General description

The SA56203 is a one-chip motor driver IC that is capable of driving all motors of CD or
DVD systems e.g. spindle, sled and loading motors and actuators on the optical pick-up
unit. The driver intended for the 3-phase, brushless, Hall-commutated spindle motor uses
PWM switching. Internal regeneration of the back EMF of the spindle motor enables the
driver to operate in current-steering mode without using external power-dissipating sense
resistors. The driver for the 2-phase sled stepper motor operates in current-steering PWM
mode. In addition the IC contains four full-bridge linear channels that can be used to drive
a loading motor and 3D actuators (focus, tracking and tilt).

The SA56203 is available in an exposed die pad HTSSOP56 package.

Features

Low heat generation due to power-efficient direct full-bridge switching of spindle motor
driver

Controlled spindle motor current during acceleration and brake

Reverse torque brake function (full bridge)

Adjustable spindle motor current limiter

Internal regeneration for EMF of spindle motor

Current-steering PWM controlled stepper motor driver for sled

Four class-AB linear channels for loading motor and 3D actuators (focus, tracking and
tilt)

Tracking actuator driver with back EMF amplifier

Loading motor driver with transresistance amplifier for loading current

Low on-resistance D-MOSFET output power stages

Built-in thermal shutdown and thermal warning

Interfaces to 3 V and 5 V logic

Package with low thermal resistance to heatsink (reflowable die pad)

Lead free package.

Applications

DVD+RW, DVD-RW and DVD-RAM

Combi

CD-RW

Other compact disc media.

SA56203

One-chip motor driver

Rev. 01 -- 30 September 2004

Preliminary data sheet

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

3 of 27

Philips Semiconductors

SA56203

One-chip motor driver

Block diagram

Fig 1.

Block diagram.

001aab244

REVERSE

DETECTION

LEVEL

SHIFT

47 k

VINREF

47 k

VINREF

47 k

VINREF

47 k

VINREF

LEVEL

SHIFT

LEVEL

SHIFT

LEVEL

SHIFT

SLED

LOGIC

CURRENT

REFERENCE

OSCILLATOR

THERMAL

SHUTDOWN

HALL BIAS

ADC

CHARGE

PUMP

MUTE/

STANDBY

FUNCTIONS

SPINDLE

LOGIC

HALL

AMP

47 k

VINREF

500 k

VINREF

SA56203

VINLD

COSC

HBIAS

RREF

REMF

RLIM

SS1(SPN)

DD1(SPN)

SS2(SPN)

DD2(SPN)

SSA

VINSPN

VINREF

DDA

CP1

CP2

CP3

CTL1

CTL2

TEMP

VINTRK

VINFCS

VINTLT
V

DD(LD)

DD(TRK)

LDO

SS(ACT)

DD(ACT)

TLTO

FCSO

TRKO

TLTO

RSLD1

RSLD2

SLDO2

SLDO1

SS(SLD)

DD(SLD)

VLDTRK

VINSLD1

VINSLD2

51
50

47 k

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

4 of 27

Philips Semiconductors

SA56203

One-chip motor driver

Pinning information

6.1 Pinning

6.2 Pin description

Fig 2.

Pin configuration.

SA56203

001aab245

VINLD

VINTRK

VINFCS

COSC

HBIAS

RREF

REMF

RLIM

SS1(SPN)

DD1(SPN)

SS2(SPN)

DD2(SPN)

SSA

VINSPN

VINREF

DDA

CP1

CP2

CP3

CTL1

CTL2

TEMP

VINTLT

DD(LD)

DD(TRK)

LDO

TRKO

DD(ACT)

FCSO

DD(SLD)

TLTO

FCSO

SS(ACT)

TRKO

TLTO

RSLD1

RSLD2

SLDO2

SLDO1

SS(SLD)

VLDTRK

VINSLD1

VINSLD2

Table 2:

