LHG T680
Multi TOPLED
Common Anode
Abgekndigt nach PD_078_02
Obsolete acc. to PD_078_02
2003-08-04
1
Besondere Merkmale
Gehusetyp: weies P-LCC-4 Gehuse;
Kontrasterhhung durch schwarze Oberflche
Besonderheit des Bauteils: additive
Farbmischung durch unabhngige
Ansteuerung aller Chips
Wellenlnge: 645 nm (hyper-rot),
570 nm (grn)
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: AlGaAs (hyper-rot);
GaP (grn)
optischer Wirkungsgrad: 3 lm/W (hyper-rot),
2,5 lm/W (grn)
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 8000/Rolle, 330 mm
Anwendungen
Anzeigen im Innenbereich
(z.B. in Laufschriftanzeigen)
3-Farb-Anzeigen (rot-gelb-grn)
Leuchtdiodenchips getrennt ansteuerbar
Hinterleuchtung (LCD, Schalter, Tasten,
Displays, Werbebeleuchtung,
Allgemeinbeleuchtung)
Einkopplung in Lichtleiter
Fr automobil Anwendungen nicht geeignet
Gleiche Pinbelegung wie LHGB T686
Features
package: white P-LCC-4 package;
higher contrast by a black surface
feature of the device: additive mixture of color
stimuli by independent driving of each chip
wavelength: 645 nm (hyper-red),
570 nm (green)
viewing angle: Lambertian Emitter (120)
technology: AlGaAs (hyper-red);
GaP (green)
optical efficiency: 3 lm/W (hyper-red),
2.5 lm/W (green)
grouping parameter: luminous intensity
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 8000/reel, 330 mm
Applications
indoor displays
(e.g. light writing displays)
3-color-displays (red-yellow-green)
LED chips can be controlled separately
backlighting (LCD, switches, keys, displays,
illuminated advertising, general lighting)
coupling into light guides
not suitable for automotive applications
same pin layout like LHGB T686
2003-08-04
2
LHG T680
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 11 % ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of 11 %.
s
Abgekndigt nach PD_078_02 / Obsolete acc. to PD_078_02
Letzte Bestellung / Last Order: 30.09.2003
Letzte Lieferung / Last Delivery: 31.03.2004
Anm.: Die Standardlieferform von Serientypen beinhaltet eine Familiengruppe. Einzelne Gruppen sind
nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Gruppe pro Farbe enthalten.
Note: The standard shipping format for serial types includes a family group. Individual groups are not
available.
No packing unit / tape ever contains more than one luminous intensity group per color.
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous Intensity
I
F
= 10 mA
I
V
(mcd)
Bestellnumm
er
Ordering
Code
hyper-red
green
s
LHG T680
s
LHG T680-L+K
s
LHG T680-L+L
s
LHG T680-L+M
s
LHG T680-M+K
s
LHG T680-M+L
s
LHG T680-M+M
hyper-red
green
colorless clear
and
black painted
package surface
11.2 ...28.0
11.2 ...18.0
11.2 ...18.0
11.2 ...18.0
18.0 ...28.0
18.0 ...28.0
18.0 ...28.0
7.1 ... 28.0
7.1 ... 11.2
11.2 ... 18.0
18.0 ... 28.0
7.1 ... 11.2
11.2 ... 18.0
18.0 ... 28.0
on request
LHG T680
2003-08-04
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LH
LG
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
C
Durchlassstrom
Forward current
I
F
30
mA
Stostrom
Surge current
t
10
s,
D
= 0.005
I
FM
0.5
A
Sperrspannung
1)
Reverse Voltage
V
R
5
12
V
Leistungsaufnahme
Power consumption
P
tot
90
95
mW
Wrmewiderstand
Thermal resistance
Sperrschicht / Umgebung
1 chip on
Junction / air
2 chips on
Sperrschicht / Ltpad
1 chip on
Junction / solder point
2 chips on
Montage auf PC-Board FR 4 (Padgre
16 mm
2
)
mounted on PC board FR 4 (pad size
16 mm
2
)
R
th JA
R
th JA
R
th JS
R
th JS
480
680
260
370
K/W
K/W
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2003-08-04
4
LHG T680
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Werte
Values
Einheit
Unit
LH
LG
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 10 mA
peak
660
572
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 10 mA
dom
645
570
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 10 mA
22
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
120
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
(max.)
I
F
= 10 mA
V
F
V
F
1.75
2.5
2.0
2.5
V
V
Sperrstrom
(tpy.)
