2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

FEATURES

One pin digital volume control (for each channel)

Volume setting with up/down pulses

Auto repeat function on volume setting

Headphone sensing

Maximum gain set by selection pin

Low sensitivity for EMC radiation

Internal feedback resistors

Flexibility in use

Few external components

Low saturation voltage of output stage

Standby mode controlled by CMOS compatible levels

Low standby current

No switch-on/switch-off plops

High supply voltage ripple rejection

Protected against electrostatic discharge

Outputs short-circuit safe to ground, V

and across the

load

Thermally protected.

APPLICATIONS

Portable consumer products

Notebook computers

Communication equipment.

GENERAL DESCRIPTION

The TDA8552T is a two channel audio power amplifier that
provides an output power of 2

1.4 W into an 8

load

using a 5 V power supply. The circuit contains two BTL
power amplifiers, two digital volume controls and
standby/mute logic. Volume and balance of the amplifiers
are controlled using two digital input pins which can be
driven by simple push-buttons or by a microcontroller.

Using the selection pin (GAINSEL) the maximum gain can
be set at 20 or 30 dB. The headphone sense input (HPS)
can be used to detect if a headphone is plugged into the
jack connector. If a headphone is plugged into the jack
connector the amplifier switches from the BTL to the SE
mode and the BTL loudspeakers are switched off. This
also results in a reduction of quiescent current
consumption.

The TDA8552T is contained in a 20-pin small outline
package. For the TDA8552TS, which is contained in a
20-pin very small outline package, the maximum output
power is limited by the maximum allowed ambient
temperature. More information can be found in Section
"Thermal design considerations". The SO20 package has
the four corner leads connected to the die pad so that the
thermal behaviour can be improved by the PCB layout.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8552T

SO20

plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

TDA8552TS

SSOP20

plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

2.7

5.5

quiescent supply current

BTL mode; V

= 5 V

BTL mode; V

= 3.3 V

SE mode; V

= 5 V

8.5

SE mode; V

= 3.3 V

stb

standby current

output power

THD = 10%; R

= 8

; V

= 5 V

1.4

voltage gain

low gain; maximum volume

low gain; minimum volume

high gain; maximum volume

high gain; minimum volume

step

number of volume steps

THD

total harmonic distortion

= 0.5 W

0.1

SVRR

supply voltage ripple
rejection

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

PINNING

Note

1. For the SO20 (SOT163-1) package only: the ground

pins 1, 10, 11 and 20 are mechanically connected to
the leadframe and electrically to the substrate of the
die. On the PCB the ground pins can be connected to
a copper area to decrease the thermal resistance.

SYMBOL

PIN

(1)

DESCRIPTION

GND1

ground 1, substrate/leadframe

OUT2+

positive loudspeaker terminal
output channel 2

DD1

supply voltage 1

HPS

digital input for headphone
sensing

MODE

digital trinary input for mode
selection (standby, mute and
operating)

UP/DOWN1

digital trinary input for volume
control channel 1

UP/DOWN2

digital trinary input for volume
control channel 2

DD2

supply voltage 2

OUT2

negative loudspeaker terminal
output channel 2

GND2

ground 2, substrate/leadframe

GND3

ground 3, substrate/leadframe

OUT1+

positive loudspeaker terminal
output channel 1

DD3

supply voltage 3

GAINSEL

digital input for gain selection

IN2

audio input channel 2

SVR

half supply voltage, decoupling
ripple rejection

IN1

audio input channel 1

DD4

supply voltage 4

OUT1

negative loudspeaker terminal
output channel 1

GND4

ground 4, substrate/leadframe

Fig.2 Pin configuration.

handbook, halfpage

GND1

OUT2

VDD1

HPS

MODE

UP/DOWN1

UP/DOWN2

VDD2

OUT2

GND2

GND4

OUT1

VDD4

IN1

IN2

GAINSEL

SVR

VDD3

OUT1

GND3

TDA8552T

MGM610

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

FUNCTIONAL DESCRIPTION

The TDA8552T is a 2

1.4 W BTL audio power amplifier

capable of delivering 2

1.4 W output power into an 8

load at THD = 10% using a 5 V power supply. The gain of
the amplifier can be set by the digital volume control.
The gain in the maximum volume setting is 20 dB (low
gain) or 30 dB (high gain). This maximum gain can be
selected by the gain selection pin. The headphone sense
input (HPS) can be used to detect if a headphone is
plugged into the jack connector. If a headphone is plugged
into the jack connector the amplifier switches from the BTL
to the SE mode and the BTL loudspeakers are switched
off. This also results in a reduction of quiescent current
consumption. Using the MODE pin the device can be
switched to the standby condition, the mute condition or
the normal operating condition. The device is protected by
an internal thermal shutdown protection mechanism.