Pin description

Symbol

Pin

Description

HU+

Hall input U positive

Hall input U negative

HV+

Hall input V positive

Hall input V negative

HW+

Hall input W positive

Hall input W negative

HBIAS

Hall element bias

RREF

external resistor for current reference

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

5 of 27

Philips Semiconductors

SA56203

One-chip motor driver

REMF

external resistor for EMF regeneration

RLIM

external resistor for current limit

SS1(SPN)

spindle driver ground 1

spindle driver output U

DD1(SPN)

spindle driver supply voltage 1

spindle driver output V

SS2(SPN)

spindle driver ground 2

spindle driver output W

DD2(SPN)

spindle driver supply voltage 2

frequency generator output

SSA

analog ground

VINSPN

spindle driver input voltage for spindle motor current

VINREF

reference input voltage for all motor drivers

DDA

analog supply voltage

CP1

charge pump capacitor connection 1

CP2

charge pump capacitor connection 2

CP3

charge pump capacitor connection 3

CTL1

driver logic control input 1

CTL2

driver logic control input 2

TEMP

thermal warning

VINSLD1

sled driver 1 input for sled motor current

VINSLD2

sled driver 2 input for sled motor current

VLDTRK

voltage output loader/track

SS(SLD)

sled driver ground

SLDO2

sled driver output 2 negative

SLDO2+

sled driver output 2 positive

RSLD2

sled driver 2 current sense

SLDO1

sled driver output 1 negative

SLDO1+

sled driver output 1 positive

RSLD1

sled driver 1 current sense

DD(SLD)

sled driver sense supply voltage

TLTO

tilting driver output negative

TLTO+

tilting driver output positive

FCSO

focus driver output negative

FCSO+

focus driver output positive

DD(ACT)

focus/tilt drivers supply voltage

SS(ACT)

actuator drivers ground

TRKO

tracking driver output negative

TRKO+

tracking driver output positive

LDO

loading driver output negative

LDO+

loading driver output positive

Table 2:

Pin description

...continued

Symbol

Pin

Description

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

6 of 27

Philips Semiconductors

SA56203

One-chip motor driver

Functional description

7.1 Spindle motor control

The control input voltage on pin VINSPN is converted into a digital value by the ADC
where the voltage on pin VINREF is the midpoint reference. The transconductance gain
from input voltage V

VINSPN

to output motor current I

MOT

is:

where I

LIM

can be programmed by means of external resistor R

LIM

. The motor current is

described by

Figure 3

For VINSPN voltages larger than V

VINREF

the motor will accelerate with forward torque

control. For VINSPN voltages smaller than V

VINREF

the motor will brake with reverse

torque control.

DD(TRK)

tracking driver supply voltage

DD(LD)

loading driver supply voltage

VINTLT

tilting driver input for tilt actuator driver

VINFCS

focus driver input for focus actuator voltage

VINTRK

tracking driver input for tracking actuator voltage

VINLD

loading driver input for loading motor voltage

COSC

external capacitor for internal oscillator

Table 2:

Pin description

...continued

Symbol

Pin

Description

Fig 3.

Spindle motor current as a function of control input voltage VINSPN.

m SPN

(

)

MOT

VINSPN

VINREF

(

)

------------------------------------------------------

LIM

VINREF

---------------------

001aaa431

LIM

MOT

VINSPN

LIM

reverse

torque

brake

VINREF

forward

torque

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

7 of 27

Philips Semiconductors

SA56203

One-chip motor driver

7.2 Spindle brake

Because the U, V and W half-bridges of the spindle motor driver use a direct PWM
full-bridge switching scheme, the motor current can also be controlled and limited during
brake. It should be noted that because of this active brake mechanism energy of the motor
can be recuperated back to the supply. Especially at large speeds, this can result in
currents delivered back to the supply.

If the supply and / or other circuits than the motor driver do not use this recuperated
current, than the supply voltage can rise to unacceptable values. In this event it is
recommended to lower the spindle current during brake by means of the VINSPN setting.
The SA56203 has a clamp incorporated on the spindle driver supply voltage for protecting
the IC against this overvoltage.

Upon detection of reverse rotation all U, V and W driver outputs are connected to
V

DD(SPN)

. This short brake prevents the motor from spinning backwards.

7.3 Internal regeneration of back EMF spindle motor

The spindle motor driver uses the information from the Hall sensors to internally
regenerate the back EMF of the motor (see

Figure 4

Rotational speed

is derived from the Hall event frequency. Multiplying

with the k-factor

of the motor gives the back EMF voltage V

EMF

. This V

EMF

is added to the current-limited

scaled spindle input voltage V

VINSPN

. This sum V

MOT

steers the PWM outputs U, V and W.

