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Электронный компонент: RF2909

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Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
SiGe HBT
Si CMOS
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RF2
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1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Q SIG
Q REF
GND1
NC
LO IN+
LO IN-
NC
VCC1
GND2
VCC2
INSTGT
APC
I SIG
I REF
NC
GND6
GND5
RF OUT
GND4
GND3
PLLON
TX PD
PC 2
PC1
+45
-45
DC
BIAS
PWR
CTRL
RF2909
3V 915MHZ SPREAD-SPECTRUM
TRANSMITTER IC
Direct Sequence Spread Spectrum
Spread Spectrum Cordless Phones
Portable Battery Powered Equipment
GMSK, QPSK, DQPSK, QAM Modulation
915MHz ISM Applications
The RF2909 is a monolithic integrated transmitter IC
capable of universal direct modulation. The quadrature
modulator allows for a variety of modulation formats and
compound carriers. The transmitter has two power control
modes. Two inputs can be controlled digitally for stepping
output power 1mW, 10 mW, or 70mW output power. Or,
the output level can be adjusted by an analog input from
1 mW to 80 mW. The quadrature mixers have differential
inputs, and are internally biased; a DC blocking capacitor
is required if external DC levels are present. The LO is
split with a passive network tuned for 915MHz.
2.7V to 5V Power Supply
1mW, 10mW, 70mW Digital Output
Power
20dB Analog Power Control Range
Excellent Phase & Amplitude Balance
Compatible with the RF2908
RF2909
3V 915MHz Spread-Spectrum Transmitter IC
RF2909 PCBA
Fully Assembled Evaluation Board
11
Rev B1 010904
.069
.053
.050
.016
8MAX
0MIN
.010
.008
.157
.150
.244
.228
1
.344
.337
.012
.008
.025
.010
.004
.033
Package Style: SSOP-24
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RF2909
Rev B1 010904
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Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage
-0.5 to +5.5
V
DC
Power Down Voltage (V
PD
)
V
DD
+ 0.4
V
DC
Input LO and RF Levels
+6
dBm
Operating Ambient Temperature
-40 to +85
C
Storage Temperature
-40 to +150
C
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Carrier Input (LO IN)
T = 25 C, V
DD
= 3.3V
Frequency Range
100
902-928
1100
MHz
Phase shift optimized for 915MHz
Power Level
-10
dBm
Differential
Input Impedance
50
915MHz
Modulation Input
Frequency Range
DC
10
500
MHz
50
source, I,Q= 500mV
p-p
Reference Voltage (V
REF
)
1.7
V
Modulation for P
OUT
Power (I & Q)
500
mV
p
Differential, 1V
p
single ended
Maximum Modulation (I & Q)
1
V
p
Differential, 1.5Vp single ended
Quadrature Phase Error
3
5
I/Q Amplitude Imbalance
.35
db
Input Impedance
3
k
Differential
RF Output
V
DD
= 3.3V, LO power= -10dBm,
LO frequency=915MHz, SSB, I/Q= 1V
PP
sine wave, 100KHz
Digital Output Power
1, 10, 70
mW
See Table I for control logic
Output Impedance
50
Output VSWR
1.5:1
With external matching (see app. schematic)
Second Harmonic Output
-25
dBc
Other Harmonics Output
-30
dBc
Sideband Suppression
30
dB
P
OUT
=10mW
Carrier Suppression
27
dB
Modulation DC offset can be externally
adjusted for optimum suppression. Carrier
suppression is then typically better than
40dB.
Output Level Control
Analog Power Control Range
20
dB
Analog Power Control Voltage
(APC)
0
3.6
V
Input voltage to pin 12 must be less than
3.6V or V
CC
(whichever is less).
Analog Power Control Input
Current
1
A
Analog Power Output
80
mW
V
APC
= 2.8V, PC1= "0", PC2= "0"
Digital Power Output, High
70
mW
APC= 0V, PC 1= "0", PC 2="1"
Digital Power Output, Med
10
mW
APC= 0V, PC 1= "1", PC 2="0"
Digital Power Output, Low
1
mW
APC= 0V, PC 1= "0", PC 2="0"
PC 1/PC 2 "ON"
1
Threshold Voltage
PC 1/PC 2 "OFF"
2
Threshold Voltage
Standby Mode
Turn On/Off Time
0.15
1
S
Power Down "ON"
2
V
Threshold voltage; Part is turned "ON"
Power Down "OFF"
1
V
Threshold voltage; Part is turned "OFF"
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
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Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Power Supply
Voltage
3.3
V
Specifications
2.7
5.0
V
Operating limits
Current
175
200
mA
Total, Digital High Power, V
APC
, V
PC1
=0V,
V
PC2
= V
CC
45
60
Total, Digital Medium Power, V
APC
,
V
PC2
=0V, V
PC1
=V
CC
30
40
mA
Total, Digital Low Power, V
APC
, V
PC1
,
V
PC2
=0V
130
180
mA
Total, Linear Power, V
APC
= 2.8V, V
PC1
,
V
PC2
=0V
1.5
5
mA
PLL Buffer amp on.
