LG T671
TOPLED
Bright Green Die
2002-09-18
1
Besondere Merkmale
Gehusetyp: weies P-LCC-2 Gehuse
Besonderheit des Bauteils: extrem breite
Abstrahlcharakteristik; ideal fr
Hinterleuchtungen und Einkopplungen in
Lichtleiter
Wellenlnge: 570 nm
Abstrahlwinkel: Lambertscher Strahler (120)
Technologie: GaAlP
optischer Wirkungsgrad: 2,5 lm/W
Gruppierungsparameter: Lichtstrke
Verarbeitungsmethode: fr alle
SMT-Bestcktechniken geeignet
Ltmethode: IR Reflow Lten und
Wellenlten (TTW)
Vorbehandlung: nach JEDEC Level 2
Gurtung: 8 mm Gurt mit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
Anwendungen
Hinterleuchtung (LCD, Schalter, Tasten,
Displays, Werbebeleuchtung,
Allgemeinbeleuchtung)
optischer Indikator
Einkopplung in Lichtleiter
Innenbeleuchtung im Automobilbereich
(z.B. Instrumentenbeleuchtung, u. .)
Features
package: white P-LCC-2 package
feature of the device: extremely wide viewing
angle; ideal for backlighting and coupling in
light guides
wavelength: 570 nm
viewing angle: Lambertian Emitter (120)
technology: GaAlP
optical efficiency: 2.5 lm/W
grouping parameter: luminous intensity
assembly methods: suitable for all
SMT assembly methods
soldering methods: IR reflow soldering and
TTW soldering
preconditioning: acc. to JEDEC Level 2
taping: 8 mm tape with 2000/reel, 180 mm or
8000/reel, 330 mm
Applications
backlighting (LCD, switches, keys, displays,
illuminated advertising, general lighting)
optical indicators
coupling into light guides
interior automotive lighting (e.g. dashboard
backlighting)
2002-09-18
2
LG T671
Anm.: -1 gesamter Farbbereich (siehe Seite 4)
Die Standardlieferform von Serientypen beinhaltet eine untere bzw. eine obere Familiengruppe,
die aus nur 3 bzw. 4 Halbgruppen besteht. Einzelne Halbgruppen sind nicht erhltlich.
In einer Verpackungseinheit / Gurt ist immer nur eine Halbgruppe enthalten.
Note: -1 Total color tolerance range (see page 4)
The standard shipping format for serial types includes a lower or upper family group of 3 or 4
individual groups. Individual half groups are not available.
No packing unit / tape ever contains more than one luminous intensity half group.
Typ
Type
Emissions-
farbe
Color of
Emission
Farbe der
Lichtaustritts-
flche
Color of the
Light Emitting
Area
Lichtstrke
Luminous
Intensity
I
F
= 10 mA
I
V
(mcd)
Lichtstrom
Luminous
Flux
I
F
= 10 mA
V
(mlm)
Bestellnummer
Ordering Code
LG T671-K2L2-1
LG T671-L2N1-1
green
colorless clear
9.0 ... 18.0
14.0 ... 35.5
40 (typ.)
70 (typ.)
Q65110A0342
Q65110A0343
LG T671
2002-09-18
3
Grenzwerte
Maximum Ratings
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Betriebstemperatur
Operating temperature range
T
op
40 ... + 100
C
Lagertemperatur
Storage temperature range
T
stg
40 ... + 100
C
Sperrschichttemperatur
Junction temperature
T
j
+ 100
C
Durchlassstrom
Forward current
I
F
30
mA
Stostrom
Surge current
t
10
s,
D
= 0.005
I
FM
0.5
A
Sperrspannung
1)
Reverse voltage
V
R
12
V
Leistungsaufnahme
Power consumption
P
tot
95
mW
Wrmewiderstand
Thermal resistance
Sperrschicht/Umgebung
Junction/air
Sperrschicht/Ltpad
Junction/solder point
Montage auf PC-Board FR 4 (Padgre
16 mm
2
)
mounted on PC board FR 4 (pad size
16 mm
2
)
R
th JA
R
th JS
400
180
K/W
K/W
1)
fr kurzzeitigen Betrieb geeignet / suitable for short term application
2002-09-18
4
LG T671
Kennwerte (
T
A
= 25 C)
Characteristics
Bezeichnung
Parameter
Symbol
Symbol
Wert
Value
Einheit
Unit
Wellenlnge des emittierten Lichtes
(typ.)
Wavelength at peak emission
I
F
= 10 mA
peak
572
nm
Dominantwellenlnge
1)
(typ.)
Dominant wavelength
I
F
= 10 mA
dom
570 6
nm
Spektrale Bandbreite bei 50 %
I
rel max
(typ.)