The result is that the input voltage V

VINSPN

represents the current through the motor. This

explains how the SA56203 spindle motor driver exhibits a current control transfer function
without using external sense resistors.

The simplified motor schematic in

Figure 5

shows the series resistance and back EMF

voltage of the motor.

Fig 4.

Regeneration of back EMF voltage spindle motor.

001aaa438

PWM

SPEED

U
V
W

Hall U

spindle
motor

MOT

= V

+ V

EMF

= R

EMF

Hall V
Hall W

DIGITAL DOMAIN

VINSPN

torque

control

signal

LIM

maximum

motor

current

EMF

motor

k-factor

ANALOG DOMAIN

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Figure 6

shows the motor voltages V

and V

during accelerating and braking. The

back EMF voltage is part of these motor voltages.

7.4 Programming R

LIM

If the supply is connected between the terminals of a non-running spindle motor, then
usually a current will flow that is too large. The motor current can be limited to a value I

LIM

can be programmed by means of R

LIM

. In order to calculate the required R

LIM

first a

typical maximum motor current I

MAX

needs to be determined:

LIM

can be chosen to be a fraction of this maximum current I

MAX

. By making the ratio

between R

LIM

and R

REF

this same fraction, I

LIM

is programmed as expressed in the

following formula:

Fig 5.

Simplified spindle motor schematic.

Fig 6.

Motor voltages when accelerating and braking with constant motor current.

001aaa450

EMF

001aaa432

accelerating

braking

EMF

DD(SPN)

max

MAX

DD SPN

(

)

motor

switches

--------------------------------------------

LIM

REF

-------------

MAX

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Figure 7

shows the limit current as a function of R

LIM

with R

REF

= 47 k

During accelerating and braking the motor current will not exceed I

LIM

. I

LIM

also sets the

transconductance gain I

LIM

VINREF

of the spindle driver.

7.5 Programming R

EMF

The back EMF voltage is internally regenerated. The ratio between R

EMF

and R

REF

used to scale the internal EMF regeneration. The value of external resistor R

EMF

depends

on the type of motor (k-factor and number of pole pairs N

) and the motor supply voltage

DD(SPN)

. The following formula should be used to determine the R

EMF

resistor:

with k in units Nm/A.

7.6 Frequency Generator (FG)

The raw zero-crossings of the Hall sensors are first filtered and debounced before being
passed to the FG. The FG toggles its output at every filtered Hall zero-crossing. For three
Hall sensors this means that the motor frequency is linked to the FG frequency by:

where N

indicates the number of pole pairs of the motor. The FG has an open-drain

output for easy interfacing to 3 V and 5 V logic.

7.7 Sled motor driver

Two current steering channels are available to drive a stepper motor. Per channel an
external sense resistor R

sense

is used that is connected to V

DD(SLD)

. A peak-current control

loop is implemented that modulates the duty cycle of the PWM signal (see

Figure 8

Fig 7.

Limit current I

LIM

as a function of external resistor R

LIM

LIM

)

001aaa434

100

LIM

(% of I

MAX

)

EMF

2.6

REF

DD SPN

(

)

--------------------------------------------------

motor

-------------------

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Philips Semiconductors

SA56203

One-chip motor driver

The clock generator has a nominal frequency of

kHz. See

Figure 9

, transfer

function from input voltage V

VINSLD

to output current at a typical R

sense

of 0.5

Input-to-output transconductance gain can be scaled down by connecting external resistor
R

ext

in series with the input VINSLD.

Both limiting current and transconductance gain are related to R

sense

in the following way:

Transconductance gain;

Limiting current;

Fig 8.

Peak-current control architecture of sled motor driver.

Fig 9.

Transfer function of sled motor driver.

