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Электронный компонент: ML671000

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FEDL671000-02
1Semiconductor
This version: Jul. 2001
Previous version: Jul. 2001
ML671000
OKI's CMOS 32-Bit Single-Chip Microcontroller with Built-in USB Device Controller
1/25
GENERAL DESCRIPTION
The ML671000 is a high-performance CMOS 32-bit microcontroller combining a RISC based, 32-bit CPU core -
the ARM7TDMI
TM
- with USB device controller, memory and peripherals.
The built-in USB device controller which is based on USB1.1 Full-speed (12 Mbps) makes interface with PCs or
other devices by USB. The ML671000, which provides the 32-bit data processing capability and built-in
peripheral functions performed by UART, serial ports, 16-bit timers, a DMA controller, and a memory controller,
is a single-chip microcontroller idealy suited to PC peripheral equipment and communication terminal control
applications.
FEATURES (1)
CPU
RISC 32-bit CPU
(ARM7TDMI)
Executable 32-bit instructions and 16-bit instructions
General registers:
32-bit
31 registers
Built-in multiplier
Little-endian format
Memory Spaces
Internal RAM :
4K bytes
External ROM, RAM, I/O :
26M bytes
External DRAM :
32M bytes
I/O Ports
I/O pins: 64 pins (I/O directions are specified at the bit level)
Timers
16-bit flexible timer
2ch
(auto-reload, compare-output, PWM, capture modes)
16-bit auto-reload timer
2ch
12-bit watchdog timer
Serial Ports
UART (16550A equivalent)
1ch, UART/synchronous serial
1ch
USB Device Controller
USB1.1 compliant, support full-speed (12 Mbps)
Transmission type: control, bulk, isochronous, interrupt
Remote wakeup function
Adaptable to USB bus powered devices
Four endpoint addresses
Endpoint FIFO size
EP0
64 bytes
2 (transmit/receive)
EP1
64 bytes
1 (transmit-receive)
EP2
64 bytes
2 (transmit-receive, 2 levels)
EP3
256 bytes
2 (transmit-receive, 2 levels)
DMA Controller
2ch
Single and Dual addressing modes
Cycle steal and Burst transfers
8- or 16-bit data transfers
Maximum transferring: 65536 times
Addressing area:
64M bytes
ARM7TDMI and the ARM POWERED logo are registered trademarks of ARM Ltd., UK.
The information contained herein can change without notice owing to the product being under development.
FEDL671000-02
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FEATURES (2)
Interrupt Controller
Interrupt sources:
22 (13 internal , 9 external )
Interrupt priority:
8 levels
Memory Controller
Direct connection to ROM, SRAM, DRAM and I/O.
4-bank memory control
ROM, RAM, I/O
2 banks; DRAM
2 banks
Access wait control parameters for each bank.
Other
Arbitration of external bus request
Power saving functions
Standby modes:
HALT and STOP modes
Clock gears:
Selection of 1/2 OSC, 1/1 OSC, OSC
2
Onboard debugging is possible with JTAG interface.
Built-in PLL:
4
Power Supply Voltage
3.0 to 3.6 V
Operating Frequency
CPU: 6, 12, 24 MHz; USB: 48 MHz @12 MHz (Operating USBC)
CPU: 4 to 24 MHz (Non-Operating USBC)
Operating Temperature
Range
-
10
C to +70
C
Package
128-pin plastic QFP (QFP128-P-1420-0.50-K)
APPLICATIONS
Digital still camera, Printer, Terminal Adapter for PC peripherals and Communication terminals.
FEDL671000-02
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ML671000
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BLOCK DIAGRAM
ARM7DTMI
RAM
Interrupt
Controller
Time Base
Generator
Flexible Timer/
Auto-reload Timer
UART Port
Serial Port
USB Device Controller
PLL
2-channel
DMAC
Internal Bus/External Memory Controller
I/O Port
P
0
[7:0]*
P
1
[7:0]*
P
3
[7:0]*
P
2
[7:0]*
P
4
[7:0]*
P
5
[7:0]*
Asterisks indicate pins with secondary functions.
