor between DVcc2 and DGND1 of TTL output power supply as shortly as possible
because noise tends to occur.
4. Analog positive power supply (AVcc)
Connect to the analog ground on PCB with a ceramic capacitor over 0.1F as close to the pin as possible.
5. Reference voltage (VREFTS, VREFT, VREF1, VREF2, VREF3, VREFB, VREFBS)
These pins provide reference voltage to upper and lower comparators. Voltage between VREFT and
VREFB corresponds to input dynamic range.
There is a 200
resistance between VREFT and VREFB. By applying 2V to both pins a current of about
10mA flows. When the reference voltage is made unstable by the clock, ADC characteristics are adversely
affected. Connect VREFT and VREFB to the analog ground on PCB by means of a tantalum capacitor
over 10F and a ceramic capacitor over 0.1F respectively. Also, connect each of VREF1, VREF2 and
VREF3 to the analog ground on PCB using a ceramic capacitor over 0.1F. This will provide stability to the
characteristics of high frequency. Strictly speaking on reference voltage VREFT side and VREFB side
there is a respective about 10mV offset.
When there is no problem with the usage of those offset voltages, voltage is applied directly to VREFT,
VREFB. In case the reference voltage is to be strictly applied, adjust to obtain an offset voltage of 0V,
keeping VREFTS and VREFBS as sense pins and VREFT and VREFB as force pins to form a feedback
loop circuit.
For details, see the Standard Circuit.
6. Analog input (VINH, VINL)
VINH is the input pin for the upper comparator while VINL is the input pin for the lower comparator.
Keep the input signal level within the level between VREFT and VREFB.
As this IC's analog input capacitance stands at about 50pF, it is necessary to drive with an buffer amplifier
having sufficient driving capability. Also, when driving is done with the buffer amplifier of a low output
impedance, as A/D converter input capacitance is large, ringing is generated and settling time grows
longer. Here a small resistance of about 5 to 30
is connected in series between the buffer amplifier and
each of A/D converter's VINH and VINL, as a dumping resistance. This eliminates ringing and shortens
settling time. Also keep wiring between buffer amplifier and A/D converter as short as possible.
10
CXA1977R
7. Clock input (CLK)
TTL input. Clock line wiring should be the shortest possible while distanced from other signal lines to avoid
affecting them.
This IC is 2-step parallel type A/D converter. Accordingly an external sample-and-hold circuit (SH) is
necessary. However the timing between this SH circuit output waveform (A/D converter analog input
waveform) and the A/D converter clock timing requires attention. In the relation between A/D converter
clock and the A/D converter analog input signal, with the timing T
H
of the rising edge of A/D converter
clock, the upper comparator compares the input signal and the reference voltage to latch the results. After
that, with the timing T
L
of the falling edge of A/D converter clock, the lower comparator compares the input
signal and reference signal to latch the results. (Strictly speaking, the sampling delay
t
SH
is in T
H
and the
sampling delay
t
SL
is in T
L
.)
In this A/D converter, the lower comparator features a length of 32mV (16LSB) redundance in relation to
the upper comparator. At the timing when the lower comparator compares input signal and reference
signal to latch at the timing T
L
, it is necessary to have the SH output settling performed. But at the timing
when the upper comparator compares input signal and reference voltage to latch at the timing T
H
, as long
as the SH output is within the 32mV range to the final settling value, digital correction applies, A/D
conversion precisely occurs. As seen from the above, A/D converter clock rise and fall timing versus SH
output waveform should be duly considered. For the clock high level time
t
PWH
and low level time
t
PWL
, set
to a value in excess of the time indicated for the respective operating conditions.
Output data is synchronously with the clock rising edge.
For details on timing, refer to the Timing Chart.
8. MINV input (MINV)
Digital output polarity inversion control pin of D9 (MSB).
TTL input. At open, turns to high level input.
For correspondence with analog input voltage and output data code, refer to the Output Formula Chart.
9. LINV input (LINV)
Digital output polarity inversion control pin of D8 to D0 (LSB).
TTL input. At open, turns to high level input.
For correspondence with analog input voltage and output data code, refer to the Output Formula Chart.
10. Output enable (ENABLE)
3-state control pin of digital output (D0 to D9, UNDER, OVER)
TTL input. At open, turns to high level input. At that time digital output turns all to high impedance.
11. Power save input (PS)
Power save control pin of internal circuit.
TTL input. At open, turns to high level input.
To set to power save mode, turn both PS and ENABLE to high level input.
11
CXA1977R
12. Digital output (D0 to D9)
Output pin of D9 (MSB) to D0 (LSB).
TTL output.
Output data polarity inversion is executed by means of MINV and LINV signals, and they can output in
binary, 1'S complement and 2'S complement.