001aab483

CLOCK

LOGIC
DRIVE

DRIVER

VINSLD

RSLD

sense

DD(SLD)

VSS(SLD)

SLDO

IRSLD

47 k

VINREF

input amplifier

osc

256

---------

001aaa436

VINSLD

VINREF

(V)

1 A

1 A/V

1 A

OUT

(A)

dead zone

30 mV

-------

sense

------------------------

LIM

sense

------------------------

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

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Philips Semiconductors

SA56203

One-chip motor driver

7.8 Loading motor driver

One of the linear channels is available to drive a DC loading motor. Pin V

DD(LD)

is used to

set the supply voltage for the loading motor driver. The following voltage-steering bridge
topology is implemented in the SA56203.

7.9 Actuator motor drivers

Three linear channels are available to drive 3D actuators: focus, tracking and tilt. Pin
V

DD(ACT)

is used to set the supply voltage for the focus and tilt actuators (maximum 5.5 V).

A separate pin V

DD(TRK)

sets the supply voltage for the tracking actuator (maximum 14 V).

The voltage-steering bridge topology is the same as depicted in

Figure 10

7.10 Charge pump

The on-board charge pump generates a voltage of typically 18.2 V by using the V

DD(SPN)

supply voltage. This boosted voltage is used to turn on the upper n-type DMOS transistors
of the output stages of the spindle driver, sled driver, loading driver and actuator drivers.
Recommended values for the pump and hold capacitor are 10 nF and 22 nF respectively
(see default settings). The charge pump should not be loaded with other components or
circuitry other than these capacitors.

7.11 Thermal protection

If the junction temperature of the SA56203 exceeds 150

C, then a thermal warning signal

is given at pin TEMP. Pin TEMP has an active-LOW open-drain output for easy interfacing
to the 3 V and 5 V logic. The temperature hysteresis for the thermal warning is 20

C. If

the junction temperature of the IC rises to 160

C, then a thermal shutdown is activated

that sets all power outputs in 3-state. The temperature hysteresis for the thermal
shutdown is 30

C. As soon as the thermal shutdown deactivates at 130

C, all motor

drivers continue normal operation. At the same time the thermal warning signal is
deactivated.

Fig 10. Voltage steering bridge topology of linear driver.

001aab246

47 k

188 k

LDO

DD(LD)

VINREF

VINLD

188 k

23.5 k

188 k

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

7.12 Oscillator

The RC oscillator uses two external components (R

REF

and C

OSC

) to fix its frequency at

18 MHz. R

REF

is used to generate a reference current. This reference current is used to

charge and discharge C

OSC

. The nominal oscillation frequency f

osc

is 18 MHz with

REF

= 47 k

(2 % tolerance) and C

OSC

= 70 pF (5 % tolerance). These values are fixed.

The oscillator can be overruled by applying an 18 MHz clock to pin COSC. The reference
current derived from R

REF

is also used for R

LIM

and R

EMF

. R

REF

should always be

connected.

7.13 Muting Functions

Pins CTL1 and CTL2 are used to mute certain parts of the IC; see

Table 3

[1]

Off equals 3-state.

Internal circuitry

Table 3:

Muting functions

[1]

CTL1 CTL2 Loading

motor

Sled
motor

Focus
tilt

Tracking

Spindle
motor

Special

off

standby

off

FG and Hall bias on; pin
VLDTRK for loader motor

off

all actuators off; pin
VLDTRK for tracking
actuator

off

spindle, sled and all
actuators on

Table 4:

Internal circuitry

Symbol

Pin

Equivalent circuit

Hall amplifiers

HU+

HV+

HW+

SSA

Hall bias

HBIAS

SSA

001aab696

2, 4, 6

1, 3, 5

001aab697

off when standby
(CTL1 and CTL2 = LOW)

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Current reference

RREF

REMF

RLIM

SSA

DDA

Spindle motor driver

SS1(SPN)

DD1(SPN)

SS2(SPN)

DD2(SPN)

Frequency generator

SSA

Spindle input

SSA

VINSPN

VINREF

Charge pump

DD1(SPN)

DD2(SPN)

SSA

CP1

CP2

CP3

Table 4:

Internal circuitry

Symbol

Pin

Equivalent circuit

001aab698

1.65 V

001aab699

13, 17

11, 15

001aab700

500 k

001aab701

001aab702

12 k

170 k

13, 17

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Control

SSA

CTL1

CTL2

Temperature warning

SSA

TEMP

Sled inputs

SSA

VINREF

VINSLD1

VINSLD2

VLDTRK output

SSA

DDA

VLDTRK

Sled motor driver

SS(SLD)

