Absolute Maximum Ratings
Symbol
Parameter
Value
Units
V
DSS
Drain to Source Voltage
30
V
I
D
Continuous Drain Current(@T
C
= 25
C)
(Note 6)
95
A
Continuous Drain Current(@T
C
= 100
C)
67.3
A
I
DM
Drain Current Pulsed
(Note 1)
380
A
V
GS
Gate to Source Voltage
20
V
E
AS
Single Pulsed Avalanche Energy
(Note 2)
450
mJ
dv/dt
Peak Diode Recovery dv/dt
(Note 3)
7.0
V/ns
P
D
Total Power Dissipation(@T
A
= 25 C) *
3.75
W
Total Power Dissipation(@T
C
= 25 C)
Derating Factor above 25 C
150
W
1.0
W/C
T
STG,
T
J
Operating Junction Temperature & Storage Temperature
- 55 ~ 175
C
T
L
Maximum Lead Temperature for soldering purpose,
1/8 from Case for 5 seconds.
300
C
Thermal Characteristics
Symbol
Parameter
Value
Units
Min.
Typ.
Max.
R
JC
Thermal Resistance, Junction-to-Case
-
-
1.0
C/W
R
JA
Thermal Resistance, Junction-to-Ambient *
-
-
40
C/W
R
JA
Thermal Resistance, Junction-to-Ambient
-
-
62.5
C/W
SFB95N03L
Octorber, 2002. Rev. 0.
1/7
Features
Low R
DS
(on) (0.0085 )@V
GS
=10V
Low Gate Charge (Typical 39nC)
Low Crss (Typical 185pF)
Improved dv/dt Capability
100% Avalanche Tested
Maximum Junction Temperature Range (175C)
General Description
This Power MOSFET is produced using SemiWell's advanced
planar stripe, DMOS technology. This latest technology has been
especially designed to minimize on-state resistance, have a low
gate charge with superior switching performance, and rugged
avalanche characteristics. This Power MOSFET is well suited
for synchronous DC-DC Converters and Power Management in
portable and battery operated products.
Logic N-Channel MOSFET
SemiWell
Semiconductor
Symbol
2. Drain
3. Source
1. Gate
Copyright@SemiWell Semiconductor Co., Ltd., All rights reserved.
* When mounted on the minimum pad size recommended (PCB Mount)
D
2
-PACK (TO-263)
1
2
3
SFB95N03L
Electrical Characteristics
( T
C
= 25 C unless otherwise noted )
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV
DSS
Drain-Source Breakdown Voltage
V
GS
= 0V, I
D
= 250uA
30
-
-
V
BV
DSS
/
T
J
Breakdown Voltage Temperature
coefficient
I
D
= 250uA, referenced to 25 C
-
0.023
-
V/C
I
DSS
Drain-Source Leakage Current
V
DS
= 30V, V
GS
= 0V
-
-
1
uA
V
DS
= 24V, T
C
= 150 C
-
-
10
uA
I
GSS
Gate-Source Leakage, Forward
V
GS
= 20V, V
DS
= 0V
-
-
100
nA
Gate-Source Leakage, Reverse
V
GS
= -20V, V
DS
= 0V
-
-
-100
nA
On Characteristics
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
, I
D
= 250uA
1.0
-
3.0
V
R
DS(ON)
Static Drain-Source On-state Resis-
tance
V
GS
=10 V, I
D
= 47.5A
V
GS
=5 V, I
D
= 47.5A
-
-
0.0065
0.0085
0.0085
0.0115
Dynamic Characteristics
C
iss
Input Capacitance
V
GS
=0 V, V
DS
=25V, f = 1MHz
-
1015
1320
pF
C
oss
Output Capacitance
-
845
1110
C
rss
Reverse Transfer Capacitance
-
185
240
Dynamic Characteristics
t
d(on)
Turn-on Delay Time
V
DD
=15V, I
D
=95A, R
G
=50
see fig. 13.
(Note 4, 5)
-
45
100
ns
t
r
Rise Time
-
165
340
t
d(off)
Turn-off Delay Time
-
70
150
t
f
Fall Time
-
140
290
Q
g
Total Gate Charge
V
DS
=24V, V
GS
=5V, I
D
=95A
see fig. 12.