P
6
[7:0]*
P
7
[7:0]
XA[15:1]
XA0/nLB
nCS0
nRD
nWRE/nWRL
P0[7:0]/XA[23:16]
XD[15:0]
P1.7/nXWAIT
P1.6/nCS1
P1.5/nHB/nWRH
P1.4/nRAS1
P1.3/nWH/nCASH
P1.2/nRAS0
P1.1/nCAS/nCASL
P1.0/nWL/nWE
P6.7/nBACK
P6.6/nBREQ
nEFIQ
P2[7:0]/nEIR[7:0]
P3.7/TMCLK3
P3.6/TMCLK2
P3.5/TMCLK1
P3.4/TMCLK0
P3.3/TMIN1/TMOUT1
P3.2/TMIN0/TMOUT0
D +
D
-
P4.7/SOUT
P4.6/ SIN
P4.5/TXD0
P4.4/RXD0
P4.3/ TXC
P4.2/ RXC
P6.5/DACK1
P6.4/DACK0
P6.3/nDREQ1
P6.2/nDREQ0
nRST
nEA
DBSEL
TEST
V
DD
V
SS
OSC0
OSC1
CLKOUT
PLLEN
TCK
TMS
nTRST
TDI
TDO
P5.7/ DTR
P5.6/ RTS
P5.5/ CTS
P5.4/ DSR
P5.3/ DCD
P5.2/ RI
P5.1/OUT1
P5.0/OUT2
nR/W
OSCV
DD
OSCV
SS
32-bit Core Address Bus
32-bit Core Address Bus
(two each)
P
e
ri
pheral
A
ddress B
u
s
P
e
ri
pheral

A
d
dress B
u
s
(16
bi
ts)
FEDL671000-02
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PIN CONFIGURATION (TOP VIEW)
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
XD1 XD2 XD3 XD4 XD5 XD6 XD7 XD8 XD9
XD1
0
XD1
1
XD12
XD13
XD14
XD15
XA0
/
n
L
B
XA1
XA4
XA3
XA2
V
SS
V
DD
XA5
XA7 XA8 XA9
XA1
0
XA1
1
XA1
2
XA1
3
XA1
4
XA1
5
P0
.
1
/
XA1
7
P0
.
0
/
XA1
6
P0
.
2
/
XA1
8
P0
.
3
/
XA1
9
P0
.
4
/
XA2
0
P0
.
5
/
XA2
1
P0
.
6
/
XA2
2
P0
.
7
/
XA2
3
V
DD
V
SS
DBSEL
XD0
nCS0
nRD
nWRE/nWRL
P1.1/nCAS/nCASL
P1.2/nRAS0
P1.3/nWH/nCASH
P1.4/nRAS1
P1.5/nHB/nWRH
P1.6/nCS1
P
2
.0/nE
I
R0
P
2
.1/nE
I
R1
P
2
.2/nE
I
R2
P
2
.3/nE
I
R3
P
2
.4/nE
I
R4
P
2
.5/nE
I
R5
P
2
.6/nE
I
R6
P
2
.7/nE
I
R7
V
SS
V
DD
P7.7
nEFIQ
P7.6
P7.5
P7.4
P7.3
P7.2
P7.1
P7.0
nEA
D+
D-
nTRST
TDO
TDI
TMS
TCK
TEST
nRST
PL
L
E
N
CL
KOUT
OSCV
DD
OSC0
OSC1
OSCV
SS
P1.7/nXWAIT
P6.7/nBACK
P6.6/nBREQ
P6.5/DACK1
P6.4/DACK0
P6.3/nDREQ1
P6.2/nDREQ0
P6.0
P
5
.7/DT
R
P
5
.6/RT
S
P
5
.5/CT
S
P
5
.4/DS
R
P
5
.3/DCD
P
5
.2/RI
P
5
.1/OUT
2
P
5
.0/OUT
1
P
4
.7/S
OUT
P
4
.6/S
IN
P
4
.5/T
X
D
P
4
.4/RX
D
P
4
.3/T
X
C
P
4
.2/RX
C
P4
.
1
P4
.
0
P
3
.7/T
M
C
LK
3
P
3
.6/T
M
C
LK
2
P
3
.5/T
M
C
LK
1
P
3
.4/T
M
C
LK
0
P
3
.3/T
M
I
N1/T
M
O
UT
1
P
3
.2/T
M
I
N0/T
M
O
UT
0
P3
.
1
P3
.
0
V
SS
V
DD
nR/W
P1.0/nWL/nWE
XA6
P6.1
V
SS
V
DD
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
128-Pin Plastic QFP
FEDL671000-02
1Semiconductor
ML671000
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PIN DESCRIPTION (1)
Classification
Pin Name
I/O
Function
Description
XA15 to XA1
O
--
External address bus bits 15 to 1
Address Bus
nLB/XA0
O
--
Bank 0/1 lower byte select or external address bus bit 0
Data Bus
XD15 to XD0
I/O
--
External data bus
nCS0
O
--
Bank 0 chip select signal
nRD
O
--
Bank 0/1 read enable signal
nR/W
O
--
Read strobe signal
Bus Control
nWRE/nWRL
O
--
Bank 0/1 write enable or lower byte write enable signal
OSC0
I
--
Connection pin for crystal oscillator or ceramic resonator
If an external clock used, input the clock signal to this pin.
OSC1
O
--
Connection pin for crystal oscillator or ceramic resonator
If an external clock used, leave this pin open (unconnected).
CLKOUT
O
--
Internal system clock output
PLLEN
I
--
Enable pin for internal PLL. If PLL is to be used, connect this pin to V
DD
.
OSCV
DD
I
--
Power supply pin for internal oscillator circuit and PLL. Connect to V
DD
.
Clock Control
OSCV
SS
I
--
Power supply pin for internal oscillator circuit and PLL. Connect to
GND.
I/O
Primary
Bit 7 of port 0
P0.7/XA23
O
Secondary
Bit 23 of external address bus
I/O
Primary
Bit 6 of port 0
P0.6/XA22
O
Secondary
Bit 22 of external address bus
I/O
Primary
Bit 5 of port 0
P0.5/XA21
O
Secondary
Bit 21 of external address bus
I/O
Primary
Bit 4 of port 0
P0.4/XA20
O
Secondary
Bit 20 of external address bus
I/O
Primary
Bit 3 of port 0
P0.3/XA19
O
Secondary
Bit 19 of external address bus
I/O
Primary
Bit 2 of port 0
P0.2/XA18
O
Secondary
Bit 18 of external address bus
I/O
Primary
Bit 1 of port 0
P0.1/XA17
O
Secondary
Bit 17 of external address bus
I/O
Primary
Bit 0 of port 0
P0.0/XA16
O
Secondary
Bit 16 of external address bus
I/O
Primary
Bit 7 of port 1
P1.7/nXWAIT
I
Secondary
External wait cycle insert input
I/O
Primary
Bit 6 of port 1
P1.6/nCS1
O
Secondary
Bank 1 chip select signal
I/O
Primary
Bit 5 of port 1
P1.5/nHB/
nWRH
O
Secondary
Bank 0/1 upper byte select or upper byte write enable signal
I/O
Primary
Bit 4 of port 1
P1.4/nRAS1
O
Secondary
Bank 3 row address strobe signal
I/O
Primary
Bit 3 of port 1
P1.3/
nWH/nCASH
O
Secondary
Bank 2/3 upper byte column address strobe signal.
I/O
Primary
Bit 2 of port 1
P1.2/nRAS0
O
Secondary
Bank 2 row address strobe signal
I/O
Primary
Bit 1 of port 1
P1.1/
nCAS/nCASL
O
Secondary
Bank 2/3 column address strobe or lower byte column address strobe
signal
I/O
Primary
Bit 0 of port 1
I/O Ports
P1.0/
nWL/nWE
O
Secondary
Bank 2/3 lower byte write enable or write enable signal
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PIN DESCRIPTION (2)
Classification
Pin Name
I/O
Function
Description
I/O
Primary
Bit 7 of port 2
P2.7/nEIR7
I
Secondary
External interrupt request 7 input pin
I/O
Primary
Bit 6 of port 2
P2.6/nEIR6
I
Secondary
External interrupt request 6 input pin
I/O
Primary
Bit 5 of port 2
P2.5/nEIR5
I
Secondary
External interrupt request 5 input pin
I/O
Primary
Bit 4 of port 2
P2.4/nEIR4
I
Secondary
External interrupt request 4 input pin
I/O
Primary
Bit 3 of port 2
P2.3/nEIR3
I
Secondary
External interrupt request 3 input pin
I/O
Primary
Bit 2 of port 2
P2.2/nEIR2
I
Secondary
External interrupt request 2 input pin
I/O
Primary
Bit 1 of port 2
P2.1/nEIR1
I
Secondary
External interrupt request 1 input pin
I/O
Primary
Bit 0 of port 2
P2.0/nEIR0
I
Secondary
External interrupt request 0 input pin
I/O
Primary
Bit 7 of port 3
P3.7/TMCLK3
I
Secondary
External clock input pin for timer 3
I/O
Primary
Bit 6 of port 3
P3.6/TMCLK2
I
Secondary
External clock input pin for timer 2
I/O
Primary
Bit 5 of port 3
P3.5/TMCLK1
I
Secondary
External clock input pin for timer 1
I/O
Primary
Bit 4 of port 3
P3.4/TMCLK0
I
Secondary
External clock input pin for timer 0
I/O
Primary
Bit 3 of port 3
P3.3/
TMIN1/
TMOUT1
I/O
Secondary
If timer 1 is set to the compare-output or PWM modes, this pin is an
output.
If set to the capture mode, this pin is an input.
