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Product Description
Ordering Information
Typical Applications
Features
Functional Block Diagram
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro, NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Optimum Technology Matching Applied
Si BJT
GaAs MESFET
GaAs HBT
Si Bi-CMOS
SiGe HBT
Si CMOS
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
V
CC
NC
NC
NC
NC
NC
GND
GND
GND
GND
LO IN
RF OUT
V
CC
V
CC
IF IN
TX ENABLE
RF2603
2.8V PCS UPCONVERTER
TDMA/CDMA PCS Systems
Portable Battery-Powered Equipment
The RF2603 is a upconverter/pre-driver designed for
PCS systems. The device features single-ended IF and
LO inputs and single-ended RF output for ease of inter-
face. The RF2603 is manufactured on an advanced Gal-
lium Arsenide Heterojunction Bipolar Transistor (HBT)
process and is packaged in a TSSOP-16 package.
Single Supply 2.8V Operation
+3dBm Typical Output 1dB Compression
Point
Power Down Control
17dB Conversion Gain
RF2603
2.8V PCS Upconverter
RF2603 PCBA
Fully Assembled Evaluation Board
6
Rev A2 010403
5.10
4.90
0.750
0.450
6.50
6.30
4.50
4.30
8 MAX
0 MIN
0.18
Typ.
1.00
Ref.
0.65
0.30
0.19
1.20
MAX
1.20
MAX
0.15
0.05
1.05
0.80
Package Style: TSSOP-16
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Absolute Maximum Ratings
Parameter
Rating
Unit
Supply Voltage
-0.5 to +5.5
V
Enable Voltage
-0.5 to +5.5
V
LO Input Power
+3
dBm
Input IF Power
+3
dBm
Operating Temperature Range
-30 to +85
C
Storage Temperature
-30 to +150
C
Parameter
Specification
Unit
Condition
Min.
Typ.
Max.
Overall
T = 25C, V
CC
= 2.8V, RF
OUT
= 1880MHz,
LO= 2076MHz@-5dBm,
IF = 196MHz@-25dBm
RF Output Frequency Range
1850 to 1910
MHz
Conversion Gain
14
17
dB
Noise Figure
11
dB
Single Sideband
Output P1dB
0
3
dBm
RF Output Third Order Intercept
11
dBm
IF Frequency
70
350
MHz
Recommended Operating Range
LO Input Level
-10
-3
0
dBm
Recommended Operating Range
LO Input VSWR
1.5:1
50
RF Output VSWR
1.5:1
Spurious
LO Feedthrough
-15
-10
dB
P
OUT
=0dBm
Power Supply
Supply Voltage (V
CC
)
2.7
2.8
2.9
V
Power Supply Current
30
40
mA
TX Enable Voltage On
V
CC
V
TX Enable Voltage Off
0
V
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
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Pin
Function
Description
Interface Schematic
1
VCC
Supply Voltage pin. External bypassing is required. The trace length
between the pin and bypass capacitors should be minimized. The
ground side of the bypass capacitor should be connected immediately
to ground plane.
2
NC
Not connected.
3
NC
Not connected.
4
GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
5
LO IN
LO input pin. This pin is internally DC-biased and should be
DC-blocked if connected to a device with a DC level present. The input
impedance is 50
.
6
GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
7
RF OUT
RF output pin. This pin is internally DC-biased and should be
DC-blocked if connected to a device with a DC level present. This pin
must be externally matched for 50
output impedance.
8
VCC
Supply Voltage pin. External bypassing is required. Either a length of
transmission line or external inductor is needed between this pin and
the bypass capacitor for tuning the output to 50
.
9
NC
Not connected.
10
NC
Not connected.
11
GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
12
VCC
Supply Voltage pin. External bypassing is required. Either a length of
transmission line or external inductor is needed between this pin and
the bypass capacitor for tuning the mixer.
13
GND
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
14
IF IN
IF input pin. This pin is internally DC-biased and should be DC-blocked
if connected to a device with a DC level present.
15
NC
Not connected.
16
TX ENABLE
TX enable pin.
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Application Schematic
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
15 pF
15 pF
15 pF
TX ENABLE
7.5 pF
300
100 nH
T2
15 pF
4.7
F
Transmission Lines
T1 and T2 Z
0
= 73
,
= 29 @ 1.9 GHz
V
CC1
LO IN
RF OUT
V
CC2
V
CC3
IF IN
T1
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
C2
15 pF
VCC1
C1
15 pF
J1
LO IN
J2
RF OUT
T1*
C3
15 pF
VCC2
TX ENABLE
C5
7.5 pF
J3
IF IN
R1
300
L1
100 nH
T2*
C4
15 pF
C6
4.7
F
VCC3
C8**
DNI
2603400-
*T1 and T2, 73
, Electrical Length = 29 @ 1.9 GHz
**Denotes components which should not be populated on evaluation board.
GND
GND
GND
P1-2
VCC2
P1-4
TX ENABLE
P1-5
VCC3
P1-3
VCC1
P1
1
2
3
4
5
6
7
CON7
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Evaluation Board Layout
Board Size 2.0" x 2.0"
Board Thickness 0.035", Board Material Rogers 4003
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