(Note 4, 5)
-
39
51
nC
Q
gs
Gate-Source Charge
-
13
-
Q
gd
Gate-Drain Charge(Miller Charge)
-
18
-
Source-Drain Diode Ratings and Characteristics
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Unit.
I
S
Continuous Source Current
Integral Reverse p-n Junction
Diode in the MOSFET
-
-
95
A
I
SM
Pulsed source Current
-
-
380
V
SD
Diode Forward Voltage
I
S
=95A, V
GS
=0V
-
-
1.5
V
t
rr
Reverse Recovery Time
I
S
=95A,V
GS
=0V,dI
F
/dt=100A/us
-
55
-
ns
Q
rr
Reverse Recovery Charge
-
65
-
nC
NOTES
1. Repeativity rating : pulse width limited by junction temperature
2. L = 50 uH, I
AS
=95A, V
DD
= 15V, R
G
= 0 , Starting T
J
= 25C
3. ISD 95A, di/dt 300A/us, V
DD
BV
DSS
, Starting T
J
= 25C
4. Pulse Test : Pulse Width 300us, Duty Cycle 2%
5. Essentially independent of operating temperature.
6. Continuous Drain current calculated by maximum junction temperature ; limited by package
2/7
0
5
10
15
20
25
30
35
0
1000
2000
3000
4000
5000
6000
C
rss
C
oss
C
iss
Notes :
1. V
GS
= 0V
2. f=1MHz
C
iss
=C
gs
+C
gd
(C
ds
=shorted)
C
oss
=C
ds
+C
gd
C
rss
=C
gd
Capacit
ance [pF
]
V
DS
, Drain-Source Voltage [V]
0
5
10
15
20
25
30
35
40
45
50
55
60
65
70
0
2
4
6
8
10
12
V
DS
= 15V
V
DS
= 24V
Note : I
D
= 95 A
V
GS
,
G
a
t
e
-Sou
rce
Volt
ag
e [
V
]
Q
g
, Total Gate Charge [nC]
0
2
4
6
8
10
12
10
-1
10
0
10
1
10
2
175
o
C
25
o
C
-55
o
C
Notes :
1. V
DS
= 15V
2. 250 s Pulse Test
I
D
,
Dr
a
i
n Cu
r
r
e
n
t
[
A
]
V
GS
, Gate-Source Voltage [V]
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
10
-1
10
0
10
1
10
2
175
Notes :
1. V
GS
= 0V
2. 250 s Pulse Test
25
I
DR
, Rev
e
r
s
e
Dr
ain C
u
r
r
ent
[A]
V
SD
, Source-Drain voltage[V]
0
100
200
300
400
0
5
10
15
20
V
GS
= 10V
V
GS
= 5V
Note : T
J
= 25
R
DS(
O
N)
[m
],
Dr
a
i
n-
Sou
r
ce O
n
-
R
es
ist
a
nc
e
I
D
, Drain Current [A]
10
-1
10
0
10
1
10
1
10
2
V
GS
Top : 10.0 V
8.0 V
6.0 V
5.0 V
4.5 V
4.0 V
3.5 V
Bottom : 3.0 V
Notes :
1. 250 s Pulse Test
2. T
C
= 25
I
D
,
D
r
ai
n Cu
r
r
e
nt
[A
]
V
DS
, Drain-Source Voltage [V]
3/7
Fig 3. On Resistance Variation vs.
Drain Current and Gate Voltage
Fig 4. On State Current vs.
Allowable Case Temperature
Fig 6. Gate Charge Characteristics
SFB95N03L
Fig 1. On-State Characteristics
Fig 2. Transfer Characteristics
Fig 5. Capacitance Characteristics
-100
-50
0
50
100
150
200
0.8
0.9
1.0
1.1
1.2
Notes :
1. V
GS
= 0 V
2. I
D
= 250 A
BV
DS
S
,
(
N
o
r
m
al
ized
)
D
r
ai
n-So
urce Brea
k
d
ow
n
V
o
l
t
a
g
e
T
J
, Junction Temperature [
o
C]
1 0
-5
1 0
-4
1 0
-3
1 0
-2
1 0
-1
1 0
0
1 0
1
1 0
-2
1 0
-1
1 0
0
N o te s :
1 . Z
JC
(t) = 1 .0
/W M a x.