Also, by turning ENABLE signal to high level, the output can be turned into high impedance output.
However, when the output level is for high impedance output or is in power save mode, the voltage of 3.6V
or more must not be applied to prevent the distruction of IC.
For correspondence with analog input voltage and output data code, refer to the Output Formula Chart. For
the timing, refer to the Timing Chart.
13. Overflow output (OVER)
When the input signal exceeds VREFT, overflow signal is output.
MINV and LINV have no effect on this pin.
Also by turning ENABLE signal to high level, the output can be turned into high impedance output.
However, when the output level is for high impedance output or is in power save mode, the voltage of 3.6V
or more must not be applied to prevent the distruction of IC.
For correspondence with analog input voltage and output data code, refer to the Output Formula Chart.
For the timing, refer to the Timing Chart.
14. Underflow output (UNDER)
When the input signal turns below VREFB, underflow signal is output.
MINV and LINV have no effect on this pin.
Also by turning ENABLE signal to high level, the output can be turned into high impedance output.
However, when the output level is for high impedance output or is in power save mode, the voltage of 3.6V
or more must not be applied to prevent the distruction of IC.
For correspondence with analog input voltage and output data code, refer to the Output Formula Chart.
For the timing, refer to the Timing Chart.
12
CXA1977R
15. TTL to CMOS interface
In general, V
OH
of TTL is approximately 3.7V without load, and it is guaranteed to be 2.7V (Min.). However,
it is not enough for V
OH
of TTL to drive V
IH
of CMOS,because V
IH
of CMOS is 3.5V (Min.)
TTL
CMOS
V
OH
(Min.) = 2.7V
V
IH
(Min.) = 3.5V (= 0.7V
DD
)
V
OL
(Max.) = 0.5V
V
IL
(Max.) = 1.5V (= 0.3V
DD
)
When TTL output of ADC is made a connection with CMOS logic circuit, pull-up resistance (Rp) is used.
(See chart below). The value of Rp is usually from a few thousand ohm to scores of thousand ohm. The Rp
(min.) is decided by Supply voltage of CMOS (V
DD
) and I
OL
of ADC (= +500A), while the Rp (max.) is
decided by required propagation delay (positive edge) and load capacitance. When Vcc is larger than V
DD
,
it is necessary to pay attention to input equivalent circuit of CMOS, because it may happen that V
IH
goes
over the absolute maximum ratings of CMOS and it brings about LATCH-UP to CMOS circuit.
CMOS
V
CC
Rp
V
DD
ADC
13
CXA1977R
Output Formula Chart
ENABLE
MINV
LINV
OUTPUT
1 (OPEN)
1 (OPEN)
OF 9 8 7 6 5 4 3 2 1 0 UF
(MSB) (LSB)
1 0 0 0 0 0 0 0 0 0 0 0
0 0 0 0 0 0 0 0 0 0 1 0
0 0 0 0 0 0 0 0 0 1 0 0
0 0 0 0 0 0 0 0 0 1 1 0
:
0 1 0 0 0 0 0 0 0 0 0 0
:
0 1 1 1 1 1 1 1 0 1 1 0
0 1 1 1 1 1 1 1 1 0 0 0
0 1 1 1 1 1 1 1 1 0 1 0
0 1 1 1 1 1 1 1 1 1 0 0
0 1 1 1 1 1 1 1 1 1 1 1
000
0
1
(OPEN)
0
1
2
3
:
512
:
1019
1020
1021
1022
1023
4V
:
:
:
:
:
:
:
:
:
:
2V
1 (OPEN)
0
OF 9 8 7 6 5 4 3 2 1 0 UF
(MSB) (LSB)
1 0 1 1 1 1 1 1 1 1 1 0
