EM1402
1
05219.R0 4/05
www.protekdevices.com
3 EMI FILTERS/2 TVS ARRAYS
Only One Name Means ProTek'TionTM
APPLICATIONS
Cellular Phones
Notebooks
Personal Digital Assistant (PDA)
Ground Positioning System (GPS)
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Bidirectional EMI Filtering/TVS Low Pass Filters
Low Insertion Loss: -3db Roll-Off @ 77/85 MHz
Protects Up to Five(5) Data Lines
RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
Flip Chip Package
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C
Flammability rating UL 94V-0
8mm Tape and Reel Per EIA Standard 481
05219
PIN CONFIGURATION
R1
R2
R1
A1
A3
C2
C4
C3
A4
C1
A2
GND
C
C
C
C
C
C
B1 B2
C
C
R
1
= 100 Ohms
R
2
= 47 Ohms
10 BUMP FC
2
www.protekdevices.com
05219.R0 4/05
EM1402
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-40
C to 85
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
DC Power Per Resistor
mW
100
P
Typical Resistance @ 20%
OHMS
100
R
1
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
REVERSE
LEAKAGE
CURRENT
@ 3V
I
D
A
TYPICAL
FORWARD
VOLTAGE
@10mA
V
F
VOLTS
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@2.5V, 1 MHz
C
pF
EM1402
6.0
0.1
0.8
40
CUT-OFF
FREQUENCY
fc
MHz
77/85
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
MINIMUM
ATTENUATION
@
800-3000 MHz
dB
30
Note 1:
20% tolerance.
Typical Resistance @ 20%
OHMS
47
R
2
3
www.protekdevices.com
05219.R0 4/05
EM1402
GRAPHS
FIGURE 1
RESISTANCE VS TEMPERATURE
(Normalized to Resistance at 25C)
Temperature C
0.900
Normalized Resistance
1.100
1.060
1.020
0.940
0.980
-40 -20 0 20 40 60 80 100
FIGURE 2
OVERSHOOT & CLAMPING VOLTAGE FOR EM1402
ESD Test Pulse: +15 kilovolt, 1/30ns (waveform)
5
V
o
lts per Division
-5
5
15
25
35
4
www.protekdevices.com
05219.R0 4/05
EM1402
APPLICATION NOTE
The EM1402 provides a bidirectional filter and protector
for all the signals and the power line on the SIM (sub-
scriber indenty module) card connector. SIM cards are
found in all GSM cellular phones and in some other
handheld devices or card readers. The ESD diodes
protect the controller against possible ESD strikes that
may occur when the connector pins are exposed during
direct contact or during insertion of the SIM card into the
card slot. The EMI filter suppresses all high-frequency
noise, preventing the unwanted EMI signals from both
entering and exiting the main board. The signals that
interface with the SIM card are the Reset, the Clock and
the bidirectional data I/O as shown in Figure 1.
For best filter and ESD performance, both ground bumps
(B1, B2) of the EM1402 should be directly connected to
the ground plane. A small capacitor of about 1F is
required next to the V
CC
pin of the SIM connector in order
to improve stability of the SIM card supply rail.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic
Compatibility (EMC) protection. The following guidelines
are recommended:
The protection device should be placed near the
input terminals or connectors, the device will divert
the transient current immediately before it can be
coupled into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground
loops should be minimized.
The transient current return path to ground should be
kept as short as possible to reduce parasitic
inductance.
Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
Controller
with logic
level translator
100 Ohm
47 Ohm
100 Ohm
RST
CLK
I/O
VCC
1F
GND
GND
5V/3V/1.8V
Data I/O
Clock
Reset
SIM Card Connector
VCC
supply
(5V, 3.3V or 1.8V)
Figure 1. Typical Application for SIM Card Interface
5
www.protekdevices.com
05219.R0 4/05
EM1402
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
6
www.protekdevices.com
05219.R0 4/05
EM1402
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer's and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
EM1402-T73-1.
3. Suffix - LF - Lead-Free, i.e.,
EM1402-LF-T73-1.
4. Suffix - C - Coated, i.e., EM1402-LF-T73C-1.
A
B
C
D
E
F
G
H
I
J
1.940
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
0.0764
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.013
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
2.05
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
0.0807
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
0.018
MIN
MIN
MAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
1
2
3
4
C
B
A
D
C
G
E
F
H
J
I
B
0.30 DIA.
63/37 Sn/Pb
Solder Bumps
BOTTOM VIEW
SIDE VIEW
TAPE & REEL SPECIFICATIONS
Top Cover
Tape
For Tape Feeder Reference
Only Including Draft
Concentric Around B
K
0
P
0
A
0
P
1
Embossment
B
0
Direction of Feed
10 Pitches Cumulative
Tolerance On Tape
0.2mm
W
Outline & Dimensions: Rev 0 - 5/05, 06060
PART NUMBER
TAPE WIDTH
W
REEL
DIAMETER
QTY PER
REEL
P
0
P
1
EM1402
8mm
7"
3,000
4mm
4mm
A
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