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Электронный компонент: CXA1600

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--1--
E92311B8X
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Absolute Maximum Ratings (Ta=25 C)
Supply voltage
V
CC
7
V
Operating temperature
Topr
20 to +75
C
Storage temperature
Tstg
65 to +150
C
Operating Conditions
Supply voltage
V
CC
1.8 to 4.5
V
Description
The CXA1600M/P is an 8-pin single-chip bipolar IC
for AM radios. This IC includes all functions from
the front-end to the power amplifier.
The CXA1600M/P doesn't require any external
filter, making external ceramic filter attachment
unnecessary.
Features
EIAJ output=100 mW (typ.)
(V
CC
=3 V, R
L
=8
)
Built-in electrical volume control.
No ceramic filter required.
Few peripheral components.
Applications
AM radio
Structure
Bipolar silicon monolithic IC
8-pin Single-chip AM Radio with Built-in Power Amplifier
CXA1600M
CXA1600P
8 pin SOP (Plastic)
8 pin DIP (Plastic)
Block Diagram
RF AMP
OVERLOAD AGC
AGC
VOL
AF POWER AMP
IF DET
IF AMP
OSC
MIXER
BPF
RF IN
OL AGC
LO OSC
V
CC
AGC
VOL
GND
SP OUT
1
2
3
4
5
6
7
8
CXA1600M/P
For the availability of this product, please contact the sales office.
--2--
CXA1600M/P
Pin Description
V
CC
=3 V
No.
Symbol
Voltage
Equivalent Circuit
Description
(typ.)
1
2
3
4
5
6
AGC
VOL
GND
SP OUT
V
CC
LO OSC
0.61 V
0.1 V
0 V
1.28 V
3 V
V
CC
AGC
V
CC
GND
1
V
CC
GND
VOL
2
V
CC
GND
SP OUT
4
V
CC
GND
LO OSC
6
Connect with a capacitor.
Connect to the midpoint of the
volume control.
Ground
Audio output.
Connect with a capacitor.
Power supply
Oscillation output.
Connect with an oscillation coil.
--3--
CXA1600M/P
No.
Symbol
Voltage
Equivalent Circuit
Description
(typ.)
7
8
OL AGC
RF IN
0.62 V
3 V
V
CC
GND
OL AGC
7
V
CC
GND
RF IN
8
Connect with a capacitor.
RF input.
Connect with the antenna circuit.
Electrical Characteristics
V
CC
=3 V, Ta=25 C
1
2
3
4
5
Item
Non-signal
circuit current
EIAJ output
(with 8
load)
Volume attenuation
Overall noise level
Selectivity
Test conditions
No signal
f=1 MHz, f
MOD
=1 kHz, 30 %
Vin=90 dBV
f=1 MHz, f
MOD
=1 kHz, 30 %
Vin=90 dBV, Volume=minimum
Short circuit at RF IN with a 1F
capacitor. Measure the level at SP OUT.
Volume=maximum
f=1.010 MHz, f
MOD
=1 kHz, 30 %
Vin=35 dBV.
Min.
Typ.
Max.
Unit
4.8
6
10
mA
80
100
mW
70
65
dBm
25
15
dBm
14
19
dB
--4--
CXA1600M/P
Noise
THD
AM I/O Characteristics
T
H
D

-

D
i
s
t
o
r
t
i
o
n

f
a
c
t
o
r

[
%
]
O
u
t
p
u
t

l
e
v
e
l

[
d
B
]
Bar antenna input level [dB
V/m]
20
30
40
50
60
70
80
90
100
110
120
0
10
20
30
40
50
60
8
7
6
5
4
3
2
1
0
O
u
t
p
u
t