SLDO2

SLDO2+

RSLD2

SLDO1

SLDO1+

RSLD1

Linear motor drivers

TLTO

TLTO+

FCSO

FCSO+

DD(ACT)

SS(ACT)

Table 4:

Internal circuitry

Symbol

Pin

Equivalent circuit

001aab703

to mute table

001aab704

temperature
above 150

47 k

001aab705

29, 30

150

001aab706

001aab707

001aab708

001aab709

001aab710

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Limiting values

SS(ACT)

TRKO

TRKO+

LDO

LDO+

DD(TRK)

DD(LD)

Linear inputs

SSA

VINREF

VINTLT

VINFCS

VINTRK

VINLD

Oscillator

SSA

DDA

COSC

Table 4:

Internal circuitry

Symbol

Pin

Equivalent circuit

001aab711

001aab712

47 k

001aab713

52, 53, 54, 55

001aab714

Table 5:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

DD1(SPN)

DD2(SPN)

spindle driver supply
voltage

0.5

+16

DD(SLD)

sled driver sense supply

0.5

+16

DD(LD)

loading driver supply
voltage

0.5

+16

DD(TRK)

tracking driver supply
voltage

0.5

+16

DD(ACT)

focus/tilt drivers supply
voltage

0.5

+6.5

DDA

analog supply voltage

0.5

+6.5

stg

storage temperature

+150

amb

operating temperature
range

+85

junction temperature

+160

O(SPN)

spindle output current, pins
12, 14 and 16

2.1

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

10. Recommended operating conditions

O(SLD)

sled output current, pins
33, 34, 35, 36, 37 and 38

1.2

O(ACT)

loading/actuator drivers
output current, pins 40, 41,
42, 43, 46, 47, 48 and 49

2.0

Hall

Hall current on pins 1, 2, 3,
4, 5 and 6

HBIAS

Hall bias current on pin
HBIAS

+100

RPROG

current on external resistor
pins 8, 9 and 10

O(n)

current on pins 18, 28 and
31

+10

DIG

driver logic control current
on pins 26 and 27

CPUMP

charge pump current on
pins 23, 24 and 25

+20

STEER

steering current on pins 20,
21, 29, 30, 52, 53, 54 and
55

COSC

current on pin COSC

+20

esd

electrostatic discharge
voltage

pins 23, 40 to 44 and 51

human body model

1000

machine model

100

all other pins

human body model

2000

machine model

200

Table 5:

Limiting values

...continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 6:

Recommended operating conditions

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

DD1(SPN)

DD2(SPN)

spindle driver supply
voltage

DD1(SPN)

DD2(SPN)

4.5

DDA

analog supply
voltage

4.5

5.0

5.5

DD(SLD)

sled driver sense
supply

4.5

DD(ACT)

focus/tilt drivers
supply voltage

4.5

5.5

DD(TRK)

tracking driver
supply voltage

4.5

DD(LD)

loading driver supply
voltage

4.5

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

11. Thermal characteristics

12. Characteristics

Table 7:

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

th(j-a)

thermal resistance from
junction to ambient

in free air; multilayer
printed-circuit board

K/W

Fig 11. Maximum dissipation as a function of ambient temperature.

001aaa428

amb

(

150

100

(W)

Table 8:

Characteristics

DDA

= 5 V; V

DD1(SPN)

= V

DD2(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(TRK)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; T

amb

= 25

C; all

characteristics are specified for the default settings (see

Table 9

); all voltages are referenced to V

; positive currents flow

into the device; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supplies: pins V

DD1(SPN)

, V

DD2(SPN)

, V

DDA

, V

DD(ACT)

, V

DD(SLD)

, V

DD(LD)

, V

DD(TRK)

and CP3

DD(SPN)

spindle driver supply current

DD1(SPN)

+ I

DD2(SPN)

DDA

analog supply current

DD(SLD)

sled driver supply current

1.5

DD(ACT)

focus/tilt drivers supply
current

DD(TRK)

tracking driver supply current

DD(LD)

loading driver supply current

CTL2 = H

stb(tot)

total standby current

CTL1 = CTL2 = L

CP3

charge pump output voltage

18.7

DDA(POR)

power-on reset voltage on
V

DDA

3.5

9397 750 13365

Preliminary data sheet

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Philips Semiconductors

SA56203

One-chip motor driver

Spindle motor driver: pins HU+, HV+, HW+ HU

, HV

, HW

, HBIAS, RREF, REMF, RLIM, U, V, W FG, VINSPN, VINREF

and COSC

input offset voltage Hall
amplifier

= V

= 1.65 V

[1]

3.5

+3.5

input voltage range Hall
amplifier

DDA

HBIAS

voltage on pin HBIAS

HBIAS

= 32 mA

0.6

osc

oscillator frequency on pin
COSC

MHz

PWM

PWM frequency on pins U, V
and W

kHz

ds(on)

D-MOSFET on-resistance
(high or low)

I = 100 mA

0.35

VINREF

input voltage range on
reference pin VINREF

1.2

1.65

2.5

VINSPN

input voltage range on torque
control pin VINSPN

DDA

, I

spindle motor current limit

see

Figure 3

[2]

switches

+ R

motor

= 2

;

VINSPN

= 0 V and 3.3 V

2.55

m(SPN)

transconductance gain
spindle

see

Figure 3

[3]

switches

+ R

motor

= 2

;

VINSPN

= 0 V and 3.3 V

1.55

A/V

Sled motor driver: pins RSLD1, SLDO1+, SLDO1

, RSLD2, SLDO2+, SLDO2

, VINSLD2 and VINSLD1

SLDO

motor current limit

sense

= 0.5

; V

VINSLD

= 0 V

and 3.3 V

1.0

PWM

PWM frequency on pins
SLDO1+, SLDO1

, SLDO2+

and SLDO2

kHz

i(trip)

input dead zone trip level

[4]

transconductance gain

[4] [5]

0.60

0.75

0.90

A/V

ds(on)

D-MOSFET on-resistance
(high or low)

I = 100 mA; V

VINSLD

= 0 V and

3.3 V

1.0

Loading motor driver: pins VINLD, LDO+ and LDO

LDO

current limit (high or low)

CTL1 = L; R

= 4

;

VINLD

= 0 V and 3.3 V

0.85

1.0

1.5

output offset voltage

CTL1 = L; no load

100

+100

voltage gain

CTL1 = L; no load

[6]

17.2

18.0

18.8

ds(on)

D-MOSFET on-resistance
(high or low)

CTL1 = L; I = 100 mA;
V

VINLD

= 0 V and 3.3 V

0.7

1.0

Table 8:

Characteristics

...continued

DDA

= 5 V; V

DD1(SPN)

= V

DD2(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(TRK)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; T

amb

= 25

C; all

characteristics are specified for the default settings (see

Table 9

); all voltages are referenced to V

; positive currents flow

into the device; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

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Philips Semiconductors

SA56203

One-chip motor driver

Tracking actuator driver: pins VINTRK, TRKO+ and TRKO

TRKO

current limit

= 4

; V

VINTRK

= 0 V and

3.3 V

1.0

1.5

2.0

output offset voltage

no load

+70

voltage gain tracking driver

[7]

17.2

18.0

18.8

ds(on)

D-MOSFET on-resistance
(high or low)

I = 100 mA; V

VINTRK

= 0 V or

3.3 V

0.7

1.0

Focus and tilt actuator drivers: pins VINFCS, VINTLT, FCSO+, FCSO

, TLTO+ and TLTO

FCSO

, I

TLTO

current limit

= 4

;

VINFCS

= 0 V or 3.3 V;

VINTLT

= 0 V or 3.3 V

1.0

1.5

2.0

output offset voltage

no load

+55

voltage gain focus/tilt drivers

[7]

11.2

12.8

v(m)

gain mismatch between focus
and tilt drivers

[8]

ds(on)

MOSFET on-resistance (high
or low)

I = 100 mA;
V

VINFCS

= 0 V or 3.3 V;

VINTLT

= 0 V or 3.3 V

0.6

0.9

Voltage output loader/tracking actuator: pin VLDTRK

transresistance gain of
current loading motor

CTL1 = L; I

LDO

= 250 mA;

= 4

1.3

1.5

1.7

V/A

output offset transresistance
amplifier

CTL1 = L; no load

100

+100

voltage gain of back EMF
voltage tracking actuator

CTL2 = L

[9]

29.2

30.0

30.8

output offset back EMF
amplifier

CTL2 = L; R

= 4

250

+250

O(CM)

common mode output voltage

VINREF

VLDTRK

output resistance

I = 0.1 mA

150

O(source/sink)

source and sink current drive
capability

0.3

Digital inputs and outputs

Inputs: pins CTL1 and CTL2

HIGH-level input voltage

2.0

LOW-level input voltage

0.8

Outputs: pins FG and TEMP

LOW-level output voltage

I = 2 mA

0.5

Table 8:

Characteristics

...continued

DDA

= 5 V; V

DD1(SPN)

= V

DD2(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(TRK)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; T

amb

= 25

C; all

characteristics are specified for the default settings (see

Table 9

); all voltages are referenced to V

; positive currents flow

into the device; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

20 of 27

Philips Semiconductors

SA56203

One-chip motor driver

[1]

The recommended minimum Hall amplifier differential input voltage is 25 mV peak-to-peak value.

[2]

The motor current limit of the spindle is tested by applying VINSPN = 0 V and 3.3 V, measuring the duty-cycles on the U, V and W
spindle driver outputs and calculating the corresponding motor currents with the applied 12 V supply voltage and the 2

motor and

switches resistance.

[3]

The transconductance gain of the spindle is tested by applying VINSPN = 0 V and 3.3 V and calculating the corresponding motor
currents (see

Table note 2

) and determining the slope (see

Figure 3

[4]

The sled motor is tested loaded with R

= 4

in series with L

= 1 mH.

[5]

The transconductance gain of the sled motor driver is tested as:
g

= {(I

SLDO

at V

VINSLD

= 1.85 V)

SLDO

at V

VINSLD

= 1.45 V)}/0.4 V.

[6]

The voltage gain of the loading motor driver is tested as:
G

= {(V

LDO+

LDO

at V

VINLD

= 2.4 V)

LDO+

LDO

at V

VINLD

= 0.9 V)}/1.5 V.

[7]

The voltage gain of the actuator driver is tested as:
G

= {(V

ACTO+

ACTO

at V

VINACT

= 2.4 V)

ACTO+

ACTO

at V

VINACT

= 0.9 V)}/1.5 V.

[8]

The gain mismatch is related to the absolute gain; an absolute gain of 8 (18 dB) corresponds with a maximum mismatch of 0.4 (5 %)
and an absolute gain of 4 (12 dB) corresponds with a maximum mismatch of 0.2 (5%).

[9]

The voltage gain of the back EMF voltage tracking actuator is tested as:
G

= {(V

VLDTRK

at V

TRKO+

= 1.03 V and V

TRKO

= 1.00 V)

VLDTRK

at V

TRKO+

= 1.00 V and V

TRKO

= 1.03 V)}/0.06 V.

Temperature protection: pin TEMP

TEMP

thermal warning temperature

150

hys(TEMP)

thermal warning hysteresis

thermal shutdown
temperature

160

hys(SD)

thermal shutdown hysteresis

Table 8:

Characteristics

...continued

DDA

= 5 V; V

DD1(SPN)

= V

DD2(SPN)

= 12 V; V

DD(SLD)

= 12 V; V

DD(TRK)

= 12 V; V

DD(ACT)

= 5 V; V

DD(LD)

= 12 V; T

amb

= 25

C; all

characteristics are specified for the default settings (see

Table 9

); all voltages are referenced to V

; positive currents flow

into the device; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Table 9:

Default settings

Pin

Default setting

HU+, HV+

5 V

HW+

ground

, HV

, HW

1.650 V

HBIAS

open-circuit

RREF

47 k

to V

, fixed value, should not be changed

REMF

12 k

to V

RLIM

20 k

to V

SS1(SPN)

, V

SS2(SPN)

ground

U, V, W

open-circuit

DD1(SPN)

