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Электронный компонент: S3F49FAXZZ

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S3F49FAX
for Compact Flash
SPECIFICATION
Revision 1.0
HELP DESK
Sejin, Ahn (herlock@sec.samsung.com)
Sanghun, Song (hoontour@samsung.com)
SPECIFICATION
S3F49FAX
1
Table of Contents
1.1 Introduction ..............................................................................................................................2
1.2
Features...................................................................................................................................3
1.3
Block Diagram .........................................................................................................................4
2.1
Controller Package Drawing....................................................................................................5
2.2
Controller Pin Assignments and Pin Type...............................................................................6

Table of Figures
1 S3F49FAX
Block Diagram.......................................................................................................4
2 S3F49FAX
Pin
Assignment .....................................................................................................5
3 100-TQFP-1414
Package Dimension......................................................................................26


Table of Tables
1
100-Pin TSOP Pin Assignment ...............................................................................................6
2
I/O Type Description................................................................................................................10
3
Signal Description for PCMCIA/IDE Interface .........................................................................11
4
Signal Description for Flash Memory Interface .......................................................................17
5
Signal Description for Miscellaneous Part...............................................................................20
6 Signal
Description
for Power Signal ........................................................................................21
7 Signal
Description
for USB Device ..........................................................................................21
8
Signal Description for Internal NOR Flash Memory ................................................................21
9 Absolute
Maximum Ratings.....................................................................................................22
10 Recommended
Operating Conditions .....................................................................................22
11 Thermal
Characteristics...........................................................................................................22
12
D.C. Electrical Characteristics (In case of 3.3V Interface I/O) ................................................23
13
D.C. Electrical Characteristics (In case of 5.0V Interface I/O) ................................................24
14
System Clock Timing...............................................................................................................25
15
POR(power on reset) Detection Level.....................................................................................25
SPECIFICATION
S3F49FAX
2
1.1 INTRODUCTION
Samsung's S3F49FAX is NAND flash memory controller which can control flash memories as solid state disk. It
provides PC Card ATA/IDE/USB interface, host and flash transfer rates up to 20.0MB/S. S3F49FAX can control
flash memory maximum 8 pieces. The device is designed using 0.35um CMOS process, assembled as 100-TQFP
package. It supports operation in both 5.0V and 3.3V.
An outstanding feature of the S3F49FAX flash disk controller is its CPU core: the ARM7TDMI 16/32-bit RISC
processor, designed by Advanced RISC Machine (ARM), Ltd. The ARM core is a low-power, general purpose,
microprocessor macro-cell that was developed for use in application-specific and customer-specific integrated
circuit. It is simple, elegant, and fully static design is particularly suitable for cost and power sensitive application.
PC Card-ATA/True IDE/CompactFlash/USB compatible host interface
Automatic sensing of PC Card ATA and IDE
Full Speed USB Function Controller compatible with the USB Specification Version 1.1
Included 256-byte CIS RAM
Five PC Card ATA addressing modes
Host data transfer rate: 20MB/s
Flash data transfer rate: 20MB/s
(It depends on the characteristics of flash memory)
Host Interface: 8/16-bit Access
Flash Interface: 8-bit Access
Support 3 power save mode: SLEEP/ACTIVE mode
(Auto power down function)
Support 128/256/512Mbit, 1Gbit, 2Gbit, 4Gbit NAND flash memory made by Samsung
NAND Flash Density
Min. / Max. Capacity (number of flash)
128M/256M/512M/1G bit (512Byte/page)
16MB / 1 G Byte (Up to 8EA)
1G / 2G / 4G bit (2048Byte/page)
256MB / 4 G Byte (Up to 8EA)
ECC function (Error correction algorithm): 2bit correction
Available 100-pin TQFP
Interface Voltage Range : 3.0 to 5.5V
Interface
Support
Controller Part Number Host
interface
S3F49FAXZZ CompactFlash
S3F49FAXZA USB
1.1
SPECIFICATION
S3F49FAX
3
1.2 FEATURES
Microprocessor Architecture
16/32bit RISC architecture
Efficient and powerful ARM7TDMI CPU core
Cost-effective JTAG based debug solution
Internal Memory
Included 48KB internal NOR FLASH
Included 16KB internal SRAM
DMA Controller
Two-channel,general-purpose
DMA
controller
Data transfer between SRAM and Flash,
SRAM and USB without CPU Intervention
Support for 8/16/32bit data transfers
Increment or decrement of source
or destination address
Programmable Timer
channel 16bit programmable timer
Interrupts
8 interrupt sources
Normal or fast interrupt modes (IRQ, FIQ)
PC-Card/ATA Interface
Include 256Bytes SRAM for CIS
Support memory and I/O addressing mode
Support True IDE mode



USB Device
Full Speed USB Function Controller
compatible with the USB Specification
Version 1.1
DMA Interface for Bulk Transfer
5 Endpoint with FIFO
Integrated USB Transceiver
(ASIC Full speed USB Pad)
ECC Engine
Correct 2-bit Error
64bit Counter
64bit timer by cascading the 32-bit timers.