l
e
v
e
l

[
d
B
]
0
10
20
30
40
50
60
Selectivity Characteristics
110 100 90
80
70
60
50
40
30
20
10
0
10
20
30
Input frequency (f
IN
-f
O
) [kHz]
0dB=10dBV
S+N
V
CC
=3V
f=1MHz
f
MOD
=1kHz
MOD
=30%
--5--
CXA1600M/P
Notes on Applications
Application 1
The CXA1600M/P operates on the new system using very low intermediate frequency (approx. 55 kHz).
(Actual IF frequency is determined by internal B.P.F.fo.)
f
IF
=
1
f
OSC
f
IN
55 kHz
2
Please take care of choice of the coil and variable capacitor as follows. (See next page.)
f
IN
Bar ANT
D1, D2: 1S1555
OSC COIL
V
OSC
=400mVp-p
D1
D2
C
2
4
.
7
1
3
0
H
C3
1500p
1
6
0
p
1
6
0
p
C
7
2
2
0
3
V
GND
GND
RF IN
OL AGC
LO OSC
V
CC
RF AMP
OSC
OVERLOAD AGC
BPF
IF AMP
IF DET
AF POWER AMP
VOL
VOL
AGC
AGC
GND
GND
GND
SP OUT
C
1
2
2
1
0
0
k
R
1
2
.
2
C
4
0
.
1
C
5
C6
220
8
SP
VARIABLE CAPACITOR:
HQ-025A of Toko Co., Ltd.
or equivalent
f
IF
MIXER
1
2
3
4
5
6
7
8
f
OSC
--6--
CXA1600M/P
Coil data
APPlication 1
AM OSC
Wire diameter 0.08 mm 2UEW
AM Bar Antenna
f (kHz)
796
L (H)
1 to 3
130
Q
O
1 to 3
70
1 to 4
32.5
4 to 3
97.5
f (kHz)
796
L (H)
560
3 to 2
140
2 to 1
420
S
1
2
3
4
5
6
S
1
2
3
Number of widings (H)
APPlication 2
AM OSC
Wire diameter 0.08 mm 2UEW
AM Bar Antenna
f (kHz)
796
L (H)
1 to 3
210
Q
O
1 to 3
70
1 to 4
71.3
4 to 3
138.7
f (kHz)
796
L (H)
900
3 to 2
180
2 to 1
720
S
1
2
3
4
5
6
S
1
2
3
Number of widings (H)
--7--
CXA1600M/P
Application Circuit 1
VARIABLE CAPACITOR used (Equivalent capacitor)
Bar ANT
D1, D2: 1S1555
OSC COIL
VARIABLE CAPACITOR:
HQ-025A of Toko Co., Ltd.
or equivalent
D1
D2
C
2
4
.
7
1
3
0
H
C3
1500p
1
6
0
p
1
6
0
p
C
7
2
2
0
3
V
GND
GND
RF IN
OL AGC
LO OSC
V
CC
RF AMP
MIXER
OSC
OVERLOAD AGC
BPF
IF AMP
IF DET
AF POWER AMP
VOL
VOL
AGC
AGC
GND
GND
GND
SP OUT
C
1
2
2
1
0
0
k
R
1
2
.
2
C
4
0
.
1
C
5
C6
220
8
SP
1
2
3
4
5
6
7
8
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
--8--
CXA1600M/P
Application Circuit 2
VARIABLE CAPACITOR used (Non-Equivalent capacitor)
Bar ANT
D1, D2: 1S1555
OSC COIL
VARIABLE CAPACITOR:
C
RF
=160p, C
OSC
=80p
D1
D2
C
2
4
.
7
2
1
0
H
8
0
p
1
6
0
p
C
7
2
2
0
3
V
GND
GND
RF IN
OL AGC
LO OSC
V
CC
RF AMP
MIXER
OSC
OVERLOAD AGC
BPF
IF AMP
IF DET
AF POWER AMP
VOL
VOL
AGC
AGC
GND
GND
GND
SP OUT
C
1
2
2
1
0
0
k
R
1
2
.
2
C
4
0
.
1
C
5
C6
220
8
SP
C3
220p
1
2
3
4
5
6
7
8
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER/PALLADIUM
42/COPPER ALLOY
0.1g
SOP-8P-L03
SOP008-P-0225
8PIN SOP (PLASTIC)
SONY CODE
EIAJ CODE
JEDEC CODE
0 to 10
0.1 0.1
+ 0.15
0
.
5


0
.
2
DETAILA
8
5
1
4
4
.
4


0
.
1
+

0
.
3
1.27
1.25 0.15
+ 0.4
6
.
4


0
.
4
A
5.0 0.1
+ 0.4
0.10
PLATING
M
0.24
b
B
(
0
.
1
5
)
0
.
1
5


0
.
0
5
(0.4)
b = 0.4 0.05
DETAIL B : SOLDER
0
.
1
5


0
.
0
1
b = 0.4 0.03
DETAIL B : PALLADIUM
+

0
.
0
3
+ 0.1
+

0
.
1
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE STRUCTURE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
COPPER ALLOY
8PIN DIP (PLASTIC)
9.4 0.1
+ 0.4
2.54
1
4
5
8
1.2 0.15
0.5 0.1
3
.
0

M
I
N
0
.
5

M
I
N
3
.
7


0
.
1
+

0
.
4
7
.
6
2
6
.
4


0
.
1
+

0
.
3
0
.
2
5


0
.
0
5
+

0
.
1
0 to 15
0.5g
DIP-8P-01
DIP008-P-0300
Package Outline Unit : mm
CXA1600M
CXA1600P
CXA1600M/P
--9--
NOTE : PALLADIUM PLATING
This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame).