1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

FEATURES

Complete 1.4 GHz single chip system

Three PNP band switch buffers (20 mA)

Four bus-controlled bidirectional ports (NPN
open-collector outputs); only one port in 16-pin version

33 V tuning voltage output

In-lock detector

5-step ADC

Mixer-Oscillator (M/O) band switch output

15-bit programmable divider

Programmable reference divider ratio (512, 640
or 1024)

Programmable charge-pump current (50 or 250

Varicap drive disable

C-bus format

address plus 4 data bytes transmission (write mode)

address plus 1 status byte transmission (read mode)

three independent addresses

Low power and low radiation.

APPLICATIONS

TV tuners and front-ends

VCR tuners.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TSA5522M

SSOP20

plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

TSA5522T

SO16

plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

QUICK REFERENCE DATA

Note

1. One band switch buffer ON; I

= 20 mA.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

CC1

supply voltage (+5 V)

4.5

5.5

CC2

band switch supply voltage (+12 V)

CC1

13.5

CC1

supply current

CC2

band switch supply current

note 1

RF input frequency

1400

MHz

i(RF)

RF input voltage

= 80 to 150 MHz

dBm

= 150 to 1000 MHz

dBm

= 1000 to 1400 MHz

dBm

xtal

crystal oscillator input frequency

MHz

o(PNP)

PNP band switch buffers output current

o(NPN)

NPN open-collector output current

amb

operating ambient temperature

+85

stg

storage temperature (IC)

+150

GENERAL DESCRIPTION (see Fig.1)

The device is a single chip PLL frequency synthesizer
designed for TV and VCR tuning systems. The circuit
consists of a divide-by-eight prescaler with its own
preamplifier, a 15-bit programmable divider, a crystal
oscillator and its programmable reference divider and a
phase/frequency detector combined with a charge-pump
which drives the tuning amplifier, including 33 V output.
Three high-current PNP band switch buffers are provided
for band switching together with four open-collector NPN
outputs (only one open-collector output on 16-pin
devices). These ports can also be used as input ports [one
Analog-to Digital Converter (ADC) and three general
purpose I/O ports (not available on 16-pin devices)]. An
output is provided to control a Philips mixer/oscillator IC in
combination with the PNP buffers state.

Depending on the reference divider ratio (512, 640
or 1024), the phase comparator operates at 3.90625 kHz,
6.25 kHz or 7.8125 kHz with a 4 MHz crystal. The LOCK
detector bit FL is set to logic 1 when the loop is locked and
is read on the SDA line (status byte) during a read
operation.

The ADC is available for digital AFC control. The ADC
code is read during a read operation on the I

C-bus. The

ADC input is combined with the port P6. In the TEST
mode, this port is also used as a TEST output for f

ref

and

div

(see Table 4).

C-bus format

Five serial bytes (including address byte) are required to
address the device, select the VCO frequency, program
the ports, set the charge-pump current and the reference
divider ratio. The device has three independent I

C-bus

addresses selected by applying a specific voltage on AS
input (see Table 3). The general address C2 is always
valid.

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

PINNING

SYMBOL

SO16

SSOP20

DESCRIPTION

CC1

voltage supply (+5 V)

RF1

RF signal input 1

RF2

RF signal input 2

band switch output to mixer/oscillator drive

ground

CC2

voltage supply (+12 V)

n.c.

not connected

PNP band switch buffer output 2

PNP band switch buffer output 1

PNP band switch buffer output 0

charge-pump output

tune

tuning voltage output

NPN open-collector output/ADC input

NPN open-collector output/comparator input

SCL

serial clock input

SDA

serial data input/output

address selection input

XTAL

crystal oscillator input

Fig.2 Pin configuration (SO16).

handbook, halfpage

MLD225

TSA5522T

RF1

RF2

XTAL

SDA

SCL

CC1

VCC2

tune

Fig.3 Pin configuration (SSOP20).

handbook, halfpage

TSA5522M

MLD230

XTAL

SDA

SCL

RF1

RF2

CC2

CC1

n.c.

Vtune

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

FUNCTIONAL DESCRIPTION

The device is controlled via the two-wire I

C-bus. For

programming, there is one module address (7 bits) and the
R/W bit for selecting the READ or the WRITE mode.

C-bus mode

RITE MODE

(R/W = 0); see Table 1

Data bytes can be sent to the device after the address
transmission (first byte). Four data bytes are required to
fully program the device. The bus transceiver has an
auto-increment facility which permits the programming of
the device within one single transmission
(address + 4 data bytes).

The device can also be partially programmed providing
that the first data byte following the address is divider
byte 1 (DB1) or control byte (CB). The bits in the data
bytes are defined in Table 1. The first bit of the first data

byte transmitted indicates whether frequency data
(first bit = 0) or control and ports data (first bit = 1) will
follow. Until an I

C-bus STOP command is sent by the

controller, additional data bytes can be entered without the
need to re-address the device. The frequency register is
loaded after the 8th clock pulse of the second divider
byte (DB2), the control register is loaded after the 8th clock
pulse of the control byte (CB) and the ports register is
loaded after the 8th clock pulse of the ports byte (PB).

C-

BUS ADDRESS SELECTION

The module address contains programmable address bits
(MA1 and MA0) which offer the possibility of having
several synthesizers (up to 3) in one system by applying a
specific voltage on the AS input.

The relationship between MA1 and MA0 and the input
voltage on the AS input is given in Table 3.

Table 1

C-bus data format

Note

1. Not available on 16-pin devices.

Table 2

Description of Table 1

BYTE

MSB

DATA BYTE

LSB

COMMAND

Address byte (ADB)

MA1

MA0

Divider byte 1 (DB1)

N14

N13

N12

N11

N10

Divider byte 2 (DB2)

Control byte (CB)

RSA

RSB

Ports byte (PB)

(1)

SYMBOL

DESCRIPTION

MA1, MA0

programmable address bits (see Table 3)

N14 to N0

programmable divider bits N = N14

+ N13

+ ... + N1

2 + N0

charge-pump current; CP = 0 = 50

A; CP = 1 = 250

T2 to T0

test bits (see Table 4). For normal operation T2 = 0; T1 = 0; T0 = 1

RSA, RSB

reference divider ratio select bits (see Table 5)

tuning amplifier control bit; for normal operation OS = 0 and tuning voltage is ON; when
OS = 1 tuning voltage is OFF (high impedance)

P2 to P0

PNP band switch buffers control bits

P7 to P4

NPN open collector control bits when P

= 0 output n is OFF; when P

= 1 output n is ON

don't care

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

Table 3

Address selection

Table 4

Test bits

Table 5

Ratio select bits

Table 6

Band switch output levels

VOLTAGE APPLIED ON AS

INPUT

MA1

MA2

0 to 0.1V

CC1

Always valid

0.4V

CC1

to 0.6V

CC1

0.9V

CC1

to V

CC1

DEVICE OPERATION

normal mode

charge-pump is OFF

charge-pump is sinking current

charge-pump is sourcing current

ref

is available at LOCK output

div

is available at LOCK output

RSA

RSB

REFERENCE DIVIDER

640

1024

512

VOLTAGE

ON BS

OUTPUT

PHILIPS M/O

BAND

0.25 V

band A

0.4V

CC1

band B

0.8V

CC1

band C

EAD MODE

; R/W = 1 (see Table 7)

Data can be read from the device by setting the R/W bit to
logic 1. After the slave address has been recognized, the
device generates an acknowledge pulse and the first data
byte (status byte) is transferred on the SDA line (MSB
first). Data is valid on the SDA line during a HIGH level of
the SCL clock signal. A second data byte can be read from
the device if the microcontroller generates an
acknowledge on the SDA line (master acknowledge). End
of transmission will occur if no master acknowledge
occurs. The device will then release the data line to allow
the microcontroller to generate a STOP condition. When
ports P4 to P7 are used as inputs, the corresponding bits
must be logic 0 (high impedance state). The POR flag is
set to logic 1 at power-on. The flag is reset when an
end-of-data is detected by the device (end of a read
sequence). Control of the loop is made possible with the
in-lock flag (FL) which indicates when the loop is locked
(FL = 1).

The bits I2, to I0 represent the status of the I/O ports
P7, P5 and P4 respectively. A logic 0 indicates a LOW
level and a logic 1 indicates a HIGH level
(see "Characteristics").

A built-in ADC is available at pin P6. This converter can be
used to apply AFC information to the microcontroller from
the IF section of the television. The relationship between
the bits A2 to A0 is given in Table 8.

Table 7

READ data format

Notes

1. A = acknowledge.

2. POR = power-on-reset (POR = 1 at power-on).

3. FL = in-lock flag (FL = 1 when loop is locked).

4. I2 to I0 = digital levels for I/O ports P7, P5 and P4 respectively.

5. A2 to A0 = digital outputs of the 5-level ADC.

BYTE

MSB

DATA BYTE

LSB

COMMAND

Address byte (ADB)

MA1

MA0

(1)

Status byte (SB)

POR

(2)

(3)

(4)

(5)

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

Table 8

ADC levels

Note

1. Accuracy is 0.02V

CC1

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling bipolar devices. Every pin withstands the ESD test in
accordance with

MIL-STD-883C category B (2000 V). Every pin withstands the ESD test in accordance with Philips

Semiconductors Machine Model 0

, 200 pF (200 V).

VOLTAGE APPLIED ON

PORT P6

(1)

0.6V

CC1

to 13.5V

0.45V

CC1

to 0.6V

CC1

0.3V

CC1

to 0.45V

CC1

0.15V

CC1

to 0.3V

CC1

0 to 0.15V

CC1

SYMBOL

PARAMETER

MIN.

MAX

UNIT

CC1

supply voltage +5 V

0.3

6.0

CC2

supply voltage + 12 V

0.3

i(RF)

prescaler input voltage

0.3

CC1

o(BS)

band switch output voltage

0.3

CC1

o(PNP)

PNP band switch buffer output voltage

0.3

CC2

o(PNP)

PNP band switch buffers output current

NPN

NPN open-collector output voltage

0.3

NPN

NPN open-collector output current

o(CP)

charge-pump output voltage

0.3

CC1

o(tune)

output tuning voltage

0.3

i(SCL)

serial clock input voltage

0.3

6.0

i/o(SDA)

serial data input/output voltage

0.3

6.0

o(SDA)

serial data output current

i(AS)

address selection input voltage

0.3

CC1

i(xtal)

crystal oscillator input voltage

0.3

CC1

stg

storage temperature range (IC)

+150

maximum junction temperature

+150

short circuit time; every pin to V

CC1

or GND

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

THERMAL CHARACTERISTICS

CHARACTERISTICS

CC1

= 4.5 to 5.5 V; V

CC2

= V

CC1

to 13.2 V; T

amb

20 to 85

C; unless otherwise specified; see note 1

SYMBOL

PARAMETER

MAX

UNIT

th j-a

thermal resistance from junction to ambient in free air

SO16

110

K/W

SSOP20

120

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX

UNIT

CC1

supply voltage (+5 V)

4.5

5.5

CC2

supply voltage (+12 V)

CC1

13.5

CC1

supply current

CC2

supply current

One band switch buffer is ON;
I

source

= 20 mA

RF input frequency

1400

MHz

divider ratio

15-bit frequency word

256

32767

MHz

Crystal oscillator

xtal

crystal oscillator input
frequency

xtal

= 25 to 300

3.2

4.48

MHz

xtal

crystal oscillator input
impedance (absolute value)

= 4 MHz

600

1200

Prescaler

i(RF)

RF input level

CC1

= 4.5 to 5.5 V; see Fig.4;

= 80 to 150 MHz

CC1

= 4.5 to 5.5 V; see Fig.4;

= 150 to 1000 MHz

CC1

= 4.5 to 5.5 V; see Fig.4;

= 1000 to 1400 MHz

PNP band switch buffers outputs

output leakage current

CC2

= 13.5 V; V

= 0 V

o(sat)

output saturation voltage

source

= 20 mA; note 1

0.2

0.5

NPN open-collector outputs P4, P5, P6 and P7; see note 2

output leakage current

CC1

= 5.5 V; V

= 13.5 V

o(sat)

output saturation voltage

sink

= 20 mA; note 3

0.2

0.5

allowed capacitive loading
on output pins

= 13.5 V

Input ports P7, P5 and P4; see note 2

LOW level input voltage

1.5

HIGH level input voltage

AS input (Address Selection)

IH(AS)

HIGH level input current

= V

CC1

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

Notes

1. A single PNP band switch buffer is ON.

2. P4, P5 and P7 I/O ports are not available in 16-pin package. In 20-pin package, when a port is active, the collector

voltage must not exceed 6 V.

