ChipFind - документация

Электронный компонент: BZA968AVL

Скачать:  PDF   ZIP
www.docs.chipfind.ru
background image
DATA SHEET
Product specification
Supersedes data of 2003 Apr 15
2003 Oct 20
DISCRETE SEMICONDUCTORS
BZA900AVL series
Quadruple low capacitance ESD
suppressor
M3D743
background image
2003 Oct 20
2
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
FEATURES
Low diode capacitance
Low leakage current
SOT665 surface mount package
Common anode configuration.
APPLICATIONS
Communication systems
Computers and peripherals
Audio and video equipment.
DESCRIPTION
Monolithic transient voltage suppressor diode in a five lead
SOT665 package for 4-bit wide ESD transient
suppression.
MARKING
PINNING
TYPE NUMBER
MARKING CODE
BZA956AVL
V3
BZA962AVL
V2
BZA968AVL
V1
PIN
DESCRIPTION
1
cathode 1
2
common anode
3
cathode 2
4
cathode 3
5
cathode 4
handbook, halfpage
MGW315
1
5
4
3
2
1
2
3
4
5
Fig.1 Simplified outline (SOT665) and symbol.
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
BZA956AVL
-
plastic surface mounted package; 5 leads
SOT665
BZA962AVL
-
plastic surface mounted package; 5 leads
SOT665
BZA968AVL
-
plastic surface mounted package; 5 leads
SOT665
background image
2003 Oct 20
3
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. DC working current limited by P
tot(max)
.
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
THERMAL CHARACTERISTICS
Note
1. Solder point of common anode (pin 2).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
Per diode
I
Z
working current
T
amb
= 25
C
-
note 1
mA
I
F
continuous forward current
T
amb
= 25
C
-
200
mA
I
FSM
non-repetitive peak forward current
t
p
= 1 ms; square pulse
-
3.5
A
P
tot
total power dissipation
T
amb
= 25
C; note 2; see Fig.5
-
335
mW
P
ZSM
non repetitive peak reverse power
dissipation
square pulse; t
p
= 1 ms
-
6
W
T
stg
storage temperature
-
65
+150
C
T
j
junction temperature
-
150
C
ESD
electrostatic discharge
IEC 61000-4-2 (contact discharge)
15
-
kV
HBM MIL-Std 883
10
-
kV
STANDARD
CONDITIONS
IEC 61000-4-2, level 4 (ESD)
>15 kV (air); >8 kV (contact discharge)
HBM MIL-Std 883, class 3
>4 kV
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th j-a
thermal resistance from junction to
ambient
all diodes loaded
370
K/W
R
th j-s
thermal resistance from junction to
solder point; note 1
one diode loaded
135
K/W
all diodes loaded
125
K/W
background image
2003 Oct 20
4
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
ELECTRICAL CHARACTERISTICS
T
j
= 25
C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
F
forward voltage
I
F
= 200 mA
-
-
1.2
V
I
R
reverse current
BZA956AVL
V
R
= 3 V
-
-
200
nA
BZA962AVL
V
R
= 4 V
-
-
100
nA
BZA968AVL
V
R
= 4.3 V
-
-
20
nA
V
Z
working voltage
I
Z
= 1 mA
BZA956AVL
5.32
5.6
5.88
V
BZA962AVL
5.89
6.2
6.51
V
BZA968AVL
6.46
6.8
7.14
V
r
dif
differential resistance
I
Z
= 1 mA
BZA956AVL
-
-
200
BZA962AVL
-
-
150
BZA968AVL
-
-
100
S
Z
temperature coefficient
I
Z
= 1 mA
BZA956AVL
-
1.3
-
mV/K
BZA962AVL
-
2.4
-
mV/K
BZA968AVL
-
2.9
-
mV/K
C
d
diode capacitance
f = 1 MHz; V
R
= 0
BZA956AVL
-
22
28
pF
BZA962AVL
-
18
22
pF
BZA968AVL
-
16
19
pF
diode capacitance
f = 1 MHz; V
R
= 5 V
BZA956AVL
-
12
17
pF
BZA962AVL
-
9
12
pF
BZA968AVL
-
8
11
pF
I
ZSM
non-repetitive peak reverse current
t
p
= 1 ms; T
amb
= 25
C
BZA956AVL
-
-
0.90
A
BZA962AVL
-
-
0.85
A
BZA968AVL
-
-
0.80
A
background image
2003 Oct 20
5