Interface Voltage Range
3.0 to 5.5 volts
Package Type
100-TQFP
SPECIFICATION
S3F49FAX
4
1.3 BLOCK DIAGRAM
SRAM
(16KB)
DMA0
16bit
TIMER
NAND
FLASH
FLASH
Controller
PLL
POR
ARM7TDMI
NOR FLASH
(48KB)
LocalBUS
ECC
Engine
CF
Host
PCMCIA
IDE
SFR for
ECC/FTL
USB Device
USB
Host
64bit
Counter
DMA1
VCO
Power MAN
Reset CNTL
ARBITER
BUS CNTL
Figure 1. S3F49FAX Block Diagram

SPECIFICATION
S3F49FAX
5
2
PIN INFORMATION
2.1 CONTROLLER PACKAGE DRAWING
S3F49FAX
100TQFP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
M
O
D
E
_SET
XD7
XD14
XD6
XD13
XD5
XD12
XD4
XD11
XD3
GND
TDI
TMS
TCK
GND
VDD2
TDO
XIN
-TRST
XOUT
GPIO[9] / CKOUT
GPIO[8] / RSOUT
HWP
DP
DN
VDD1
VC
ON
TEST0
TEST1
TEST2
PLLC
AP
V
DD3
FCE9 / GPIO[7]
FCE8 / GPIO[6]
FCE7 / GPIO[5]
FCE6 / GPIO[4]
FCE5 / GPIO[3]
V
DDA
FCE4 / GPIO[2]
FCE3 / GPIO[1]
FCE2 / GPIO[0]
FCE1
FCE0
GND
V
DD4
FR
D
Y
1 / SD
ATA
-FRE
FCLE
FALE
XA0
BVD2/XDASP
XD0
BVD1/XSTSCHG
XD1
XD8
XD2
XD9
XWP/XIOIS16
XD10
FD7
FD6
FD5
FD4
VDD6
GND
FD3
GND
FD2
FD1
FD0
VSSA
-FWP
-FWE
VDD5
XD
15
-X
CE
1
-X
CE
2
XA10
-X
O
E
-
X
IORD
XA9
-
X
IOW
R
XA8
-X
WE
XA7
X
RDY
P
V
DD2
P
V
DD1
XA6
-
X
C
SEL/XD
S
XA5
XA4
XR
ESET
XA3
-X
WA
I
T
XA2
-
X
IN
PAC
K
XA1
-X
RE
G
FR
D
Y
0 / SC
LK
Figure 2. S3F49FAX Pin Assignment
SPECIFICATION
S3F49FAX
6
2.2 CONTROLLER PIN ASSIGNMENTS AND PIN TYPE
Table 1. 100-Pin TSOP Pin Assignment
Pin No.
Pin Name
I/O State
I/O Type
Function
1
XD7
I/O
pvbct83
Data bus of PCMCIA
2
XD14
I/O
pvbct83
Data bus of PCMCIA
3
XD6
I/O
pvbct83
Data bus of PCMCIA
4
XD13
I/O
pvbct83
Data bus of PCMCIA
5
XD5
I/O
pvbct83
Data bus of PCMCIA
6
XD12
I/O
pvbct83
Data bus of PCMCIA
7
XD4
I/O
pvbct83
Data bus of PCMCIA
8
XD11
I/O
pvbct83
Data bus of PCMCIA
9
XD3
I/O
pvbct83
Data bus of PCMCIA
10 GND
P
Ground
11
DP
I/O
pbusb1
Positive data for USB
12
DN
I/O
pbusb1
Negative data for USB
13 VDD1
P
Power
14
-TRST
I
pis
Test reset for JTAG
15
TDI
I
pis
Test data input for JTAG
16
TMS
I
pis
Test mode select for JTAG
17
TCK
I
pis
Test clock for JTAG
18 GND
P
Ground
19 VDD2
P
Power
20
TDO
O
pob4
Test data output for JTAG
21 XIN
psoscm26
Crystal
Input
22 XOUT
psoscm26
Crystal
Output
23
HWP
I
pic
Disable write command
24 CKOUT
/
GPIO[9]
I/O
pbct4
Output of Clock signal /
General I/O pin
25 RSOUT
/
GPIO[8]
I/O
pbct4
Output of Rest signal /
General I/O pin


SPECIFICATION
S3F49FAX
7
Table 1. 100-Pin TSOP Pin Assignment (Continued)
Pin No.
Pin Name
I/O State
I/O Type
Function
26
VDDA
P
Analog Power for PLL
27 PLLCAP
apad_80
Capacitor
for
PLL
28
VSSA
P
Analog Ground for PLL
29
MODE_DET
I
pic
Select Interface Mode
30
VCON
I
pica
Reference Voltage for VCO
31
TEST0
I
pic
Select test mode
32
TEST1
I
pic
Select test mode
33
TEST2
I
pifsn
Select test mode
34 VDD3 P
Power
35
FCE9 /
GPIO[7]
I/O
pbct4sm
Enable 9 chip of nand flash /
General I/O PIN
36
FCE8 /
GPIO[6]
I/O
pbct4sm
Enable 8 chip of nand flash /
General I/O PIN
37
FCE7/
GPIO[5]
I/O
pbct4sm
Enable 7 chip of nand flash /
General I/O PIN
38
FCE6/
GPIO[4]
I/O
pbct4sm
Enable 6 chip of nand flash /
General I/O PIN
39
FCE5/
GPIO[3]
I/O
pbct4sm
Enable 5 chip of nand flash /
General I/O PIN
40
FCE4/
GPIO[2]
I/O
pbct4sm
Enable 4 chip of nand flash /
General I/O PIN
41
FCE3/
GPIO[1]
I/O pbct4sm
Enable 3 chip of nand flash /
General I/O PIN
42
FCE2 /
GPIO[0]
I/O pbct4sm
Enable 2 chip of nand flash /
General I/O PIN
43
FCE1
O
pob4sm
Enable 1 chip of nand flash
44
FCE0
O
pob4sm
Enable 0 chip of nand flash
45
FRDY0 /
SCLK
I Picu
Ready/Busy signal of nand flash /
Serial data for internal flash
46
FRDY1 /
SDATA
I/O Pbcut4
Ready/Busy signal of nand flash /
Serial clock for internal flash
47 GND P
Ground
SPECIFICATION
S3F49FAX
8
Table 1. 100-Pin TSOP Pin Assignment (Continued)
Pin No.
Pin Name
I/O State
I/O Type
Function
48 VDD4 P
Power
49
FCLE
O
pob4sm
Command latch enable in nand flash
50
FALE
O
pob4sm
Address latch enable in nand flash
51
-FRE
O
pob8
Read enable in nand flash
52
-FWE
O
pob4
Write enalbe in nand flash
53
-FWP
O
pob4sm
Write protect in nand flash
54 VDD5 P
Power
55
FD0
I/O
pbcdt4
I/O of nand flash memory
56
FD1
I/O
pbcdt4
I/O of nand flash memory
57
FD2
I/O
pbcdt4
I/O of nand flash memory
58
FD3
I/O
pbcdt4
I/O of nand flash memory
59
FD4
I/O
pbcdt4
I/O of nand flash memory
60
FD5
I/O
pbcdt4
I/O of nand flash memory
61
FD6
I/O
pbcdt4
I/O of nand flash memory
62
FD7
I/O
pbcdt4
I/O of nand flash memory
63 GND P
Ground
64 VDD6 P
Power
65
XD10
I/O
pvbct83
Data bus of PCMCIA
66
XWP / IOIS16
O
pvot83
IOIS16 of PCMCIA (XIOSI16)
67
XD9
I/O
pvbct83
Data bus of PCMCIA
68
XD2
I/O
pvbct83
Data bus of PCMCIA
69
XD8
I/O
pvbct83
Data bus of PCMCIA
70
XD1
I/O
pvbct83
Data bus of PCMCIA
71
BVD1 / XSTSCHG
I/O
pvbcut43
STSCHG of PCMCIA (XIOIS16)
72
XD0
I/O
pvbct83
Data bus of PCMCIA
73
BVD2 / XDASP
I/O
pvbcut43
DASP for IDE (XDASP)
74
XA0
I
pvic3
Address bus of PCMCIA
75 GND P
Ground
SPECIFICATION
S3F49FAX
9
Table 1. 100-Pin TSOP Pin Assignment (Continued)
Pin No.