Reverse current
(max)
V
R
= 12 V (green), V
R
= 5 V (hyper-red)
I
R
I
R
0.01
10
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 10 mA; 10C
T
100C
TC
peak
0.28
0.11
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 10 mA; 10C
T
100C
TC
dom
0.05
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 10 mA; 10C
T
100C
TC
V
2.5
1.4
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 10 mA
opt
3
2.5
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LHG T680
2003-08-04
5
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 10 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
%
OHL01359
100
80
60
40
20
0
400
450
500
550
600
650
700
nm
hyper-red
I
rel
V
green
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LHG T680
2003-08-04
6
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(10 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 10 mA
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
10
1.4
5
-1
0
10
V
F
V
5
1
10
F
mA
2
10
green
hyper-red
OHL01360
1.6 1.8 2.0 2.2 2.4 2.6
3.0
V
V (20 mA)
10
-1
0
10
10
1
2
10
mA
10
-3
5
OHL01361
F
I
5
-2
10
5
-1
10
0
10
1
10
I
I
5
5
hyper-red
green
green
0
OHL01365
C
A
T
0
20
40
60
80
100
V
V (25 C)
I
I
0.4
0.8
1.2
1.6
2
hyper-red
OHL00110
0
I
F
T
0
mA
A
20
40
60
80 C 100
10
20
30
40
2 chips on
1 chip on
LHG T680
2003-08-04
7
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
OHL00111
0
I
F
T
0
mA
S
20
40
60
80 C 100
10
20
30
40
2 chips on
1 chip on
LHG T680
2003-08-04
8
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
green/hyper-red (1 Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
green/hyper-red (2 Chips on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
green/hyper-red (1Chip on)
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 85 C
green/hyper-red (2 Chips on)
OHL01686
s
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
D
I
T
T
P
F
t
P
=
D
= 0.005
0.01
0.02
0.05
0.2
0.5
DC
10
1
5
I
F
t
2
10
0.1
p
10
3
mA
-5
10
0.2
0.1
0.005
0.02
mA
OHL00121
0.5
10
0
p
t
I
F
D
=
-4
10
-3
10
-2
10
-1
10
0
10
1
10
s
1
10
2
10
3
10
P
D
T
P
t
=
t
T
F
I
-5
10
0.2
0.1
0.005
0.02
mA
OHL00104
0.5
10
0
p
t
I
F
D
=
-4
10
-3
10
-2
10
-1
10
0
10
1
10
s
1
10
2
10
3
10
P
D
T
P
t
=
t
T
F
I
-5
10
0.2
0.1
0.005
0.02
mA
OHL00122
0.5
10
0
p
t
I
F
D
=
-4
10
-3
10
-2
10
-1
10
0
10
1
10
s
1
10
2
10
3
10
P
D
T
P
t
=
t
T
F
I
LHG T680
2003-08-04
9
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gewicht / Approx. weight: 35 mg
GPLY6925
4
1
0.12 (0.005)
0.18 (0.007)
marking
Package
3.4 (0.134)
1
3.0 (0.118)
0.1 (0.004) typ
(2.4 (0.094))
4
3.7 (0.146)
3.3 (0.130)
0.5 (0.020)
1.1 (0.043)
0.4 (0.016)
0.6 (0.024)
2.1 (0.083)
1.7 (0.067)
0.8 (0.031)
0.6 (0.024)
2.6 (0.102)
2.1 (0.083)
2.3 (0.091)
3.0 (0.118)
2
3
0.9 (0.035)
0.7 (0.028)
C
A
A
C
Circuit Diagram
1
Cathode
Hyper-red(H)
2
Anode
H, G
4
Cathode
Green (G)
2003-08-04
10
LHG T680
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
LHG T680
2003-08-04
11
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2003-08-04
12
LHG T680
Empfohlenes Ltpaddesign
IR Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHLPY439
Padgeometrie fr
verbesserte Wrmeableitung
improved heat dissipation
Paddesign for
Ltstoplack
Solder resist
1.1 (0.043)
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
3.3 (0.130)
0.5 (0.020)
7.5 (0.295)
0.4 (0.016)
Cathode marking
Kathoden Markierung /
Cu Flche / 12 mm per pad
2
Cu-area
_
<
3.3 (0.130)
LHG T680
2003-08-04
13
Empfohlenes Ltpaddesign
Wellenlten (TTW)
Recommended Solder Pad
TTW Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY0583
6.1 (0.240)
2.8 (0.110)
2 (0.079)
3 (0.118)
6 (0.236)
3.5 (0.138)
1.5 (0.059)
2 (0.079)
3.5 (0.138)
1 (0.039)
8 (0.315)
2.8 (0.110)
0.5 (0.020)
7.5 (0.295)
Solder resist
Ltstoplack
PCB-direction
Bewegungsrichtung
der Platine
2 (0.079)
Padgeometrie fr
improved heat dissipation
verbesserte Wrmeableitung
Paddesign for
2
Cu Flche / > 12 mm per pad
Cu-area
2003-08-04
14
LHG T680
Gurtung / Polaritt und Lage
Verpackungseinheit 8000/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 8000/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY0139
4 (0.157)
2.9 (0.114)
1.5 (0.059)
4 (0.157)
3.6 (0.142)
3.5 (0.138)
2 (0.079)
1.75 (0.069)
8 (0.315)
C
C
A
LHG T680
2003-08-04
15
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If requested,
e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2003-08-04
Date of change
Previous Version:
2003-03-04
Page
Subjects (major changes since last revision)
15
annotations
2002-07-23
3, 4
value (reverse voltage)
2002-09-18
all
not for new designs
2002-11-18
3, 4
hyper-red: value (reverse voltage from 12 V to 5 V)
2003-02-11
1, 2
Obsolete
2003-08-04
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