2 . D uty F a c to r, D = t
1
/t
2
3 . T
JM
- T
C
= P
D M
* Z
JC
(t)
sin g le p u lse
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
Z
JC
(
t
),
T
her
m
a
l Re
sp
on
se
t
1
, S q u a re W a ve P u ls e D u ra tio n [s e c ]
25
50
75
100
125
150
175
0
20
40
60
80
100
Limited by Package
I
D
, D
r
a
i
n C
u
r
r
e
nt [
A
]
T
C
, Case Temperature [ ]
10
-1
10
0
10
1
10
0
10
1
10
2
10
3
DC
10 ms
1 ms
100
s
Operation in This Area
is Limited by R
DS(on)
Notes :
1. T
C
= 25
o
C
2. T
J
= 175
o
C
3. Single Pulse
I
D
,
Drain Curr
ent
[
A
]
V
DS
, Drain-Source Voltage [V]
-100
-50
0
50
100
150
200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Notes :
1. V
GS
= 10 V
2. I
D
= 47.5 A
R
DS(
O
N)
,
(
N
or
malized)
Dr
ain
-
S
our
ce
On-
R
esist
a
n
c
e
T
J
, Junction Temperature [
o
C]
Fig 9. Maximum Safe Operating Area
Fig 10. Maximum Drain Current
vs. Case Temperature
Fig 11. Transient Thermal Response Curve
Fig 7. Breakdown Voltage Variation
vs. Junction Temperature
Fig 8. On-Resistance Variation
vs. Junction Temperature
SFB95N03L
4/7
Charge
V
GS
5 V
Q
g
Q
gs
Q
gd
1mA
V
GS
DUT
V
DS
300nF
50K
200nF
12V
Same Type
as DUT
Charge
V
GS
V
Q
g
Q
gs
Q
gd
Charge
V
GS
V
Q
g
Q
gs
Q
gd
1mA
V
GS
DUT
V
DS
300nF
50K
200nF
12V
Same Type
as DUT
Charge
V
GS
5 V
Q
g
Q
gs
Q
gd
Charge
V
GS
5 V
Q
g
Q
gs
Q
gd
1mA
V
GS
DUT
V
DS
300nF
50K
200nF
12V
Same Type
as DUT
Charge
V
GS
V
Q
g
Q
gs
Q
gd
Charge
V
GS
V
Q
g
Q
gs
Q
gd
1mA
V
GS
DUT
V
DS
300nF
50K
200nF
12V
Same Type
as DUT
5/7
Fig 13. Switching Time Test Circuit & Waveforms
Fig 14. Unclamped Inductive Switching Test Circuit & Waveforms
SFB95N03L
Fig. 12. Gate Charge Test Circuit & Waveforms
E
AS
=
L
L
I
AS
2
----
2
1
--------------------
BV
DSS
-- V
DD
BV
DSS
E
AS
=
L
L
I
AS
2
----
2
1
E
AS
=
L
L
I
AS
2
----
2
1
----
2
1
--------------------
BV
DSS
-- V
DD
BV
DSS
V
DD
V
DS
BV
DSS
t
p
V
DD
I
AS
V
DS
(t)
I
D
(t)
Time
BV
DSS
t
p
V
DD
I
AS
V
DS
(t)
I
D
(t)
Time
10V
DUT
R
G
L
L
I
D
I
D
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
DD
( 0.5 rated V
DS
)
5 V
V
DS
R
L
DUT
Pulse
Generator
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
DD
( 0.5 rated V
DS
)
V
V
DS
R
L
DUT
Pulse
Generator
R
G
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
DD
( 0.5 rated V
DS
)
5 V
V
DS
R
L
DUT
Pulse
Generator
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
in
V
DS
10%
90%
t
d(on)
t
r
t
on
t
off
t
d(off)
t
f
V
DD
( 0.5 rated V
DS
)
V
V
DS
R
L
DUT
Pulse
Generator
R
G
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