Power amplifier

The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary CMOS output stage. The total
voltage loss for both output power MOS transistors is
within 1 V and with a 5 V supply and an 8

loudspeaker

an output power of 1.4 W can be delivered. The total gain
of this power amplifier can be set at 20 or 30 dB by the
gain selection pin.

Gain selection

The gain selection can be used for a fixed gain setting,
depending on the application. The gain selection pin must
be hard wired to ground (20 dB) or to V

(30 dB). Gain

selecting during the operation is not advised, switching is
not guaranteed plop free.

Input attenuator

The volume control operates as a digitally controlled input
attenuator between the audio input pin and the power
amplifier. In the maximum volume control setting the
attenuation is 0 dB and in the minimum volume control
setting the typical attenuation is 80 dB. The attenuation
can be set in 64 steps by the UP/DOWN pin. Both
attenuators for channels 1 and 2 are separated from each
other and are controlled by there own UP/DOWN pin.
Balance control can be arranged by applying UP/DOWN
pulses only on pins 6 and 7, see Fig.5.

Volume control

Each attenuator is controlled with its own UP/DOWN pin
(trinary input):

Floating UP/DOWN pin: volume remains unchanged

Negative pulses: decreasing volume

Positive pulses: increasing volume.

Each pulse on the UP/DOWN pin results in a change in

gain of

(typical value).

In the basic application the UP/DOWN pin is switched to
ground or V

by a double push-button. When the supply

voltage is initially connected, after a complete removal of
the supply, the initial state of the volume control is an
attenuation of 40 dB (low volume), so the gain of the total
amplifier is

20 dB in the low gain setting or

10 dB in the

high gain setting. After powering-up, some positive pulses
have to be applied to the UP/DOWN pin for turning up to
listening volume.

Auto repeat

If the UP/DOWN pin is LOW or HIGH for the wait time (t

wait

in seconds) (one of the keys is pressed) then the device
starts making up or down pulses by itself with a frequency

given by

(repeat function).

The wait time and the repeat frequency are set using an
internal RC oscillator with an accuracy of

10%.

Volume settings in standby mode

When the device is switched with the MODE select pin to
the mute or the standby condition, the volume control
attenuation setting keeps its value, under the assumption
that the voltage on the V

pin does not fall below the

minimum supply voltage. After switching the device back
to the operation mode, the previous volume setting is
maintained. In the standby mode the volume setting is
maintained as long as the minimum supply voltage is
available. The current consumption is very low,
approximately 1

A (typ.). In battery fed applications the

volume setting can be maintained during battery exchange
if there is a supply capacitor available.

80
64

------

1.25 dB

rep

--------

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Mode select pin

The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is between
V

and V

0.5 V. At a mode select voltage level of less

than 0.5 V the amplifier is fully operational. In the range
between 1 V and V

1 V the amplifier is in the mute

condition. The mute condition is useful for using it as a `fast
mute', in this mode the output signal is suppressed, while
the volume setting remains at its value. It is advised to
keep the device in the mute condition while the input
capacitor is being charged. This can be achieved by
holding the MODE pin at a level of 0.5V

, or by waiting

approximately 100 ms before giving the first volume-UP
pulses.

Headphone sense pin (HPS)

A headphone can be connected to the amplifier by using a
coupling capacitor for each channel. The common ground
pin of the headphone is connected to the ground of the
amplifier, see Fig.4. By using the HPS pin as illustrated in
Fig.4, the TDA8552T detects if a headphone jack plug is
inserted into the connector.

When no headphone is plugged in, the voltage level at the
HPS pin will remain LOW. A voltage less than V

1 V at

the HPS pin will keep the device in the BTL mode, thus the
loudspeakers can be operational. If the HPS pin is not
connected then the device will remain in the BTL mode.

