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Preliminary
Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
SiGe HBT
Si CMOS
3
VREG
2
RF IN
1
VCC1
6
RF OUT
7
GND
5
VCC2
4
VMO
D
E
RF3120
3V 1800MHZ LINEAR AMPLIFIER MODULE
3V CDMA Korean-PCS Handsets
Spread-Spectrum Systems
The RF3120 is a high-power, high-efficiency linear ampli-
fier IC targeting 3V handheld systems. The device is
manufactured on an advanced Gallium Arsenide Hetero-
junction Bipolar Transistor (HBT) process, and has been
designed for use as the final RF amplifier in dual-mode
3 V CDMA hand-held digital cellular equipment, spread-
spectrum
systems,
and
other
applications
in
the
1750 MHz to 1780MHz band. The RF3120 has a digital
bias control voltage for low current in standby mode. The
device is self-contained with 50
input and output that is
matched to obtain optimum power, efficiency, and linear-
ity
characteristics.
The
module
is
an
ultra-small
6 mmx6mm land grid array with backside ground.
Input/Output Internally Matched @ 50
Single 3V Supply
29dBm Linear Output Power
26dB Linear Gain
32% Linear Efficiency
RF3120
3V 1800MHz Linear Amplifier Module
RF3120 PCBA
Fully Assembled Evaluation Board
2
Rev A0 010906
6.0 sq
0.100
3.000
4.390
0.600
0.800 sq
typ
NOTE: Nominal thickness, 1.55 mm.
1.700
0.100
2.500
Dimensions in mm.
Package Style: LGM (6mmx6mm)
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Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage (RF off)
+8.0
V
DC
Supply Voltage (P
OUT
29dBm)
+4.5
V
DC
Control Voltage (V
REG
)
+4.2
V
DC
Mode Voltage (V
MODE
)
+3.5
V
DC
Input RF Power
+10
dBm
Operating Ambient Temperature
-30 to +85
C
Storage Temperature
-30 to +150
C
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Overall
T = 25C, V
CC
= 3.4V, V
REG
= 2.8V,
V
MODE
= 2.8V, Freq= 1750MHz to 1780MHz
unless otherwise specified
Frequency Range
1750
1780
MHz
Linear Gain
22
26
dB
Second Harmonic
-35
dBc
Third Harmonic
-40
dBc
Maximum Linear Output Power
(CDMA Modulation)
29
dBm
Total Linear Efficiency
30
32
%
Adjacent Channel Power Rejec-
tion
-44
dBc
ACPR @ 1250kHz
Input VSWR
<2:1
Output VSWR
10:1
No damage.
6:1
No oscillations.
Noise Figure
8
dB
Noise Power
-95
dBm/30kHz
At 90MHz offset.
Power Supply
Power Supply Voltage
3.2
3.4
4.5
V
Quiescent Current
100
mA
V
REG
Current
6
mA
Pin 3, V
REG
= 2.8V
Turn On/Off Time
40
s
Total Current (Power down)
10
A
V
REG
=low
V
REG
"Low" Voltage
0
0.2
V
V
REG
"High" Voltage
2.7
2.8
2.9
V
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
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Pin
Function
Description
Interface Schematic
1
VCC1
First stage collector supply. A low frequency decoupling capacitor (e.g.,
4.7
F) is required.
2
RF IN
RF input internally matched to 50
. This input is internally AC-coupled.
3
VREG
Regulated voltage supply for amplifier bias.
4
VMODE
For nominal operation, V
MODE
is set to HIGH. When set LOW: V
MODE
will increase the bias current by approximately 50%; and, large signal
gain is increased by approximately 1.5dB.
5
VCC2
Output stage collector supply. A low frequency decoupling capacitor
(e.g., 4.7
F) is required.
6
RF OUT
RF output internally matched to 50
. This output is internally AC-cou-
pled.
7
GND
Ground connection. Connect to package base ground. For best perfor-
mance, keep traces physically short and connect immediately to
ground plane.
Pkg
Base
GND
Ground connection. The backside of the package should be soldered to
a top side ground pad which is connected to the ground plane with mul-
tiple vias. The pad should have a short thermal path to the ground
plane.
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Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
3
2
1
6
7
5
4
50
strip
J2
RF OUT
50
strip
J1
RF IN
C1
4.7
F
VCC1
VMODE
VCC2
VREG
C19
4.7
F
+
C20
1
F
+
3120400-
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Evaluation Board Layout
Board Size 2.0" x 2.0"
Board Thickness 0.028", Board Material FR-4
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