Specifications are subject to change without notice.
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
DEA002
24Q
0036
Features
s
Supports 15 KV IEC 61000-4-2 ESD
equipment specification
s
Single device protects as many as 20 lines
on exposed pins, communications ports
s
Incorporates 40 bi-directional PN
junction diodes
s
Small form factor replaces 20 SOT23
packages
Applications
s
Parallel printer ports, communication
ports
s
Hot-swappable designs
s
IC protection
General Information
The Model 2DEA Series is well-suited for
space constrained designs where the
requirements of international ESD standard
specification IEC 61000-4-2 must be met.
These highly integrated PN junction
diode arrays are especially effective for
use in PC notebooks and motherboards,
engineering workstations and portable
battery-powered devices such as PDAs
and cellular phones.
Space savings, as compared to popular
BAV99 SOT23 based implementations, can
yield a 75 % reduction in utilized board
area. In addition, significant assembly cost
reductions and manufacturing integrity
improvements can be realized.
Two package options are available.
Model 2DEA consists of 20 bi-directional
diode pairs in a miniature 24-pin JEDEC
QSOP package. The 2DEB consists of 17
bi-directional diode pairs in a traditional
wide-body SOIC JEDEC package.
Electrical Specifications
Supply Voltage (VDD - VSS)
...........................................-0.3 V to +12 V
Voltage @ Any Channel (Vin)
....................................-0.3 V to (VDD+0.5)
VSS = GND
Channel Clamp Current (lc)
(Continuous) .........................15 mA max.
Forward Voltage (Vf)
@ lf = 1 mA..............0.8 V typ., 0.9 V max.
@ lf =12 mA ..............................1.5 V max.
Leakage Current
@ VSS < Vin < VDD = 12 V ......0.1 A typ.
@ VSS < Vin < VDD = 12 V .....10 A max.
Diode Capacitance ......................5 pF max.
Diode Power Rating ...............20 mW/diode
Power Dissipation @ 25 C.............100 mw
ESD Protection..15 KV per IEC 61000-4-2
human body test method
Environmental Specifications
Operating Temperature.-55 C to +125 C
Storage Temp. Range...-65 C to +150 C
Physical Specifications
Standard Packages and Pin Counts
QSOP.............................................24 Pin
Wide-Body SOIC ...........................20 Pin
Dispensing
QSOP .......................3,500 pcs./13 " reel
56 pcs./tube
Wide-Body SOIC......3,500 pcs./13 " reel
37 pcs./tube
Note: IEC 61000-4-2 ESD test performance is measured at the systems level and system designs, enclosure shielding and other conventional ESD control measures usually influence
the results of these tests. Testing on the component level serves as an indicator that the system passes a specific compliance step, but does not ensure that the system passes at that
level. The Model 2DEA/DEB device, therefore, can support successful implementation of the IEC 61000-4-2 system level ESD standard.
Package Schematic
18
7
17
8
16
9
15
10
14
11
13
12
23
24
2
1
22
3
21
4
20
5
19
6
VSS
VDD
VSS
VDD
Typical Part Marking
Represents total content. Layout may vary.
24Q
DEA002
YYWW
PRODUCT
FUNCTION
PIN COUNT
PACKAGE STYLE
DATE CODE
MANUFACTURER'S
TRADEMARK
PIN 1 INDICATOR
(MOLDED INDENT)
How To Order
2 DEA - 2 - Q 24 R
Product Class
Thin-Film-on-Silicon
Product Function
ESD Protection Diode Array
DEA = 20 Lines
DEB = 17 Lines
Standard
Standard Package Style
Q =
QSOP
W =
Wide-Body SOIC
Pin Count
Q = 24 W = 20
Dispensing
R = Reel T = Tube
Part Number
Part Number
(Tape & Reel)
(Tubes)
2DEA-2-Q24R
2DEA-2-Q24T
2DEB-2-W20R
2DEB-2-W20T
Standard Part Numbers
Specifications are subject to change without notice.
Thin Film on Silicon 2DEA Integrated ESD Protection Diode Array
QSOP
Package Dimensions
Wide-Body SOIC
Package Dimensions
A
.635
(.025)
TYP.
3.81 - 3.99
(.150 - .157)
PIN 1
.21 - .31
(.008 - .012)
1.35 - 1.75
(.053 - .069)
.10 - .25
(.004 - .010)
0-8
.19 - .25
(.007 - .010)
.41 - 1.27
(.016 - .050)
5.80 - 6.20
(.228 - .244)
PIN 1
0.66
(.026)
10.11 - 10.51
(.398 - .414)
12.66 - 12.86
(.496 - .505)
0.38 - 0.48
(.014 - .016)
1.27
(0.50)
TYP.
REF
2.44 - 2.64
(.096 - .104)
7.40 - 7.60
(.291 - .299)
0-8
0.23 - 0.32
(.0091 - .0125)
0.10 - 0.30
(.004 - .012)
Model
A
2QSP24
8.56 - 8.74 (.337 - .344)
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MO-137.
Governing dimensions are in mm. Dimensions in
parentheses are in inches and are approximate.
JEDEC Reference Number MS-013.
QSOP Package Power
Temperature Derating Curve
Wide-Body SOIC Package Power
Temperature Derating Curve
WATTS
AMBIENT TEMPERATURE ( C )
1.0
1.25
.75
.50
.25
2QSP24
0
50
75
100
125
150
25
WATTS
AMBIENT TEMPERATURE ( C )
1.0
1.25
.75
.50
.25
WBSOIC20
0
50
75
100
125
150
25
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COPYRIGHT 2002, BOURNS, INC. LITHO IN U.S.A. REV. 9/02 e/TF0201
09/02
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