When a headphone is plugged into the connector, the
voltage at the HPS pin will be set to V

. The device then

switches to the Single-Ended (SE) mode, this means that
the slave power amplifiers at the outputs OUT1

and

OUT2

will be switched to the standby mode. This results

in floating outputs OUT1

and OUT2

, the loudspeaker

signal is thus attenuated by approximately 80 dB and only
the headphone can operate.

One of the benefits of this system is that the loudspeaker
current does not flow through the jack connector switch,
which could give some output power loss. The other
benefit is that the quiescent current is reduced when the
headphone jack is inserted.

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL CHARACTERISTICS
See Section "Thermal design considerations" in Chapter "Test and application information".

Table 1

Power rating; note 1

Note

1. The power rating is based on R

th(j-a)

with recommended copper pattern of at least 4

1 cm

to the corner leads and

copper under the IC package.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

operating

0.3

+5.5

input voltage

0.3

+ 0.3

ORM

repetitive peak output current

stg

storage temperature

+150

amb

operating ambient temperature

+85

AC and DC short-circuit safe voltage

5.5

tot

maximum power dissipation

SO20

2.2

SSOP20

1.1

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

for the TDA8552T (SO20)

in free air

K/W

extra copper

K/W

for the TDA8552TS (SSOP20)

in free air

110

K/W

extra copper

K/W

(V)

(

)

o (w)

THD = 10%

OPERATION

MUSIC POWER

max

(W)

amb(max)

(

SO20

SSOP20

3.3

0.9

BTL

0.55

120

106

3.3

0.6

BTL

0.28

134

127

3.3

0.3

BTL

0.14

142

139

3.3

32SE

0.035

headphone

0.03

150

5.0

2.0

BTL

1.25

5.0

1.4

BTL

0.65

114

5.0

0.8

BTL

0.32

132

124

5.0

32SE

0.09

headphone

0.07

146

144

continuous sine wave

3.3

0.9

BTL

1.1

1.4

BTL

1.25

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

QUALITY SPECIFICATION

Quality specification in accordance with

"SNW-FQ-611 part E", if this type is used as an audio amplifier.

DC CHARACTERISTICS
V

= 5 V; T

amb

= 25

C; R

= 8

; V

MODE

= 0 V; total gain setting at 7 dB; according to Fig.4.; unless otherwise

specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

2.7

5.5

supply current

BTL mode; V

= 5 V;

; note 1

SE mode; V

= 5 V

8.5

BTL mode; V

= 3.3 V;

; note 1

SE mode; V

= 3.3 V

stb

standby current

MODE

= V

DC output voltage

note 2

2.5

OUT+

OUT

differential output offset
voltage

GAINSEL = 0 V

GAINSEL = V

150

Mode select pin

MODE

input voltage

standby

0.5

mute

1.4 V

operating

0.5

MODE

input current

0 < V

MODE

< V

mute

mute attenuation

note 3

tbf

Gain select pin

GAINSEL

input voltage

low gain (20 dB)

0.6

high gain (30 dB)

4.1

GAINSEL

input current

Headphone sense pin

HPS

input voltage

SE mode; headphone
detected

HPS

input current

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

2. The DC output voltage with respect to ground is approximately 0.5V

3. Output voltage in mute position is measured with an input of 1 V (RMS) in a bandwidth of 20 kHz, so including noise,

gain select pin is LOW (0 V).

Volume control

pulse width

rep

pulse repetition time

100

th(up)

UP/DOWN pin UP threshold
level

4.1

float(max)

UP/DOWN pin floating high
level

3.4

float(min)

UP/DOWN pin floating low
level

1.0

th(down)

UP/DOWN pin DOWN
threshold level

0.6

I(up/down)

input current UP/DOWN pin

0 < V

UP/DOWN

< V

200

wait

auto repeat wait time

500

rep

repeat time

key pressed

130

Volume attenuator

v(l)

low gain; maximum volume
(including power amplifier)

low gain; minimum volume
(including power amplifier)

tbf

v(h)

high gain; maximum volume
(including power amplifier)

high gain; minimum volume
(including power amplifier)

tbf

step

number of gain steps

variation of gain per step

1.25

input impedance

i(max)(rms)

maximum input voltage
(RMS value)

1.75

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

DC output offset voltage

----------------------------------------------------------------

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (V

= 3.3 V)

amb

= 25

C; R

= 8

; f = 1 kHz; total gain setting at 7 dB; V

MODE

= 0 V; gain select pin is at 0 V

(maximum gain = 20 dB); according to Fig.4.