Pin Name
I/O State
I/O Type
Function
76
-XREG
I
pvisu3
REG of PCMCIA
77 PVDD1 P
Power
78
XA1
I
pvic3
Address bus of PCMCIA
79
-XINPACK
O
pvob43
INPACK of PCMCIA
80
XA2
I
pvic3
Address bus of PCMCIA
81
-XWAIT
O
pvob43
Wait signal of PCMCIA
82
XA3
I
pvic3
Address bus of PCMCIA
83
XRESET
I
pvit3
Host reset signal in PCMCIA
84
XA4
I
pvic3
Address bus of PCMCIA
85
XA5
I
pvic3
Address bus of PCMCIA
86 -XCSEL/XDS I
pvitu3 Master/Slave selection signal (XDS)
87
XA6
I
pvic3
Address bus of PCMCIA
88 XRDY O
pvot43
Ready/Busy signal of PCMCIA
89
XA7
I
pvic3
Address bus of PCMCIA
90
-XWE
I
pvisu3
Wrtie enable in PCMCIA
91
XA8
I
pvic3
Address bus of PCMCIA
92
-XIOWR
I
pvisu3
IO write signal in PCMCIA
93
XA9
I
pvic3
Address bus of PCMCIA
94 PVDD2 P
Power
95
-XIORD
I
pvisu3
IO read signal in PCMCIA
96
-XOE
I
pvisu3
Output enable in PCMCIA
97
XA10
I
pvic3
Address bus of PCMCIA
98
-XCE2
I
pvisu3
Card enable 2 in PCMCIA
99
-XCE1
I
pvisu3
Card enable 1 in PCMCIA
100
XD15
I/O
pvbct83
Data bus of PCMCIA

SPECIFICATION
S3F49FAX
10
Table 2. I/O Type Description
I/O Type
Description
pic
3.3V LVCMOS Level Input Buffers
picu
3.3V LVCMOS Level Input Buffer with pull-up register
picd
3.3V LVCMOS Level Input Buffer with pull-down register
pica
VCO output frequency control PAD
pvic3
5V/3.3V LVCMOS Level PCMCIA Input Buffer
pvisu3
5V/3.3V LVCMOS Schmitt Trigger Level PCMCIA Input Buffer with Pull-up Resistor
pvitu3
5V/3.3V TTL Level PCMCIA Input Buffer with Pull-up Resistor
pvit3
5V/3.3V TTL Level PCMCIA Input Buffer
pfisn_80
High voltage Input tolerant pad
pob4
4mA LVCMOS Normal Output Buffers
pob4sm
4mA LVCMOS Normal Output Buffers with Medium Slew-Rate
pob8
8mA LVCMOS Normal Output Buffers
pvot43
5V/3.3V 4mA Tri-State PCMCIA Output Buffer without SRC
pvot83
5V/3.3V 8mA Tri-State PCMCIA Output Buffer without SRC
Apad_80
Analog Output for PLL capacitor
Pbct4
3.3V LVCMOS Level Input Buffer and 4mA Tri-State Output Buffers
pbcut4
3.3V LVCMOS Level Input Buffer with Pull-up Resistor and 4mA LVCMOS
Tri-State Output Buffer
pbcdt4
3.3V LVCMOS Level Input Buffer with Pull-down Resistor and 4mA LVCMOS
Tri-State Output Buffer
pbct4sm
3.3V LVCMOS level input buffer and 4mA tri-state output buffer
with Medium Slew-Rate
pbusb1
3.3V USB differential input receiver, a differential output driver.