I/O
Primary
Bit 2 of port 3
P3.2/
TMIN1/
TMOUT0
I/O
Secondary
If timer 0 is set to the compare-output or PWM modes, this pin is an
output.
If set to the capture mode, this pin is an input.
P3.1
I/O
--
Bit 1 of port 3
P3.0
I/O
--
Bit 0 of port 3
I/O
Primary
Bit 7 of port 4
P4.7/SOUT
O
Secondary
Serial data output pin for UART serial port
I/O
Primary
Bit 6 of port 4
P4.6/SIN
I
Secondary
Serial data input pin for UART serial port
I/O
Primary
Bit 5 of port 4
P4.5/TXD
O
Secondary
Transmit data output pin for UART/synchronous serial port
I/O
Primary
Bit 4 of port 4
P4.4/RXD
I
Secondary
Receive data input pin for UART/synchronous serial port
Primary
Bit 3 of port 4
P4.3/TXC
I/O
Secondary
Transmit clock I/O pin for UART/synchronous serial port
Primary
Bit 2 of port 4
P4.2/RXC
I/O
Secondary
Receive clock I/O pin for UART/synchronous serial port
P4.1
I/O
--
Bit 1 of port 4
I/O Ports
P4.0
I/O
--
Bit 0 of port 4
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PIN DESCRIPTION (3)
Classification
Pin Name
I/O
Function
Description
I/O Primary
Bit 7 of port 5
P5.7/DTR
O
Secondary
DTR signal output pin for UART serial port
I/O Primary
Bit 6 of port 5
P5.6/RTS
O
Secondary
RTS signal output pin for UART serial port
I/O Primary
Bit 5 of port 5
P5.5/CTS
I
Secondary
CTS signal input pin for UART serial port
I/O Primary
Bit 4 of port 5
P5.4/DSR
I
Secondary
DSR signal input pin for UART serial port
I/O Primary
Bit 3 of port 5
P5.3/DCD
I
Secondary
DCD signal input pin for UART serial port
I/O Primary
Bit 2 of port 5
P5.2/RI
I
Secondary
RI signal input pin for UART serial port
I/O Primary
Bit 1 of port 5
P5.1/OUT1
O
Secondary
OUT1 signal output pin for UART serial port
I/O Primary
Bit 0 of port 5
P5.0/OUT2
O
Secondary
OUT2 signal output pin for UART serial port
I/O Primary
Bit 7 of port 6
P6.7/nBACK
O
Secondary
Bus release request acknowledged signal output pin
I/O Primary
Bit 6 of port 6
P6.6/nBREQ
I
Secondary
Bus release request signal input pin
I/O Primary
Bit 5 of port 6
P6.5/DACK1
O
Secondary
Data transfer request 1 acknowledged signal output pin
I/O Primary
Bit 4 of port 6
P6.4/DACK0
O
Secondary
Data transfer request 0 acknowledged signal output pin
I/O Primary
Bit 3 of port 6
P6.3/nDREQ1
I
Secondary
Data transfer request 1 signal input pin
I/O Primary
Bit 2 of port 6
P6.2/nDREQ0
I
Secondary
Data transfer request 0 signal input pin
P6.1
I/O
--
Bit 1 of port 6
P6.0
I/O
--
Bit 0 of port 6
P7.7
I/O
--
Bit 7 of port 7
P7.6
I/O
--
Bit 6 of port 7
P7.5
I/O
--
Bit 5 of port 7
P7.4
I/O
--
Bit 4 of port 7
P7.3
I/O
--
Bit 3 of port 7
P7.2
I/O
--
Bit 2 of port 7
P7.1
I/O
--
Bit 1 of port 7
I/O Ports
P7.0
I/O
--
Bit 0 of port 7
D
+
I/O
--
USB Port
D
-
I/O
--
USB data I/O pins
TCK
I
--
Test clock input pin
TMS
I
--
Test mode select pin
TDI
I
--
Test data input pin
TDO
O
--
Test data output pin
Debug
Interface
nTRST
I
--
Boundary scan logic reset input pin
Interrupt
nEFIQ
I
--
External FIQ (high-speed interrupt) interrupt request signal input pin
nEA
I
--
Normally connected to ground
nRST
I
--
System reset signal input pin for this LSI device
DBSEL
I
--
During a system reset of this LSI device, this pin sets the bank 0 data
bus width. To set a 16-bit bus width, connect to V
DD
. To set an 8-bit bus
width, connect to GND.
System
Control
TEST
I
--
This pin sets the test and debug modes for this LSI device. Normally
connected to GND.
V
DD
I
--
Power supply pin. Connect all V
DD
pins to the power supply.