Spectral bandwidth at 50 %
I
rel max
I
F
= 10 mA
25
nm
Abstrahlwinkel bei 50 %
I
V
(Vollwinkel)
(typ.)
Viewing angle at 50 %
I
V
2
120
Grad
deg.
Durchlassspannung
2)
(typ.)
Forward voltage
(max.)
I
F
= 10 mA
V
F
V
F
2.0
2.5
V
V
Sperrstrom
(typ.)
Reverse current
(max.)
V
R
= 12 V
I
R
I
R
0.01
10
A
A
Temperaturkoeffizient von
peak
(typ.)
Temperature coefficient of
peak
I
F
= 10 mA; 10C
T
100C
TC
peak
0.11
nm/K
Temperaturkoeffizient von
dom
(typ.)
Temperature coefficient of
dom
I
F
= 10 mA; 10C
T
100C
TC
dom
0.07
nm/K
Temperaturkoeffizient von
V
F
(typ.)
Temperature coefficient of
V
F
I
F
= 10 mA; 10C
T
100C
TC
V
1.4
mV/K
Optischer Wirkungsgrad
(typ.)
Optical efficiency
I
F
= 10 mA
opt
2.5
lm/W
1)
Wellenlngen werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von 1 nm ermittelt.
Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of 1 nm.
2)
Spannungswerte werden mit einer Stromeinprgedauer von 1 ms und einer Genauigkeit von 0,1 V ermittelt.
Voltages are tested at a current pulse duration of 1 ms and a tolerance of 0.1 V.
LG T671
2002-09-18
5
Helligkeitswerte werden mit einer Stromeinprgedauer von 25 ms und einer Genauigkeit von
11% ermittelt.
Luminous intensity is tested at a current pulse duration of 25 ms and a tolerance of
11%.
Helligkeits-Gruppierungsschema
Luminous Intensity Groups
Lichtgruppe
Luminous Intensity Group
Lichtstrke
Luminous Intensity
I
V
(mcd)
Lichtstrom
Luminous Flux
V
(mlm)
K2
L1
L2
M1
M2
N1
9.0 ... 11.2
11.2 ... 14.0
14.0 ... 18.0
18.0 ... 22.4
22.4 ... 28.0
28.0 ... 35.5
30 (typ.)
40 (typ.)
50 (typ.)
60 (typ.)
75 (typ.)
95 (typ.)
2002-09-18
6
LG T671
Relative spektrale Emission
I
rel
=
f
(
),
T
A
= 25 C,
I
F
= 10 mA
Relative Spectral Emission
V(
) = spektrale Augenempfindlichkeit
Standard eye response curve
Abstrahlcharakteristik
I
rel
=
f
(
)
Radiation Characteristic
%
rel
OHL01098
100
80
60
40
20
0
400
450
500
550
600
650
700
nm
I
green
V
0
0.2
0.4
1.0
0.8
0.6
1.0
0.8
0.6
0.4
0
10
20
40
30
OHL01660
50
60
70
80
90
100
0
20
40
60
80
100
120
LG T671
2002-09-18
7
Durchlassstrom
I
F
=
f
(
V
F
)
Forward Current
T
A
= 25 C
Maximal zulssiger Durchlassstrom
I
F
=
f
(
T
)
Max. Permissible Forward Current
Relative Lichtstrke
I
V
/
I
V(10 mA)
=
f
(
I
F
)
Relative Luminous Intensity
T
A
= 25 C
Relative Lichtstrke
I
V
/
I
V(25 C)
=
f
(
T
A
)
Relative Luminous Intensity
I
F
= 10 mA
10
-1
V
5
OHL01263
I
F
F
V
0
10
1
10
2
10
5
mA
1
1.4
1.8
2.2
2.6
3
3.4
0
OHL01099
I
F
C
T
0
20
40
60
80
100
temp. solder point
T
S
S
T
A
T
10
20
30
40
temp. ambient
A
T
V
V (10mA)
10
-1
0
10
10
1
2
10
mA
10
-3
5
OHL02313
F
I
5
-2
10
5
-1
10
0
10
1
10
I
I
5
5
green
green
0
OHL01101
C
A
T
0
20
40
60
80
100
V
V (25 C)
I
I
0.4
0.8
1.2
1.6
2
2002-09-18
8
LG T671
Zulssige Impulsbelastbarkeit
I
F
=
f
(
t
p
)
Permissible Pulse Handling Capability
Duty cycle
D
= parameter,
T
A
= 25 C
OHL01686
s
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
t
D
I
T
T
P
F
t
P
=
D
= 0.005
0.01
0.02
0.05
0.2
0.5
DC
10
1
5
I
F
t
2
10
0.1
p
10
3
mA
LG T671
2002-09-18
9
Mazeichnung
Package Outlines
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Kathodenkennung:
abgeschrgte Ecke
Cathode mark:
bevelled edge
Gewicht / Approx. weight: 35 mg
GPLY6724
0.7 (0.028)
0.9 (0.035)
1.7 (0.067)
2.1 (0.083)
0.12 (0.005)
0.18 (0.007)
0.5 (0.020)
1.1 (0.043)
3.3 (0.130)
3.7 (0.146)
0.4 (0.016)
0.6 (0.024)
2.6 (0.102)
3.0 (0.118)
2.1 (0.083)
2.3 (0.091)
Cathode marking
3.0 (0.118)
3.4 (0.134)
(2.4) (0.095)
0.1 (0.004) (typ.)