pvbct83
5V/3.3V LVCMOS Level PCMCIA Input Buffer and 8mA Tri-State
PCMCIA Output Buffer without SRC
pvbcut43
5V/3.3V LVCMOS Level PCMCIA Input Buffer with Pull-up Resistor and
4mA Tri-State PCMCIA Output Buffer without SRC
psoscm26
Oscillator cell with enable and register
pvob43
5V/3.3V 4mA PCMCIA Output Buffer witout SRC


SPECIFICATION
S3F49FAX
11
2.3 Signal descriptions
Table 3. Signal Description for PCMCIA/IDE Interface
Signal Name
100-Pin Number
I/O
Description
XA0 74
XA1 78
XA2 80
XA3 82
XA4 84
XA5 85
XA6 87
XA7 89
XA8 91
XA9 93
XA10 97
I
ADDRESS BUS[10:0]:
These address lines along with the REG signal
are used to select the following:
The I/O port address registers within the PC
Storage Card, the memory mapped port address
registers within the PC Storage Card, a byte in
the Card's information structure and its
configuration control and status registers.
This signal is the same as the PC Card Memory
Mode signal in PC Card I/O mode.
In True IDE Mode only A[2:0] are used to select
the one of eight registers in the Task File, the
remaining address lines should be grounded by
the host.
XD0 72
XD1 70
XD2 68
XD3 9
XD4 7
XD5 5
XD6 3
XD7 1
XD8 69
XD9 67
XD10 65
XD11 8
XD12 6
XD13 4
XD14 2
XD15 100
I/O
DATA BUS[15:0]:
These lines carry the Data, Commands and
Status information between the host and the
controller. XDB0 is the LSB of the even byte of
the word. XDB8 is the LSB of the odd byte of the
word.
This signal is the same as the PC Card memory
mode signal in PC Card I/O mode.
In True IDE mode, all Task File operations occur
in byte mode on the low order bus XDB0-XDB7
while all data transfers are 16 bit using XDB0-
XDB15
SPECIFICATION
S3F49FAX
12
Table 3. Signal Description for PCMCIA/IDE Interface (Continued)
Signal Name
100-Pin Number
I/O
Description
XREG 76
I
ATTRIBUTE MEMORY AREA SELECTION:
This signal is used during memory cycles to distinguish
between common memory and register (Attribute) memory
accesses. High for Common memory, low for attribute
memory.
The signal must also be active (low) during I/O cycles when
the I/O address is on the Bus.
In True IDE mode, this input signal is not used and should be
connected to VCC by the host.
XCE1

XCE2
99
98
I
CARD ENABLE:
These input signals are used both to select the card and to
indicate to the card whether a byte or a word operation is
being performed.
-CE2 always accesses the odd byte of the word.
-CE1 accesses the even byte or the Odd byte of the
word depending on A0 and -CE2. A multi-plexing
scheme based on A0, -CE1, -CE2 allows 8 bit hosts
to access all data on XDB0-XDB7.
This signal is the same as the PC card memory mode signal
in PC Card I/O mode.In the True IDE mode, CS0 is the chip
select for the task file registers while CS1 is used to select
the alternate status register and the device control register.
XOE 96
I
OUTPUT ENABLE:
This is an output enable strobe generated by the host
interface. It is used to read data from the PC Card in memory
mode and to read the CIS and configuration registers.
In PC Card I/O mode, this signal is used to read the CIS and
configuration registers. To enable True IDE mode this input
should be grounded by the host.
SPECIFICATION
S3F49FAX
13
Table 3. Signal Description for PCMCIA/IDE Interface (Continued)
Signal Name
100-Pin Number
I/O
Description
XWE 90
I
WRITE ENABLE:
This is a signal driven by the host and used for strobing memory
write data to the registers of the PC Card when the card is
configured in the memory interface mode. It is also used for
writing the configuration registers.
In PC Card I/O mode, this signal is used for writing the
configuration registers. In True IDE mode, this input signal is not
used and should be connected to VCC by the host.
XWAIT 81
O
WAIT:
The -WAIT signal is driven low by the PC Card to signal the host
to delay completion of a memory or I/O cycle that is in progress.
IORDY:
In True IDE mode, this output signal may be used as IORDY.
XWP/
XIOIS16
66 O
I/O PORT IS 16 BITS:
Memory mode - The PC Card does not have a write protect
switch. This signal is held low after the completion of the reset
initialization sequence.
I/O operation - When the PC Card is configured for I/O operation
pin 24 is used for the -I/O selected is 16-Bit Port (-IOIS16)
function. A low signal indicates that a 16 bit or odd byte only
operation can be performed at the addressed port.
In True IDE mode, this output signal is asserted low when this
device is expecting a word data transfer cycle.