Power Supply
V
SS
I
--
Ground pin. Connect all V
SS
pins to GND.
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OVERVIEW OF INTERNAL PERIPHERAL FUNCTIONS
I/O Ports
The 64 I/O ports are configured from the 8-bit ports P0 to P7. Each bit of each port can be specified as an input
or output. If specified as an input, the port becomes a high impedance input. In addition to their port function
(primary function), some ports are assigned secondary functions such as an external interface function or an
I/O pin for an internal peripheral.
Timers
The timers consist of a 2-channel 16-bit flexible timer and a 2-channel 16-bit general-purpose timer. A count
clock can be selected for each channel.
-
Flexible timer
Operating modes: auto-reload timer, compare-output, PWM, capture
-
General-purpose timer
Auto-reload timer
-
Synchronous timer operation
Timer channel can be started and stopped in union.
-
Count clock
A count clock can be selected for each timer as: 1/1, 1/2, 1/4, 1/8, 1/16, and 1/32 of the system clock,
or as an external clock.
Time Base Generator
The time base generator consists of the time base counter, which drives frequency dividers deriving the time
base signals for on-chip peripherals from the system clock signals, and a watchdog timer, which counts time
base clock cycles and produces a system reset signal when its internal counter overflows.
UART Serial Port
Functionally the same as the 16550A, the UART serial port is equipped with 16-byte FIFOs for both receive
and transmit, modem control signals, a dedicated baud rate generator, etc.
-
Full duplex operation
-
Independent controls for transmit, receive, line status and data set interrupt
-
Modem control signals: CTS, DSR, DCD, DTR, RTS and RI
-
Built-in dedicated baud rate generator
-
Data length:5, 6, 7, or 8 bits
-
Stop bit:
1, 1.5, or 2 bits
-
Parity:
odd, even, or none
-
Detection of receive errors: parity error, framing error, overrun error, or data error of break interrupt
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UART/Synchronous Serial Port
The UART/synchronous serial port is a serial port that operates in two communication modes, the UART
mode and synchronous mode. In the UART mode, characters units are synchronized according to the
controlled start bit and stop bit, and data is transferred. In the synchronous mode, the data transfer is
synchronized to the controlled shift clock.
-
Built-in dedicated baud rate generator
-
Data length:7 or 8 bits
-
Stop bit:
1 or 2 bits (UART mode only)
-
Parity:
even or odd parity (none in the synchronous mode)
-
Detection of receive errors: parity error, framing error, and overrun error
(only overrun error in the synchronous mode)
-
Full-duplex operation
Interrupt Controller
The interrupt controller manages interrupt requests from 9 external sources and 13 internal sources, and passes
them on to the CPU as interrupt request (IRQ) or fast interrupt request (FIQ) exception requests. An interrupt
level can be set for each interrupt and priority can be controlled.
-
Supports 9 external interrupt sources from nEFIQ and nEIR [7:0] pins and 13 internal interrupt sources
from internal peripherals such as the USB device controller and the timers.
-
To simplify the control of interrupt priority, 8 interrupt levels can be set for each interrupt source.
-
The interrupt controller assigns a unique interrupt number to each interrupt source to permit rapid
branching to the appropriate routine.
Direct Memory Access (DMA) Controller
The direct memory access (DMA) controller is used instead of the CPU to transfer data between internal
memory, internal peripherals, external memory and memory mapped external devices.
-
Built-in 2 channels
-
Supports 64MB address area
-
Transfer data size:
8 or 16 bits
-
Maximum transferring:
65536 times
-
Addressing modes:
single or dual address mode
-
Bus modes:
cycle-steal or burst mode
-
Supports transfer requests from nDREQ[0:1] pins, internal peripheral devices and software.
-
Generates transfer complete interrupt requests when transfer is completed.
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ML671000
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Universal Serial Bus (USB) Device Controller
The USB device controller consists of a protocol engine to control the USB communications protocol, DPLL,
status/control, FIFO control, a USB transceiver, etc. The USB device controller conforms to USB spec. 1.1
full-speed (12Mbps) .
-
Supports the 4 types of transfers that are specified by the USB standard.
(control transfer, bulk transfer, isochronous transfer, and interrupt transfer)
-
Remote wakeup function
-
Adaptable to USB bus powered devices
-
4 endpoint addresses
Endpoint FIFO contents and functions
Endpoint
FIFO contents
Transfer mode
64 bytes
1 (transmit)
EP0
64 bytes
1 (receive)
Control
EP1
64 bytes
1 (transmit-receive)
Bulk, interrupt
EP2
64 bytes
2 (transmit-receive)
Bulk, interrupt, isochronous
EP3
256 bytes
2 (transmit-receive)
Bulk, interrupt, isochronous
External Memory Controller
The external memory controller generates control signals for accessing external memory (ROM, RAM,
DRAM, etc.) and peripheral devices mapped in the external memory space, and arbitrates external bus
requests from external devices.
