DATA SHEET
Product specification
File under Integrated Circuits, IC02
February 1985
INTEGRATED CIRCUITS
TDA2545A
Quasi-split-sound circuit
February 1985
2
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
GENERAL DESCRIPTION
The TDA2545A is a monolithic integrated circuit for quasi-split-sound processing in television receivers.
Features
3-stage gain controlled i.f. amplifier
A.G.C. circuit
Reference amplifier and limiter amplifier for vision carrier (V.C.) processing
Linear multiplier for quadrature demodulation
QUICK REFERENCE DATA
PACKAGE OUTLINES
16-lead DIL; plastic (SOT38); SOT38-1; 1996 November 19.
Supply voltage (pin 11)
V
P
= V
11-13
typ.
12
V
Supply current (pin 11)
I
P
= I
11
typ.
45
mA
Minimum i.f. vision carrier input voltage (r.m.s. value)
V
VC1-16(rms)
typ.
150
V
Output voltage; 5,5 MHz (r.m.s. value)
V
12-13(rms)
typ.
100
mV
Output voltage; 5,742 MHz (r.m.s. value)
V
12-13(rms)
typ.
45
mV
I.F. control range
G
v
typ.
64
dB
Signal-to-weighted-noise (rel. to 1 kHz; 30 kHz deviation)
at 5,5 MHz
for 2T/20T pulses with white bars
S
+
W/W
typ.
58
dB
at 5,742 MHz
S
+
W/W
typ.
56
dB
February 1985
3
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage (pin 11)
V
P
= V
11-13
max.
13,2
V
Storage temperature range
T
stg
-
25
to
+
150
C
Operating ambient temperature range
T
amb
0
to
+
70
C
(1) I.F. signal: vision carrier (V.C.) and sound carrier (S.C.).
Fig.1 Block diagram.
February 1985
4
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
CHARACTERISTICS
V
P
= V
11-13
= 12 V; T
amb
= 25
C; measured at f
VC
= 38,9 MHz, f
SC1
= 33,4 MHz, f
SC2
= 33,158 MHz:
Vision carrier (V.C.) modulated with different video signals (see below); modulation depth 100% (proportional to 10%
residual carrier).
Vision carrier amplitude (r.m.s. value) is V
VC
= 10 mV.
Vision-to-sound carrier ratios are VC/SC1 = 13 dB and VC/SC2 = 20 dB.
Sound carriers (SC1, SC2) modulated with f = 1 kHz and deviation
f =
30 kHz.
For measuring circuit see Fig.2; unless otherwise specified.
Note
1. Incidental phase on the vision carrier, caused by TV transmitter, has to be less than 0,5 degrees for black to white
transient (equivalent to S
+
W/W = 56 dB for 6 kHz sinewave).
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Supply (pin 11)
Supply voltage
V
P
= V
11-13
10,8
12
13,2
V
Supply current
I
P
=
I
11
33
45
55
mA
I.F. amplifier
Input voltage for start of gain control
(intercarrier signals
-
3 dB)
V
VC1-16(rms)
-
150
200
V
Input voltage for end of gain control
(intercarrier signals
+
1 dB)
V
VC1-16(rms)
100
250
-
mV
I.F. gain control range
G
v
60
64
-
dB
Control voltage range (see Fig.3)
V
3-13
4
-
V
p
V
Input resistance
R
1-16
-
2,5
-
k
Input capacitance
C
1-16
-
1,5
-
pF
Intercarrier generation
Output voltage; 5,5 MHz (r.m.s. value)
V
12-13(rms)
60
100
140
mV
Output voltage; 5,742 MHz (r.m.s. value)
V
12-13(rms)
27
45
63
mV
D.C. output voltage
V
12-13
-
5,9
-
V
Allowable d.c. load resistance at the output
R
12-13
7
-
-
k
Allowable output current
-
I
12
-
-
1
mA
Intercarrier signal-to-noise (see note 1)
(measured behind the FM demodulators)
weighted according to CCIR 468-2, quasi-peak
a. 2T/20T pulses with white bars (see also Fig.4)
at 5,5 MHz
S
+
W/W
53
58
-
dB
at 5,742 MHz
S
+
W/W
51
56
-
dB
b. 6 kHz sinewave
at 5,5 MHz
S
+
W/W
50
53
-
dB
at 5,742 MHz
S
+
W/W
50
53
-
dB
c. black level (sync pulses only)
at 5,5 MHz
S
+
W/W
60
65
-
dB
at 5,742 MHz
S
+
W/W
58
63
-
dB
February 1985
5
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
Fig.2 Measuring circuit for TDA2545A.
Fig.3 Control voltage at pin 3 as a function of the input voltage V
VC1-16(rms).
February 1985
6
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
Fig.4 Signal-to-weighted-noise ratio depending on video modulation.
February 1985
7
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
PACKAGE OUTLINES
UNIT
A
max.
1
2
b
1
c
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1
92-10-02
95-01-19
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.055
0.045
0.53
0.38
0.32
0.23
21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.254
2.54
7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7
0.51
3.7
0.15
0.021
0.015
0.013
0.009
0.01
0.10
0.020
0.19
050G09
MO-001AE
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
16
1
9
8
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)
D
(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
February 1985
8
Philips Semiconductors
Product specification
Quasi-split-sound circuit
TDA2545A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
"IC Package Databook" (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260
C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400
C, contact may be up to 5 seconds.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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