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

source

= 0

, gain select pin is LOW (0 V).

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R

source

= 0

at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the
positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R

source

= 0

at the input and a

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 2 V (RMS).

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

output power

THD = 10%; R

= 4

0.9

THD = 10%; R

= 8

0.6

THD = 10%; R

= 16

0.3

THD = 0.5%; R

= 4

0.6

THD = 0.5%; R

= 8

0.4

THD = 0.5%; R

= 16

0.2

THD

total harmonic distortion

= 0.1 W; note 1

0.1

o(n)

noise output voltage

note 2

SVRR

supply voltage ripple
rejection

note 3

tbf

i(max)

maximum input voltage

THD = 1%;
G

50 to 0 dB

1.1

sup

channel suppression

HPS

= V

; note 4

channel separation

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (V

= 5 V)

amb

= 25

C; R

= 8

; f = 1 kHz; total gain setting at 7 dB; V

MODE

= 0 V; Gain select pin is at 0 V

(maximum gain = 20 dB); according to Fig.4; package is SO20.

Notes

1. Volume setting at maximum.

2. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

source

= 0

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R

source

= 0

at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the
positive supply rail, gain select pin is LOW (0 V).

4. Channel suppression is measured at the output with a source impedance of R

source

= 0

at the input and a

frequency of 1 kHz. The output level in the operating single-ended channel (OUT+) is set at 1 V (RMS).

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

output power

THD = 10%; R

= 8

1.0

1.4

THD = 10%; R

= 16

0.8

THD = 0.5%; R

= 8

0.6

1.0

THD = 0.5%; R

= 16

0.6

THD

total harmonic distortion

= 0.1 W; note 1

0.15

0.4

= 0.5 W; note 1

0.1

0.3

o(n)

noise output voltage

GAINSEL. = 0 V; note 2

100

GAINSEL. = V

; note 2

100

SVRR

supply voltage ripple
rejection

note 3

i(max)

a maximum input voltage

THD = 1%;
G

50 to 0 dB

1.75

sup

channel suppression

HPS

= V

; note 4

channel separation

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

AC CHARACTERISTICS (FOR HEADPHONE; R

= 32

; CONNECTED SE)

= 5 V; T

amb

= 25

C; f = 1 kHz; total gain setting at 20 dB; V

MODE

= 0 V; gain select pin is 0 V

(maximum gain = 20 dB); according to Fig.4.

Notes

1. The noise output voltage is measured at the output in a frequency band from 20 Hz to 20 kHz (unweighted),

source

= 0

, gain select pin is LOW (0 V).

2. Supply voltage ripple rejection is measured at the output, with a source impedance of R

source

= 0

at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS) is applied to the
positive supply rail, gain select pin is LOW (0 V).

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

output power

THD = 10%; V

= 3.3 V

THD = 10%; V

= 5.0 V

THD = 0.5%; V

= 3.3 V

THD = 0.5%; V

= 5.0 V

THD

total harmonic distortion

= 60 mW

0.04

o(n)

noise output voltage

note 1

100

SVRR

supply voltage ripple
rejection

note 2

i(max)

maximum input voltage

THD = 1%;
G

50 to 0 dB

1.75

channel separation

Fig.3 Timing UP/DOWN pin.

The rise time (t

) of the pulse may have any value.

handbook, full pagewidth

MGM611

VDD

VUP/DOWN

Vth(UP)

Vth(DOWN)

Vfloat(max)

Vfloat(min)

increasing volume

decreasing volume

floating

trep

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

TEST AND APPLICATION INFORMATION

Fig.4 Test and application diagram.