SPECIFICATION
S3F49FAX
14
Table 3. Signal Description for PCMCIA/IDE Interface (Continued)
Signal Name
100-Pin Number
I/O
Description
XINPACK 79
O
INPUT PORT ACKNOWLEDGE:
This signal is not used in memory mode. The Input
acknowledge signal is asserted by the PC Card when the card
is selected and responding to an I/O read cycle at the address
that is on the address bus.
This signal is used by the host to control the enable of any
input data buffers between the PC Card and the CPU.
In True IDE mode, this output signal is not used and should be
connected at the host.
XRDY 88
O
READY/BUSY:
In memory mode, this signal is set high when the PC Card is
ready to accept a new data transfer operation and held low
when the card is busy. The host memory card socket must
provide a pull-up resistor. At power up and at reset, the RDY/-
BSY signal is held low (busy) until the PC Card has completed
its power up or reset function.
No access of any type should be made to the PC Card during
this time. The RDY/-BSY signal is held high (disabled from
being busy) whenever the following condition is true:
The PC Card has been powered up with +RESET continuously
disconnected or asserted.
I/O operation - After the PC Card has been configured for I/O
operation, this signal is used as Interrupt request. This line is
strobed low to generate a pulse mode interrupt or held low for
a level mode interrupt.
In True IDE mode, this signal is the active high Interrupt
request to the host.
XIORD 95
I
I/O READ:
This signal is not used in memory mode.This is an I/O read
strobe generated by the host. This signal gates I/O data onto
the bus from the PC Card when the card is configured to use
the I/O interface.
In True IDE Mode, this signal has the same function as in PC
Card I/O Mode.
SPECIFICATION
S3F49FAX
15
Table 3. Signal Description for PCMCIA/IDE Interface (Continued)
Signal Name 100-Pin Number
I/O
Description
XIOWR 92
I
I/O WRITE:
This signal is not used in memory mode.The I/O write strobe
pulse is used to clock I/O data on the card data bus into the PC
Card controller registers when the PC Card is configured to use
the I/O interface.
The clocking will occur on the negative to positive edge of the
signal (trailing edge). In True IDE mode, this signal has the same
function as in PC Card I/O Mode
BVD1 /
XSTSCHG
71 I/O
STATUS CHANGED:
This signal is asserted high as the BVD1 signal since a battery is
not used with this product.This signal is asserted low to alert the
host to changes in the RDY/-BSY and write protect states, while
the I/O interface is configured. Its use is controlled by the Card
config and status.
In the True IDE mode, this input / output is the pass diagnostic
signal in the Master/Slave handshake protocol.
XCSEL /
XDS
86 I
CARD SELECT:
In True IDE mode, this signal is used for configure this device as
a master or slave. When it is grounded , the device is configured
as a master.
When this signal is open, the device is configured as a slave.
In I/O and memory mode, this signal is not used.
XRESET
83
I
RESET:
When the pin is high, this signal resets the PC Card. The PC Card
is reset only at Power up if this pin is left high or open from power-
up. The PC Card is also reset when the soft reset bit in the Card
Configuration Option Register is set.
In the True IDE mode, this input pin is the active low hardware
reset from the host.
SPECIFICATION
S3F49FAX
16
Table 3. Signal Description for PCMCIA/IDE Interface (Continued)
Signal Name
100-Pin Number
I/O
Description
BVD2/XDASP 73 I/O
This output line is always driven to a high state in memory
mode since a battery is not required for this product.
This output line is always driven to a high state in I/O mode
since this product does not support the audio function.
In the True IDE mode, this input/output is the disk active/slave
present signal in the Master/Slave handshake protocol.
SPECIFICATION
S3F49FAX
17
Table 4. Signal Description for Flash Memory Interface
Signal Name
100-Pin Number
I/O
Description
FD0 55
FD1 56
FD2 57
FD3 58
I/O
FD4 59
FD5 60
FD6 61
FD7 62
FLASH DATA BUS[15:0]:
These lines are 16-bit data lines to/from the flash memory chip.
FRDY0
FRDY1
45
46
I
I/O
FLASH READY:
The signal is used for indicate to the controller, which flash
memory is ready to accept a command.
FALE
50
O
FLASH ADDRESS LATCH ENABLE:
When this signal is asserted the controller can send an
address to the flash memory by asserting of FWE pin.