4
1
2002-09-18
10
LG T671
Ltbedingungen
Vorbehandlung nach JEDEC Level 2
Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Ltprofil
(nach IPC 9501)
IR Reflow Soldering Profile
(acc. to IPC 9501)
OHLY0597
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
240-245 C
10-40 s
183 C
120 to 180 s
Defined for Preconditioning: up to 6 K/s
Ramp-down rate up to 6 K/s
Ramp-up rate up to 6 K/s
Defined for Preconditioning: 2-3 K/s
LG T671
2002-09-18
11
Wellenlten (TTW)
(nach CECC 00802)
TTW Soldering
(acc. to CECC 00802)
OHLY0598
0
0
50
100
150
200
250
50
100
150
200
250
300
T
t
C
s
235 C
10 s
C
... 260
1. Welle
1. wave
2. Welle
2. wave
5 K/s
2 K/s
ca 200 K/s
C
C
... 130
100
2 K/s
Zwangskhlung
forced cooling
Normalkurve
standard curve
Grenzkurven
limit curves
2002-09-18
12
LG T671
Empfohlenes Ltpaddesign
IR-Reflow Lten
Recommended Solder Pad
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
Gehuse fr Wellenlten (TTW) geeignet / Package suitable for TTW-soldering
OHLPY970
4.5 (0.177)
2.6 (0.102)
1.5 (0.059)
Paddesign
for improved
heat dissipation
Cu-area > 16 mm
Cu-Flche > 16 mm
2
fr verbesserte
Padgeometrie
Wrmeableitung
2
Solder resist
Ltstopplack
4.5 (0.177)
1.5 (0.059)
2.6 (0.102)
LG T671
2002-09-18
13
Empfohlenes Ltpaddesign verwendbar fr TOPLED
und Power TOPLED
IR Reflow Lten
Recommended Solder Pad useable for TOPLED
and Power TOPLED
IR Reflow Soldering
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHLPY440
Padgeometrie fr
verbesserte Wrmeableitung
improved heat dissipation
Paddesign for
Ltstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Flche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
Kathode/
Cathode
Anode
Flche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
0.7 (0.028)
Flche darf elektrisch nicht beschaltet werden.
Do not use this area for electrical contact.
2002-09-18
14
LG T671
Gurtung / Polaritt und Lage
Verpackungseinheit 2000/Rolle, 180 mm
oder 8000/Rolle, 330 mm
Method of Taping / Polarity and Orientation Packing unit 2000/reel, 180 mm
or 8000/reel, 330 mm
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
OHAY2271
C
A
3.6 (0.142)
8 (0.315)
3.5 (0.138)
1.75 (0.069)
4 (0.157)
1.5 (0.059)
2.9 (0.114)
4 (0.157)
2 (0.079)
LG T671
2002-09-18
15
Published by OSRAM Opto Semiconductors GmbH
Wernerwerkstrasse 2, D-93049 Regensburg
All Rights Reserved.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
All typical data and graphs are basing on representative samples, but don't represent the production range. If
requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.
Terms of delivery and rights to change design reserved. Due to technical requirements components may contain
dangerous substances. For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the Internet.
Packing
Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing
material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs
incurred.
Components used in life-support devices or systems must be expressly authorized for such purpose! Critical
components
1
may only be used in life-support devices or systems
2
with the express written approval of OSRAM OS.
1
A critical component is a component used in a life-support device or system whose failure can reasonably be expected
to cause the failure of that life-support device or system, or to affect its safety or the effectiveness of that device or
system.
2
Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain
and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Revision History: 2002-09-18
Date of change
Previous Version:
2002-09-16
Page
Subjects (major changes since last revision)
9
change of weight from 40 mg to 35 mg
2002-07-05
14
annotations
2002-07-23
13
recomm. solder pad for TOPLED
and Power TOPLED
(OHLPY440)
2002-08-05
3, 4
value (reverse voltage from 5 V to 12 V)
2002-08-19
2
Ordering Code
2002-09-18
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