-
Manages memory by dividing the memory space into 4 banks
2 banks of ROM, SRAM, and I/O
2 banks of DRAM
Each bank has a 16MB address space.
Bus width (8 or 16 bits) and wait cycles can be specified for each bank.
-
ROM, SRAM and I/O can be connected directly.
Outputs a strobe signal for the ROM, SRAM and I/O.
-
DRAM can be connected directly.
Row and column addresses are output as multiplexed signals.
Random access mode or high-speed page mode
Supports CAS before RAS refresh and self-refresh.
Clock Control
The clock controller generates and controls the system clock based on the internal oscillator circuit and phase
locked loop (PLL). It also controls the transitions to and from standby modes (HALT and STOP modes) and
returns to normal operation of mode.
-
It offers a choice of divider ratio for adjusting operating clock frequency to match the load processing.
When using PLL:
2
f, f, f/2
Not using PLL:
f, f/2, f/4, f/8
f = input clock frequency
FEDL671000-02
1Semiconductor
ML671000
11/25
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Condition
Rated value
Unit
Supply voltage
V
DD
-
0.3 to +4.6
Input voltage
V
IN
-
0.3 to V
DD
+
0.3
V
Output current
I
O
12
mA
Power dissipation
P
D
V
DD
GND = 0 V
Ta = 25
C
1
W
Storage temperature
T
STG
--
55 to
+
150
C
RECOMMENDED OPERATING CONDITIONS
(GND = 0 V)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Supply voltage
V
DD
--
3.0
3.3
3.6
Storage holding voltage
V
DDH
f
C
= 0 Hz
2.0
--
3.6
V
Operating frequency
f
C
V
DD
= 3.0 to 3.6
4
--
24
MHz
Ambient temperature
Ta
--
-
10
25
+
70
C
Input Clock Conditions
Connecting a crystal oscillator
PLLEN Pin
Input frequency
Operating frequency (f
C
)
"H" Level
6 to 12 MHz
12 to 24 MHz
"L" Level
4 to 12 MHz
4 to 12 MHz
Using an external clock supply
PLLEN Pin
Input frequency
Operating frequency (f
C
)
"H" Level
6 to 12 MHz
12 to 24 MHz
"L" Level
4 to 48 MHz
4 to 24 MHz
FEDL671000-02
1Semiconductor
ML671000
12/25
ELECTRICAL CHARACTERISTICS
DC Characteristics (1)
(V
DD
= 3.0 to 3.6 V, GND = 0 V, Ta=
-
10 to
+
70
C)
Parameter
Symbol
Condition
Min.
Typ. (*1)
Max.
Unit
H-level input voltage 1
V
IH1
--
0.76
V
DD
--
5.5
H-level input voltage 2, 3
V
IH2
--
0.76
V
DD
V
DD
+0.3
H-level input voltage 4
V
IH3
--
2.0
5.5
L-level input voltage 1, 2, 3
V
IL1
--
-
0.3
--
0.2
V
DD
L-level input voltage 4
V
IL2
--
-
0.3
0.8
H-level output voltage
V
OH
I
OH
=
-
4 mA
I
OH
=
-
100
A
2.2
V
DD
-
0.2
--
--
--
--
L-level output voltage
V
OL
I
OL
= 4 mA
--
--
0.4
V
Input leakage current
|I
LI
|
V
I
= 0/V
DD
--
--
1.0 (*2)
Output leakage current
|I
LO
|
V
O
= 0/V
DD
--
--
1.0 (*2)
H-level input current 3
I
IH
V
I
= V
DD
Pull-down resistor
50k
20
66
200
L-level input current 2
I
IL
V
I
= 0 V
Pull-up resistor
50k
-
200
-
60
-
20
A
Input pin capacitance
C
I
--
--
6
--
Output pin capacitance
C
O
--
--
9
--
I/O pin capacitance
C
IO
--
--
10
--
pF
(*3)
--
3
150
Current consumption
(in STOP mode)
I
DDS
(*4)
--
20
500
A
Current consumption
(in HALT mode)
I
DDH
--
35
50
Current consumption
(during operation)
I
DD
f
C
= 24 MHz
No load
--
70
105
mA
1. Applied to PIO7 to PIO0, nEFIQ, nEA, DBSEL, TEST, and PLLEN
2. Applied to nRST, TDI, TMS, and TCK
3. Applied to nTRST
4. Applied to XD0 to XD15
(*1): Typ. indicates values for the case where V
DD
= 3.3 V and Ta = 25
C.