1
A
Standby mode
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Pin
Function
Description
Interface Schematic
1
Q SIG
Baseband input to the Q mixer. A DC bias of approximately 1.7V is
present at this pin.A DC blocking capacitor is needed if the signal has a
different DC level. Maximum output power is obtained when the input
signal has a peak-to-peak amplitude of 1V. The input impedance of this
pin is 3k
. The REF and SIG inputs are interchangeable. If swapping
the I SIG and I REF pins, the Q SIG and Q REF also need to be
swapped to maintain the correct phase. The SIG and REF pins may be
driven deferentially to increase conversion gain.
2
Q REF
Reference voltage for the Q mixer. This voltage should be the same as
the DC voltage supplied to the Q SIG pin. To obtain a carrier suppres-
sion of better than 25dB it may be tuned 0.15V (relative to the Q SIG
DC voltage). Without tuning, the carrier suppression will typically be
better than 25dB. The input impedance of this pin is about 3 k
.
See pin 1.
3
GND 1
Ground connection for the modulator circuits. Keep traces physically
short and connect immediately to ground plane for best performance.
4
NC
5
LO IN+
Balanced LO Input Pin. This pin is internally DC biased and should be
DC blocked if connected to a device with a DC level present. For single-
ended input operation, one pin is used as an input and the other LO
input is AC coupled to ground. The balanced input impedance is 100
.
The single-ended input impedance is 50
.
6
LO IN-
Same as pin 4, except complementary input.
See pin 5.
7
NC
8
VCC1
This pin is used to supply V
cc
to the modulator circuits. A RF bypass
capacitor should be connected directly to this and ground.
9
GND2
Ground connection. This pin is used for RF ground of the power control
circuitry and the PA driver amplifier. Keep traces physically short and
connect immediately to ground plane for best performance.
10
VCC2
This pin is used to supply V
cc
to the power control and pre amp cir-
cuitry. A RF bypass capacitor should be connected directly to this and
ground.
11
INSTGT
Interstage bias point between pre amp and power amp. This pin should
be pulled up to V
cc
with an 8.2nH inductor for 915MHz.
See pin 18.
12
APC
Analog power control input. This pin can be used as a linear power out-
put control with a range of 20 dB. Maximum output power is achieved
when APC is high. APC is"wire-or'd" with the digital controls, therefore
should be low when using the digital control. The DC input voltage to
the pin should always be less than 3.6V.
13
PC 1
This digital power control input sets the medium current and power out-
put, 10mW. It is "wire-or'd" with APC and PC 2 and can be overcome
by either. Therefore, APC and PC 2 must be low to use this setting.
14
PC 2
This digital power control input set the high current and power output,
100mW. It is "wire-or'd" with APC and PC 1 and can override both of
those controls. Therefore, PC 2 must be low to use other settings.
15
TX PD
Enables all of the IC except for the LO buffer when > 2V.
16
PLLON
Enables the LO buffer amp when > 2V.This can be switched on and off
independently of the rest of the IC. This amp draws 1.5mA typi-
cally.This can be used to minimize load pulling of the VCO when the
transmitter is turned on. Buffer amp is off when < 1V.
17
GND3
Ground connection for RF Power Amp. Keep traces physically short
and connect immediately to ground plane for best performance.
18
GND4
Same as pin16.
BIAS
Q REF
Q SIG
BIAS
LO IN-
LO IN+
APC
PC 1
PC 2
TX PD
PLLON
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Pin
Function
Description
Interface Schematic
19
RF OUT
Power Amp output, open collector output.
20
GND5
Same as pin 17.
21
GND6
Same as pin 17.
22
NC
23
I REF
Reference voltage for the I mixer. This voltage should be the same as
the DC voltage supplied to the I SIG pin. To obtain a carrier suppres-
sion of better than 25dB it may be tuned 0.15V (relative to the I SIG
DC voltage). Without tuning, the carrier suppression will typically be
better than 25dB. The input impedance of this pin is 3k
.
24
I SIG
Baseband input to the I mixer. A DC bias of approximately 1.7V is
present at this pin.A DC blocking capacitor is needed if the signal has a
different DC level. Maximum output power is obtained when the input
signal has a peak to peak amplitude of 1V. The input impedance of this
pin is about 3 k
. The REF and SIG inputs are interchangeable. If
swapping the I SIG and I REF pins, the Q SIG and Q REF also need to
be swapped to maintain the correct phase. The SIG and REF pins may
be driven differentially to increase conversion gain.
See pin 23.
Table I
Operation
Mode
TX
PD
PLL
ON
PC 1
PC 2
APC
Function
Sleep Mode
Low
Low
Low
Low
0V
Entire chip is powered down. Total I
cc
< 1
A.
PLL Buffer
Low
High
Low
Low
0V
LO Buffer is on. I
cc
= 1.5mA
Linear Po Mode
High
High
Low
Low
0-V
cc
V
Transmitter in on. Power output is proportional to APC.
Digital Po Mode
High
High
Low
Low
0V
Transmitter is on. Power out is 1mW.
Medium Power
High
High
High
Low
0V
Transmitter is on. Power out is 10mW.
High Power
High
High
Low
High
0V
Transmitter is on. Power out is 70mW.
RF OUT
INSTGT
BIAS
I REF
I SIG