0 0 1 1 1 1 1 1 1 1 0 0
0 0 1 1 1 1 1 1 1 0 1 0
0 0 1 1 1 1 1 1 1 0 0 0
:
0 1 1 1 1 1 1 1 1 1 1 0
:
0 1 0 0 0 0 0 0 1 0 0 0
0 1 0 0 0 0 0 0 0 1 1 0
0 1 0 0 0 0 0 0 0 1 0 0
0 1 0 0 0 0 0 0 0 0 1 0
0 1 0 0 0 0 0 0 0 0 0 1
0
1 (OPEN)
OF 9 8 7 6 5 4 3 2 1 0 UF
(MSB) (LSB)
1 1 0 0 0 0 0 0 0 0 0 0
0 1 0 0 0 0 0 0 0 0 1 0
0 1 0 0 0 0 0 0 0 1 0 0
0 1 0 0 0 0 0 0 0 1 1 0
:
0 0 0 0 0 0 0 0 0 0 0 0
:
0 0 1 1 1 1 1 1 0 1 1 0
0 0 1 1 1 1 1 1 1 0 0 0
0 0 1 1 1 1 1 1 1 0 1 0
0 0 1 1 1 1 1 1 1 1 0 0
0 0 1 1 1 1 1 1 1 1 1 1
0
--
0
OF 9 8 7 6 5 4 3 2 1 0 UF
(MSB) (LSB)
1 1 1 1 1 1 1 1 1 1 1 0
0 1 1 1 1 1 1 1 1 1 0 0
0 1 1 1 1 1 1 1 1 0 1 0
0 1 1 1 1 1 1 1 1 0 0 0
:
0 0 1 1 1 1 1 1 1 1 1 0
:
0 0 0 0 0 0 0 0 1 0 0 0
0 0 0 0 0 0 0 0 0 1 1 0
0 0 0 0 0 0 0 0 0 1 0 0
0 0 0 0 0 0 0 0 0 0 1 0
0 0 0 0 0 0 0 0 0 0 0 1
--
Z
Z
Z
Z
:
Z
:
Z
Z
Z
Z
Z
0: VOLTAGE LEVEL-LOW
OF: OVER FLOW
1: VOLTAGE LEVEL-HIGH
UF: UNDER FLOW
Z: HIGH
IMPEDANCE
14
CXA1977R
Timing Chart (1)
T
H
is the timing of latching result for the comparator of V
IN
and V
REF
in the upper comparators.
T
L
is the timing of latching result for the comparator of V
IN
and V
REF
in the lower comparators.
Timing Chart (2)
Notes) Waveform 1 indicates the output waveform when internal conditions are set to obtain a low level
output, with the exception of when output is disabled by means of the ENABLE signal.
Waveform 2 indicates the output waveform when internal conditions are set to obtain a high level
output, with the exception of when output is disabled by means of the ENABLE signal.
t
DHL
t
DLH
1/F
C
t
PWL
t
PWH
t
SL
t
SH
T
H
T
L
N
N + 1
N + 2
1.5V
1.5V
DATA
N 1
DATA N
DATA N + 1
Sample-and-hold output
A/D clock
A/D digital output
1.5V
V
OL
3V
V
OH
0V
0.3V
0.3V
1.5V
t
PLZ
4.5V
t
PHZ
0V
1.5V
1.5V
t
PZL
t
PZH
1.5V
ENABLE signal
(Low-level enabling)
Waveform 1
Note)
Waveform 2
Note)
Output waveform of 3-state
enable and disable time
.
(
Enable time = t
PZL
/t
PZH
,
disable time = t
PLZ
/t
PHZ
)
1.5V
15
CXA1977R
Standard Circuit
PS
ENABLE
CLK
MINV
LINV
N.C.
DV
CC
3
DGND2
DGND1
DV
CC
1
DGND1
N.C.
27
28
36
31
32
33
38
37
41
42
43
44
45
46
47
D0 (LSB)
D1
D2
D3
D4
DGND1
N.C.
D5
D6
D7
D8
D9 (MSB)
7
12
13
19
2
3
4
5
6
1
41
43
26
29
25
35 34
48
44
45
40
39
42
UNDER
OVER
R2 50
VIN
C3
0.1
C1
0.1
VREFB
VREFB
VREFT
C5
0.1
C7
0.1
C8
0.1
C6
0.1
C4
10
C13
0.1
C14
0.1
C10
10
C12
0.1
VREFT
PS
ENABLE
CLK
MINV
LINV
C11
0.1
C9
0.1
5V
18
20
21
22
23
24
14
15
16
17
N.C.
N.C.
VINL
VINH
N.C.
AV
CC
N.C.
AGND
DV
CC
2
UNDER
OVER
DGND1
N.C.
VREFBS
VREFB
VREF3
VREF2
VREF1
VREFT
VREFTS
N.C.
N.C.
DV
CC
3
DV
CC
3
8
9
10 11
R1 50
30
D0
D1
D2
D4
D3
D5
D6
D7
D8
D9
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
16
CXA1977R
Package Outline
Unit: mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
48PIN LQFP (PLASTIC)
9.0 0.2
7.0 0.1
1
12
13
24
25
36
37
48
(0.22)
0.18 0.03
+ 0.08
0.5 0.08
(8.0)
0.5
0.2
0.127 0.02
+ 0.05
0.1 0.1
0.5
0.2
A
1.5 0.1
+ 0.2
0 to 10
DETAIL A
0.2g
LQFP-48P-L01
LQFP048-P-0707
0.1
SOLDER/PALLADIUM
NOTE: Dimension "
" does not include mold protrusion.