, V

DD2(SPN)

12 V supply

open-circuit

SSA

ground

VINSPN, VINREF

1.65 V

DDA

5 V supply

CP1, CP2

10 nF between CP1 and CP2

CP3

22 nF to ground

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

21 of 27

Philips Semiconductors

SA56203

One-chip motor driver

CTL1, CTL2

logic HIGH input; 5 V

TEMP

open-circuit

COSC

70 pF to ground, fixed value, should not be changed

VINLD, VINTRK, VINFCS, VINTLT

1.65 V

DD(LD)

, V

DD(TRK)

12 V supply

LDO+, LDO

, TRKO+, TRKO

open-circuit

SS(ACT)

ground

DD(ACT)

5 V supply

FCSO+, FCSO-, TLTO+, TLTO-

open-circuit

DD(SLD)

12 V supply

RSLD1

0.5

sense resistor to V

DD(SLD)

SLDO1+, SLDO1

open-circuit

RSLD2

0.5

sense resistor to V

DD(SLD)

SLDO2+, SLDO2

open-circuit

SS(SLD)

ground

VLDTRK

open-circuit

VINSLD2, VINSLD1

1.65 V

Table 9:

Default settings

...continued

Pin

Default setting

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

22 of 27

Philips Semiconductors

SA56203

One-chip motor driver

13. Package outline

Fig 12. Package outline SOT793-1 (HTSSOP56).

UNIT

max.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

1.2

0.15
0.05

1.05
0.80

0.25

0.27
0.17

0.20
0.09

4.3
4.1

0.5

8.3
7.9

0.4
0.1

8
0

0.08

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.8
0.4

SOT793-1

143E36T

MO-153

03-03-04

(1)

14.1
13.9

(2)

6.2
6.0

(1)

4.3
4.1

detail X

(A3)

exposed die pad

pin 1 index

HTSSOP56: plastic thermal enhanced thin shrink small outline package; 56 leads;
body width 6.1 mm; exposed die pad

SOT793-1

2.5

5 mm

scale

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

23 of 27

Philips Semiconductors

SA56203

One-chip motor driver

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

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Philips Semiconductors

SA56203

One-chip motor driver

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

14.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 10:

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

25 of 27

Philips Semiconductors

SA56203

One-chip motor driver

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Revision history

Table 11:

Revision history

Document ID

Release date

Data sheet status

Change notice

Order number

Supersedes

SA56203_1

20040930

Preliminary data sheet

9397 750 13365

Philips Semiconductors

SA56203

One-chip motor driver

9397 750 13365

Preliminary data sheet

Rev. 01 -- 30 September 2004

26 of 27

16. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

18. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

19. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 30 September 2004

Document number: 9397 750 13365

Published in The Netherlands

Philips Semiconductors

SA56203

One-chip motor driver

20. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 6

7.1

Spindle motor control . . . . . . . . . . . . . . . . . . . . 6

7.2

Spindle brake . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.3

Internal regeneration of back EMF spindle
motor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.4

Programming R

LIM

. . . . . . . . . . . . . . . . . . . . . . 8

7.5

Programming R

EMF

. . . . . . . . . . . . . . . . . . . . . . 9

7.6

Frequency Generator (FG) . . . . . . . . . . . . . . . . 9

7.7

Sled motor driver . . . . . . . . . . . . . . . . . . . . . . . 9

7.8

Loading motor driver. . . . . . . . . . . . . . . . . . . . 11

7.9

Actuator motor drivers . . . . . . . . . . . . . . . . . . 11

7.10

Charge pump . . . . . . . . . . . . . . . . . . . . . . . . . 11

7.11

Thermal protection . . . . . . . . . . . . . . . . . . . . . 11

7.12

Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

7.13

Muting Functions . . . . . . . . . . . . . . . . . . . . . . 12

Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15

Recommended operating conditions. . . . . . . 16

Thermal characteristics. . . . . . . . . . . . . . . . . . 17

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 22

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

14.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 23

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 23

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 24

14.5

Package related soldering information . . . . . . 24

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 25

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 26

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Contact information . . . . . . . . . . . . . . . . . . . . 26

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SA56203N1

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: SA56203N1