(*2): 50
A when Ta is 50
C or above.
(*3): Ta =
-
10 to +50
C
(*4): Ta = +50 to +70C
FEDL671000-02
1Semiconductor
ML671000
13/25
DC Characteristics (2)
USB Port (D+, D-)
(V
DD
= 3.0 to 3.6 V, GND = 0 V, Ta = 0 to
+
70C)
Parameter
Symbol
Condition
Min.
Typ. (*1)
Max.
Unit
Differential input sensitivity
VDI
{
(D
+
)(D
-
)
}
0.2
--
Differential common mode
range
VCM
Including VDI
part
0.8
2.5
Single ended receiver threshold
VSE
--
0.8
2.0
H-level output voltage
V
OH
15k
to GND
2.8
3.6
L-level output voltage
V
OL
15k
to 3.6 V
--
0.3
V
Output leakage current
I
LO
0 V<V
IN
<V
DD
-
10
--
+
10
A
(*1): Typ. indicates values for the case where V
DD
= 3.3 V and Ta = 25
C.
AC Characteristics
Clock timing
(V
DD
= 3.0 to 3.6 V, GND = 0 V, Ta = 10 to
+
70
C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Clock frequency
f
C
4
--
24
MHz
Clock cycle time
t
C
42
--
250
Clock H-level pulse width
t
CH
15
--
--
Clock L-level pulse width
t
CL
15
--
--
ns
External clock input frequency
f
EXC
4
--
24
MHz
External clock input cycle time
t
EXC
42
--
250
External clock input H-level pulse
width
t
EXCH
15
--
--
External clock input L-level pulse
width
t
EXCL
V
DD
= 3.0 to 3.6 V
15
--
--
Clock rise time
t
R
--
--
--
5
Clock fall time
t
F
--
--
--
5
External clock input rise time
t
EXR
--
--
--
5
External clock input fall time
t
EXF
--
--
--
5
ns
FEDL671000-02
1Semiconductor
ML671000
14/25
Control signal timing
(V
DD
= 3.0 to 3.6 V, GND = 0 V, Ta = 10 to
+
70
C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
nRST pulse width (*1)
t
RSTW1
--
2 t
C
--
--
ns
nRST pulse width (*2)
t
RSTW2
--
Oscillation
stabilization
time
--
--
--
nEFIQ pulse width
t
EFIQW
--
2 t
C
--
--
nEIR pulse width
t
EIRW
--
2 t
C
--
--
TMIN pulse width
t
TMINW
--
2 t
C
--
--
TMCLK pulse width
t
TMCLKW
--
2 t
C
--
--
ns
TCX, RXC frequency
f
SC
--
--
--
1/4 f
C
MHz
TXC, RXC H-level pulse width
t
SCLKH
--
2 t
C
--
--
TXC, RXC L-level pulse width
t
SCLKL
--
2 t
C
--
--
TXD delay time
t
TXD
C
L
= 50 pF
--
--
1 t
C
+
22
RXD setup time
t
RXS
--
0.5 t
C
--
--
RXD hold time
t
RXH
--
1.5 t
C
--
--
nDREQ0, nDREQ1 setup time
t
REQS
--
1.0
--
--
nDREQ0, nDREQ1 hold time
t
REQH
--
2.6
--
--
DACK0, DACK1 delay time
t
DACKD
C
L
= 50 pF
2.4
--
15.2
ns
(1*): Not including when power is turned on and during STOP mode
(2*): When power is turned on and also during STOP mode
External bus timing
(V
DD
= 3.0 to 3.6 V, GND = 0 V, Ta = 10 to
+
70
C)
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
XA[23:1], nLB/XA0 delay time
t
XAD
0
--
12
XD[15:0] output delay time
t
XDOD
2
--
18
XD[15:0] output hold time
t
XDOH
9
--
--
XD[15:0] input setup time
t
XDIS
12
--
--
XD[15:0] input hold time
t
XDIH
0
--
--
nXWAIT setup time
t
XWAITS
0
--
--
nXWAIT hold time
t
XWAITH
0
--
--
nHB delay time
t
HBD
0
--
9
nCS[1:0] delay time
t
CSD
0
--
10
nWRE, nWRH, nWRL delay time
t
WRD
0
--
9
nRD assert delay time
t
RDD
0
--
8
nR/W assert delay time
t
R/WD
0
10
nRAS[1:0] assert delay time
t
RASD
1
--
10
nCAS assert delay time
t
CASD
1
--
10
nWE, nWH, nWL assert delay
time
t
WED
1
--
12
nBREQ setup time
t
BREQS
11
--
--
nBREQ hold time
t
BREQH
0
--
--
nBACK delay time
t
BACKD
C
L
= 50 pF
2
--
13
ns
High impedance delay time
t
XHD
3
--
12
FEDL671000-02
1Semiconductor
ML671000
15/25
TIMING DIAGRAMS
Clock Timing
CLKOUT
t
CH
t
R
t
CL
t
C
t
F
External clock Input
t
EXCH
t
EXR
t
EXCL
t