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, halfpage
10
1
10
-
1
MLE001
10
-
2
10
-
1
1
tp (ms)
IZSM
(A)
10
BZA956AVL
BZA962AVL/BZA968AVL
Fig.2
Maximum non-repetitive peak reverse
current as a function of pulse time.
handbook, halfpage
10
1
10
2
MLE003
10
-
2
10
-
1
1
tp (ms)
PZSM
(W)
10
BZA962AVL
BZA956AVL
BZA968AVL
Fig.3
Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
handbook, halfpage
0
5
26
6
10
14
18
22
1
2
3
4
VR (V)
Cd
(pF)
MLE002
BZA962AVL
BZA968AVL
BZA956AVL
Fig.4
Diode capacitance as a function of reverse
voltage; typical values.
T
j
= 25
C; f = 1 MHz.
handbook, halfpage
0
50
100
150
400
300
100
0
200
MGT586
Tamb (
C)
Ptot
(mW)
Fig.5 Power derating curve.
background image
2003 Oct 20
6
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
handbook, full pagewidth
MLE005
450
50
Note 1: attenuator is only used for open
socket high voltage measurements
IEC 1000-4-2 network
CZ = 150 pF; RZ = 330
1/4 BZA900AVL
RG 223/U
50
coax
RZ
CZ
ESD TESTER
DIGITIZING
OSCILLOSCOPE
10
ATTENUATOR
note 1
GND
GND1
GND2
GND3
GND
GND
unclamped
+
1 kV ESD voltage waveform
(IEC 1000-4-2 network)
clamped
+
1 kV ESD voltage waveform
(IEC 1000-4-2 network)
unclamped
-
1 kV ESD voltage waveform
(IEC 1000-4-2 network)
clamped
-
1 kV ESD voltage waveform
(IEC 1000-4-2 network)
vertical scale = 5 V/div
horizontal scale = 50 ns/div
BZA968AVL
BZA962AVL
BZA956AVL
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
Fig.6 ESD clamping test set-up and waveforms.
background image
2003 Oct 20
7
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
APPLICATION INFORMATION
Typical common anode application
A quadruple transient suppressor in a SOT665 package makes it possible to protect four separate lines using only one
package. Two simplified examples are shown in Figs.7 and 8.
handbook, full pagewidth
GND
keyboard,
terminal,
printer,
etc.
I/O
BZA900AVL
A
B
C
D
FUNCTIONAL
DECODER
MLE008
Fig.7 Computer interface protection.
handbook, full pagewidth
MLE009
I/O
ROM
RAM
CPU
CLOCK
GND
VDD
VGG
data bus
control bus
address bus
BZA900AVL
Fig.8 Microprocessor protection.
background image
2003 Oct 20
8
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA900AVL is determined by the peak transient current
and the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
terminals or connectors
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
unprotected conductors
4. Minimize all printed-circuit board loop areas including
power and ground loops
5. Minimize the length of the transient return path to
ground
6. Avoid using shared transient return paths to a common
ground point.
background image
2003 Oct 20
9
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
PACKAGE OUTLINE
UNIT
b
p
c
D
E
e
1
H
E
L
p
w
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
01-01-04
01-08-27
IEC
JEDEC
EIAJ
mm
0.27
0.17
0.18
0.08
1.7
1.5
1.3
1.1
0.5
e
1.0
1.7
1.5
0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT665
bp
D
e1
e
A
Lp
detail X
HE
E
w
M
A
A
S
0
1
2 mm
scale
A
0.6
0.5
c
X
1
2
3
4
5
Plastic surface mounted package; 5 leads
SOT665
Y S
background image
2003 Oct 20
10
Philips Semiconductors
Product specification
Quadruple low capacitance ESD suppressor
BZA900AVL series
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
background image
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
R76/03/pp
11
Date of release:
2003 Oct 20
Document order number:
9397 750 11935

Document Outline