FCLE
49
O
FLASH COMMAND LATCH ENABLE:
When this signal is asserted, a command can be to the flash
memory.
FRE
51
O
FLASH READ ENABLE:
This signal is asserted to enable the reading of data from the
flash memory.
FWE
52
O
FLASH WRITE ENABLE:
When this signal is asserted , the controller can write data to
the flash memory.
SPECIFICATION
S3F49FAX
18
Table 4. Signal Description for Flash Memory Interface (Continued)
Signal Name
100-Pin Number
I/O
Description
FCE0 44
FCE1 43
FCE2 42
FCE3 41
FCE4 40
FCE5 39
FCE6 38
FCE7 37
FCE8 36
FCE9 35
O
O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
FLASH CHIP ENABLE:
These lines are flash memory enable signal.
FWP
53
O
PROTECTION OF WRITING FLASH MEMORY:
Write protect of flash chips
SPECIFICATION
S3F49FAX
19
Table 5. Signal Description for Miscellaneous Part
Signal Name
100-Pin Number
I/O
Description
TCK 17 I
TEST CLOCK:
The S3F49FAX contains internally in-circuit emulation block
for debugger mode which use standard JTAG protocol.
When the controller go into debugger mode, this signal is
provided from external debugger tool.
TMS 16 I
TEST MODE SELECT:
In the debugger mode, this signal select test mode. This pin
should be held to "1', when do not use the JTAG block.
TDI 15 I
TEST DATA INPUT:
In the debugger mode, this signal is used for carry data.
from external debugger tool to the controller.
TRST 14 I
TEST RESET:
This signal should be sustained LOW first at the begging of
normal operation.
TDO 20 O
TEST DATA OUTPUT:
In the debugger mode, this signal is used for carry data.
from the controller to external debugger tool.
XI 21
INPUT CLOCK:
This signal is system clock.
XO 22
OUTPUT CLOCK:
This signal is system output clock.
TEST0 31
TEST1 32 I
TEST2 33
SELECT TEST MODE:
Select the test mode of chip
RSOUT
25
I/O
Output Internal Reset Signal
CKOUT
24
I/O
Output the PLL clock signal for checking PLL operation
HWP
23
I
Protect writing/erasing operation
SPECIFICATION
S3F49FAX
20
Table 5. Signal Description for Miscellaneous Part (Continued)
Signal Name
100-Pin Number
I/O
Description
VCON
30
I
Define reference voltage for VCO
MODE_SET
29
I
Select Controller Clock mode,
INPUT (high): VCO mode
INPUT (low): PLL mode
GPIO[0:9]
42
41
40
39
38
37
36
35
25
24
I/O
General Purpose Input/Output Port
If you use GPIO, you should set SFR(PortFun, PortDir,
PortDat)
PLLCAP 27
PLL
Capacitor
SPECIFICATION
S3F49FAX
21
Table 6. Signal Description for Power Signal
Signal Name
100-Pin Number
I/O
Description
VDD 13
19
34
48
54
64
System power supply voltage
PVDD1
PVDD2
77
94
PCMCIA power supply voltage
GND 10
18
47
63
75
Ground
VDDA
26
Analog power supply voltage for PLL
VSSA
28
Analog ground for PLL
Table 7. Signal Description for USB Device
Signal Name
100-Pin Number
I/O
Description
DP 11
I/O
Positive
data
DN 12
I/O
Negative
data
Table 8. Signal Description for Internal NOR Flash Memory
Signal Name
100-Pin Number
I/O
Description
SDATA
46
I/O
Serial data for internal flash
SCLK
45
I
Serial clock for internal flash
SPECIFICATION
S3F49FAX
22
3
ELECTRICAL DATA
3.1 DC CHARACTERISTICS
Table 9. Absolute Maximum Ratings
Symbol
Parameter
Ratings
Unit
V
DD
DC Supply voltage
0.3 to 4.0
V
3.3V I/O
0.3 to 3.6
V
IN