EXC
t
EXF
FEDL671000-02
1Semiconductor
ML671000
16/25
Control Signal Timing
nRST
TXD
RXD
t
RSTW1
, t
RSTW2
t
EFIQW
, t
EIRW
t
TMCLKW
TXC, RXC
nEFIQ, nEIR
TMCLK
t
TMINW
t
TMCLKW
TMIN
t
SCLKL
t
SCLKH
t
TXDH
t
RXDS
t
RXDH
FEDL671000-02
1Semiconductor
ML671000
17/25
DMA Timing
CLKOUT
nDREQ0, nDREQ1
t
REQS
t
REQH
t
DACKD
DACK0, DACK1
nXWAIT Signal Input Timing
CLKOUT
nXWAIT
t
XWAITS
t
XWAITH
FEDL671000-02
1Semiconductor
ML671000
18/25
External Bus Release Timing
CLKOUT
nBREQ
t
XWAITS
t
XWAITH
t
BACKD
nBACK
t
XHD
t
XHD
XA, XD
Control signals
t
BACKD
FEDL671000-02
1Semiconductor
ML671000
19/25
External Bus Timing
CLKOUT
XA[23:1]
nLB/XA0
t
XAD
nHB
t
CSD
nCS[1:0]
t
HBD
t
WRD
t
WRD
t
R/WD
nWRE
nWRH, nWRL
nR/W
XD
t
XDOD
t
XDOH
Write Cycle
Bank 0, 1 write cycle
FEDL671000-02
1Semiconductor
ML671000
20/25
Bank 0, 1 read cycle
CLKOUT
XA[23:1]
nLB/XA0
t
XAD
nHB
t
CSD
nCS[1:0]
t
HBD
t
RDD
t
RDD
t
R/WD
nRD
nR/W
XD
t
XDIS
t
XDIH
Read Cycle
FEDL671000-02
1Semiconductor
ML671000
21/25
CLKOUT
XA[23:1]
nLB/XA0
t
XAD
nRAS[1:0]
t
CASD
nCAS[1:0]
t
RASD
t
W ED
t
W ED
nWE
nWH, nWL
XD
nR/W
W rite Cycle
t
RASD
t
CASD
t
XDOD
t
XDOD
Bank 2, 3 write cycle
FEDL671000-02
1Semiconductor
ML671000
22/25
Bank 2, 3 read cycle
CLKOUT
XA[23:1]
nLB/XA0
t
XAD
nRAS[1:0]
t
CASD
nCAS[1:0]
t
RASD
XD
nR/W
Read Cycle
t
RASD
t
CASD
t
XDIH
t
XDIS
FEDL671000-02
1Semiconductor
ML671000
23/25
CAS before RAS (CBR) refresh
CLKOUT
t
R A SD
t
R A SD
t
C A SD
t
C A SD
nRAS
nCAS
Self-refresh
CLKOUT
t
R A SD
t
RASD
t
C A SD
t
C A SD
nRAS
nCAS
FEDL671000-02
1Semiconductor
ML671000
24/25
PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity
absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method,
temperature and times).
QFP128-P-1420-0.50-K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
5m)
Package weight (g)
1.19 TYP.
5
Rev. No./Last Revised
4/Nov. 28, 1996
(Unit: mm)
FEDL671000-02
1Semiconductor
ML671000
25/25
NOTICE
1.
The information contained herein can change without notice owing to product and/or technical
improvements. Before using the product, please make sure that the information being referred to is up-to-
date.
2.
The outline of action and examples for application circuits described herein have been chosen as an
explanation for the standard action and performance of the product. When planning to use the product, please
ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.
3.
When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.
4.
Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.
5.
Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is
granted by us in connection with the use of the product and/or the information and drawings contained herein.
No responsibility is assumed by us for any infringement of a third party's right which may result from the use
thereof.
6.
The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not authorized for use in any system or application that requires special
or enhanced quality and reliability characteristics nor in any system or application where the failure of such
system or application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.
7.
Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products
and will take appropriate and necessary steps at their own expense for these.
8.
No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2001 Oki Electric Industry Co., Ltd.