handbook, full pagewidth

MGM609

15 k

20 k

3.4 k

1.6 k

20 dB

30 dB

15 k

20 k

3.4 k

1.6 k

15 k

20 dB

30 dB

0.5VDD

VDD

0.5VDD

VOLUME
CONTROL

MASTER

SLAVE

MASTER

SLAVE

UP/DOWN

COUNTER

INTERFACE

UP/DOWN

COUNTER

INTERFACE

STANDBY/MUTE

AND OPERATING

GAIN

SELECTION

UP/DOWN1

UP/DOWN2

IN1

IN2

SVR

MODE

HPS

GAINSEL

GND1 to GND4

OUT2

OUT1

1, 10, 11, 20

down

VDD1, 2

VDD3, 4

3, 8

13, 18

100

220

VDD = 5 V

330 nF

VIN1

330 nF

VIN2

volume

control

down

VDD

2.2 k

100

volume

control

down

VDD

2.2 k

C8
100 nF

VDD

mute

standby

operating

220

VDD

R2
820 k

100 k

ground

VDD

R1
1 k

R4
1 k

ring

tip

sleeve

220

headphone jack

TDA8552T

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Test conditions

amb

= 25

C if not specially mentioned; V

= 5 V;

f = 1 kHz, R

= 8

, G

= 20 dB, audio band-pass

22 Hz to 22 kHz. The thermal resistance (in standard print,
without extra copper) = 110 K/W for the SSOP20; the
maximum sine wave power dissipation is:

For T

amb

= 60

C the maximum total power dissipation is:

Thermal design considerations

The `measured' thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. All surface mount packages rely on the
traces of the PCB to conduct heat away from the package.
To improve the heat flow, a significant area on the PCB
must be attached to the (ground) pins. Data may not be
comparable between different semiconductor
manufacturers because the application boards and test
methods are not (yet) standardized. Also, the thermal
performance of packages for a specific application may be
different than presented here, because the configuration of
the application boards (copper area) may be different.
Philips Semiconductors uses FR-4 type application boards
with 1 oz copper traces with solder coating Solder Resist
Mask (SRM).

The SSOP20 package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.18) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to approximately
80 K/W. For T

amb

= 60

C the maximum total power

dissipation for this PCB layout is:

The thermal resistance for the SO20 is approximately
55 K/W if applied to a PCB with wider copper tracks to the
corner pins and just under the body of the IC.
The maximum total power dissipation for this practical
application is:

BTL application

The BTL application diagram is illustrated in Fig.4.

The quiescent current has been measured without any
load impedance. The total harmonic distortion as a
function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.

Headphone application

amb

= 25

C if not specially mentioned, V

= 5 V,

f = 1 kHz, R

= 32

, G

= 14 dB, audio band-pass

22 Hz to 22 kHz.

For headphone application diagram see: Fig.4

If a headphone is plugged into the headphone jack, the
HPS pin will switch-off the outputs of the SLAVE output
stage, this results in a mute attenuation >80 dB for the
loudspeakers. In this condition the quiescent current will
be reduced.

General remarks

Reduction of the value of capacitor C3 results in a
decrease of the SVRR performance at low frequencies.

The capacitor value of C5 and C6 in combination with the
load impedance of the headphone determines the low
frequency behaviour.

To prevent against high output currents during inserting
the headphone into the headphone jack, resistors of 5.1

have to be connected in series with the SE output lines.

The UP/DOWN pin can be driven by a 3-state logic output
stage (microprocessor) without extra external
components. If the UP/DOWN pin is driven by
push-buttons, then it is advised to have an RC-filter
between the buttons and the UP/DOWN pin. Advised
values for the RC-filter are 2.2 k

and 100 nF. Resistor R4

is not necessary for basic operation, but is advised to
keep C6 charged to a voltage of 0.5V

This has the

advantage that the plop noise when inserting the
headphone plug is minimal. If the headphone sense
function (HPS) is not used then the HPS-pin 4 should be
hard-wired to ground. This pin should never be left
unconnected.

Using double push buttons, the volume step for both
channels can be controlled. When for the balance control
only a single contact is used, the balance steps are
1.25 dB. If double contacts are used for the balance
buttons and the dashed connection is made, then the
balance steps are 2.5 dB.

150

110

----------------------

1.14 W

150

110

----------------------

0.82 W

150

----------------------

1.12 W

150

----------------------

1.63 W

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Fig.6 I

as a function of V

handbook, halfpage

MGR005

VDD (V)

IDD

(mA)

Fig.7 Gain as a function of volume steps.

= 5 V; R

= 8

(1) G

= 30 dB (max.).

(2) G

= 20 dB (max.).

handbook, halfpage

MGR006

volume steps

(dB)

(2)

(1)

Fig.8 THD as a function of P

= 5 V; R

= 8

; f = 1 kHz; G

= 20 dB (max.).