3. A single NPN open-collector output is ON.

IL(AS)

LOW level input current

= 0 V

SCL and SDA inputs

LOW level input voltage

1.5

HIGH level input voltage

3.0

5.5

HIGH level input current

= 5.5 V; V

CC1

= 0 V

= 5.5 V; V

CC1

= 5.5 V

LOW level input current

= 0 V; V

CC1

= 5.5 V

clk

input clock frequency

100

400

kHz

SDA output (I

C bus mode)

ILO

output leakage current

= 5.5 V

output voltage

sink

= 3 mA

0.4

BS output (M/O band selection)

o(BS)

output voltage

band A; I

source

= 20

0.25

0.5

band B; I

source

= 20

0.36V

CC1

0.4V

CC1

0.43V

CC1

band C; I

source

= 20

0.7V

CC1

0.8V

CC1

0.9V

CC1

band C; I

source

= 50

3.1

Charge-pump output CP

ICPH

HIGH charge pump current
(absolute value)

CP = 1

250

ICPL

LOW charge pump current
(absolute value)

CP = 0

o(CP)

output voltage

in-lock; T

amb

= +25

1.95

LI(off)

off-state leakage current

T2 = 0; T1 = 1

Tuning voltage output V

tune

LO(off)

leakage current when
switched-off

OS = 1; V

tune

= 33 V

output voltage when the
loop is closed

OS = 0; T2 = 0; T1 = 0; T0 = 1;
R

= 27 k

;

tune

= 33 V

0.4

32.6

ripple(p-p)

acceptable ripple voltage
on V

CC1

(peak-to-peak

value)

ripple

= 300 Hz to 300 kHz

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX

UNIT

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

PACKAGE OUTLINES

detail X

(A )

pin 1 index

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

10.0

9.8

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0
0.4

SOT109-1

91-08-13
95-01-23

076E07S

MS-012AC

0.069

0.0098
0.0039

0.057
0.049

0.01

0.019
0.014

0.0098
0.0075

0.39
0.38

0.16
0.15

0.050

1.05

0.041

0.24
0.23

0.028
0.020

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

2.5

5 mm

scale

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

SSOP

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

ETHOD

(SO

AND

SSOP)

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1996 Jan 23

Philips Semiconductors

Product specification

1.4 GHz I

C-bus controlled synthesizer

TSA5522

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Philips Semiconductors a worldwide company

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SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905,

Tel. 9-5(800)234-7381, Fax. (708)296-8556

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. (040)2783749, Fax. (040)2788399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. (09)849-4160, Fax. (09)849-7811

Norway: Box 1, Manglerud 0612, OSLO,

Tel. (022)74 8000, Fax. (022)74 8341

Pakistan: Philips Electrical Industries of Pakistan Ltd.,

Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton,
KARACHI 75600, Tel. (021)587 4641-49,
Fax. (021)577035/5874546

Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. (63) 2 816 6380, Fax. (63) 2 817 3474

Portugal: PHILIPS PORTUGUESA, S.A.,

Rua dr. António Loureiro Borges 5, Arquiparque - Miraflores,
Apartado 300, 2795 LINDA-A-VELHA,
Tel. (01)4163160/4163333, Fax. (01)4163174/4163366

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. (65)350 2000, Fax. (65)251 6500

South Africa: S.A. PHILIPS Pty Ltd.,

195-215 Main Road Martindale, 2092 JOHANNESBURG,
P.O. Box 7430, Johannesburg 2000,
Tel. (011)470-5911, Fax. (011)470-5494

Spain: Balmes 22, 08007 BARCELONA,

Tel. (03)301 6312, Fax. (03)301 42 43

Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM,

Tel. (0)8-632 2000, Fax. (0)8-632 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. (01)488 2211, Fax. (01)481 77 30

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West

Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978,
TAIPEI 100, Tel. (886) 2 382 4443, Fax. (886) 2 382 4444

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong,
Bangkok 10260, THAILAND,
Tel. (66) 2 745-4090, Fax. (66) 2 398-0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. (0 212)279 27 70, Fax. (0212)282 67 07

Ukraine: Philips UKRAINE, 2A Akademika Koroleva str., Office 165,

252148 KIEV, Tel. 380-44-4760297, Fax. 380-44-4766991

United Kingdom: Philips Semiconductors LTD.,

276 Bath Road, Hayes, MIDDLESEX UB3 5BX,
Tel. (0181)730-5000, Fax. (0181)754-8421

United States: 811 East Arques Avenue, SUNNYVALE,

CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556

Uruguay: Coronel Mora 433, MONTEVIDEO,

Tel. (02)70-4044, Fax. (02)92 0601

Internet: http://www.semiconductors.philips.com/ps/

For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BE-p,
P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-2724825

SCDS47

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