DC Input voltage
5.0V I/O
0.5 to 5.5
V
I
IN
DC input current
10
mA
T
STG
Storage temperature
40 to 125
C
Table 10. Recommended Operating Conditions
Symbol
Parameter
Ratings
Unit
V
DD
DC supply voltage
3.0 to 3.6
V
T
A
Temperature range
25 to 85
C
Table 11. Thermal Characteristics
Symbol
Parameter
Value
Unit
ja
Thermal Impedance of Samsung 100TQFP
Package
37-70
C/W
SPECIFICATION
S3F49FAX
23
Table 12. D.C. Electrical Characteristics (In case of 3.3V Interface I/O)
(V
DD
= 3.3
0.3V, T
A
= -25 to 85
C)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
IH
High level input voltage
LVCMOS
Interface
2.0
V
V
IL
Low level input voltage
LVCMOS
Interface
0.8
V
V
T
Switching threshold
LVCMOS 1.4 V
V
T+
Switching trigger,
positive-going threshold
LVCMOS 2.0
V
V
T-
Switching trigger,
negative-going threshold
LVCMOS 0.8
V
Input buffer
10
10
I
IH
High level input current
Input buffer
with pull-
down
V
IN
= V
DD
10 30 60
A
Input buffer
10
10
I
IL
Low level input current
Input buffer
with pull-up
V
IN
= V
SS
60 30 10
A
Type B4, B8
I
OH
= 1 mA
V
DD
0.05
Type B4
I
OH
= 4 mA
V
OH
High level output voltage
Type B8
I
OH
= 8 mA
2.4
V
Type B4, B8
I
OL
= 1 mA
0.05
Type B4
I
OL
= 4 mA
V
OL
Low level output voltage
Type B8
I
OL
= 8 mA
0.4
V
I
OZ
Tri-state output leakage current
V
OUT
=
V
SS
or V
DD
10 10
A
I
DD
Maximum operating current
45
80
mA
I
DS
Stop current
V
DD
= 3.3 V,
VCON = 2.2 V
100
150
A
SPECIFICATION
S3F49FAX
24
Table 13. D.C. Electrical Characteristics (In Case of 5V Interface I/O)
(V
DD
= 5.0
0.5V, T
A
= -25 to 85
C)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
CMOS
3.5
V
IH
High level input voltage
TTL
2.0
V
CMOS
1.5
V
IL
Low level input voltage
TTL
0.8
V
CMOS
2.45
V
T
Switching threshold
TTL
1.45
V
CMOS
3.0 3.5
V
T+
Switching trigger, positive-
going threshold
TTL
1.8 2.0
V
CMOS
1.5 2.0
V
T-
Switching trigger, negative-
going threshold
TTL
0.8 1.1
V
Input buffer
10
10
I
IH
High level input current
Input buffer
with pull-up
V
IN
= V
DD
10 100
200
A
Input buffer
10
10
I
IL
Low level input current
Input buffer
with pull-up
V
IN
= V
SS
200 100
10
A
Type B4
I
OH
= 4 mA
V
OH
High level output voltage
Type B8
I
OH
= 8 mA
V
DD
0.8 V
Type B4
I
OL
= 4 mA
V
OL
Low level output voltage
Type B8
I
OL
= 8 mA
0.4
V
I
OZ
Tri-state output leakage current
V
OUT
=
V
SS
or V
DD
10
10
A
I
DD
Maximum operating current
55
80
mA
I
DS
Stop current
V
DD
= 5.0 V,
VCON = 2.2 V
200
250
A
SPECIFICATION
S3F49FAX
25
3.2 AC CHARACTERISTICS
Table 14. System Clock Timing
Symbol
Parameter
Min
Typ
Max
Unit
T
C
Clock
cycle
time
40 55 75 ns
T
lpd
Clock low pulse duration
0.4Tc
0.6Tc
ns
T
hpd
Clock high pulse duration
0.4Tc
0.6Tc
ns
T
C
T
lpd
T
hpd

Table 15. POR(Power On Reset) Detection Level
Symbol
Parameter
Min
Typ
Max
Unit
P
D
POR Detection Level
1.3
2.1
2.65
V
SPECIFICATION
S3F49FAX
26
4
MECHANICAL DATA
The S3F49FAX disk controller is available in a 100-pin TQFP package (Samsung part number 100-TQFP-1414).
100-TQFP-1414
#100
14.00 BSC
16.00 BSC
14.00 B
S
C
16.00 B
S
C
0.08 MAX
0.127
+ 0.073
- 0.037
0-7
NOTE: Dimensions are in millimeters.
#1
0.50
(1.00)
0.45-0.75
0.05-0.15
1.00
0.05
1.20 MAX
0.20
+ 0.07
- 0.03
0.08 MAX
Figure 3. 100-TQFP-1414 Package Dimension