(1) G

= 0 dB.

(2) G

= 7 dB.

(3) G

= 20 dB.

handbook, halfpage

MGR007

THD

(%)

Po (W)

(2)

(3)

(1)

Fig.9 THD as a function of P

= 5 V; R

= 8

; f = 1 kHz; G

= 30 dB (max.).

(1) G

= 0 dB.

(2) G

= 7 dB.

(3) G

= 20 dB.

(4) G

= 30 dB.

handbook, halfpage

MGR008

THD

(%)

Po (W)

(2)

(3)

(4)

(1)

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Fig.10 THD as a function of P

= 5 V; R

= 8

; G

= 20 dB (max.).

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 Hz.

handbook, halfpage

MGR009

THD

(%)

Po (W)

(2)

(3)

(1)

Fig.11 THD as a function of P

= 5 V; R

= 8

; G

= 30 dB (max.).

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 Hz.

handbook, halfpage

MGR010

THD

(%)

Po (W)

(2)

(3)

(1)

Fig.12 THD as a function of frequency.

= 5 V; R

= 8

; P

= 0.1 W; G

= 20 dB (max.).

(1) G

= 0 dB.

(2) G

= 7 dB.

(3) G

= 20 dB.

handbook, halfpage

THD

(%)

MGR011

f (Hz)

(2)

(3)

(1)

Fig.13 THD as a function of frequency.

= 5 V; R

= 8

; P

= 0.1 W; G

= 30 dB (max.).

(1) G

= 0 dB.

(2) G

= 7 dB.

(3) G

= 30 dB.

handbook, halfpage

THD

(%)

MGR012

f (Hz)

(2)

(3)

(1)

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Fig.14 SVRR as a function of frequency.

= 5 V; R

= 8

; V

ref

= 100 mV.

(1) C3 = 10

F; G

= 20 dB.

(2) C3 = 10

F; G

= 7 dB.

(3) C3 = 100

F; G

= 20 dB.

(4) C3 = 10

F; G

= 10 dB.

(5) C3 = 100

F; G

= 7 dB.

(6) C3 = 100

F; G

= 10 dB.

handbook, halfpage

MGR013

(2)

(3)

(4)

(5)

(6)

(1)

SVRR

(dB)

f (Hz)

Fig.15 Input voltage as a function of gain.

= 5 V; R

= 8

; f = 1 kHz; THD = 1%.

(1) G

= 20 dB (max.).

(2) G

= 30 dB (max.).

handbook, halfpage

2.4

1.6

MGR014

G (dB)

(V)

1.2

0.8

0.4

(2)

(1)

Fig.16 Channel suppression as a function of

frequency.

= 5 V; V

= 1 V; V

HPS

= V

(1) Channel 1.

(2) Channel 2.

handbook, halfpage

100

MGL436

f (Hz)

sup

(dB)

(1)

(2)

Fig.17 Channel separation as a function of

frequency.

= 5 V; V

= 1 V.

(1) G

= 30 dB.

(2) G

= 20 dB.

handbook, halfpage

100

MGL435

f (Hz)

(dB)

(1)

(2)

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

PACKAGE OUTLINES

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

13.0
12.6

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT163-1

detail X

0.25

075E04

MS-013

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.51
0.49

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

10 mm

scale

(A )

SO20: plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

97-05-22
99-12-27

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

UNIT

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

0.15

1.4
1.2

0.32
0.20

0.20
0.13

6.6
6.4

4.5
4.3

0.65

1.0

0.2

6.6
6.2

0.65
0.45

0.48
0.18

0.13

0.1

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.

0.75
0.45

SOT266-1

MO-152

95-02-22
99-12-27

detail X

(A )

0.25

pin 1 index

2.5

5 mm

scale

SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

max.

1.5

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 220

C for

thick/large packages, and below 235

C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

3. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

BGA, HBGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS

not suitable

(2)

suitable

PLCC

(3)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(3)(4)

suitable

SSOP, TSSOP, VSO

not recommended

(5)

suitable

2002 Jan 04

Philips Semiconductors

Product specification

2 x 1.4 W BTL audio amplifiers with digital
volume control and headphone sensing

TDA8552T; TDA8552TS

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA74

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

753503/03/pp

Date of release:

2002 Jan 04

Document order number:

9397 750 09236

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8553TS

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8553TS