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Электронный компонент: uPD98412

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MOS INTEGRATED CIRCUIT



PD98412
1.5G ATM SWITCH LSI
Document No. S14237EJ2V0DS00 (2nd edition)
Date Published April 2000 N CP(K)
Printed in Japan
DATA SHEET
1999
DESCRIPTION
The
PD98412 (NEASCOT-X15) is an LSI integrating ATM switch functions on a single chip. It has UTOPIA
Level2 interfaces and can switch 30
30 circuits by connecting multiple PHY devices. This LSI employs a shared
buffer non-blocking type switch and realizes a switch capacity of 1.5G bps by using an externally connected SRAM
for buffering cells.
For a detailed description of the functions of the controller, refer to the following User's Manual:



PD98412 User's Manual: S14169E
FEATURES
Conforms to ATM FORUM UNI Version 3.1 & Traffic Management 4.0
Realizes all switch functions with a single chip
Non-blocking type with switch capacity of 1.5G bps
UTOPIA Level2 interface allowing you to select bit widths
(4 ports
8 bits, 2 ports
8 bits + 1 port
16 bits, 2 ports
16 bits)
Various polling modes for UTOPIA Level2 interface
Can switch 30 logical ports
Multi-speed (622M bps, 155M bps, 52M bps, 25M bps, etc.)
Microprocessor connecting port can be set for signaling processing and OAM cell processing
Supports 16K/32K/64K uni-cast VP/VC and 1K/2K/4K multi-cast VP/VC
Shared buffer architecture using standard SRAM
Cell buffer capacity: 12.8K/25.6K/51.2K cells
Supports four QOS classes (CBR, VBR, ABR, UBR)
ABR traffic control (binary mode)
Supports EPD (Early Packet Discard) and PPD (Partial Packet Discard)
+3.3-V single power source (directly connectable with +5-V TTL level signals)
Test function: Supports JTAG (IEEE 1149.1)
Remark Active low pins are indicated as
_B (symbol_B after pin names) in this document.
ORDERING INFORMATION
Part Number
Package
PD98412N7-H6
576-pin tape BGA (40
40)
The mark
shows major revised points.
Data Sheet S14237EJ2V0DS00
2



PD98412
EXAMPLE OF SYSTEM CONFIGURATION (APPLICATION)
The
PD98412 can be used to realize an ATM layer cell switching function by connecting it to a microprocessor,
SRAM for use as a cell buffer, and a header translation table (HTT)/SRAM for storing control information as shown
below.
Logical inport
Logical outport
#0 PHY
#28 PHY
#29 PHY
PHY #0
PHY #28
PHY #29
16-bit
50 MHz
8-bit
33 MHz
32-bit
+parity
92-bit
8-bit
33 MHz
UTOPIA level 2
16-bit
50 MHz
UTOPIA level 2
UTOPIA level 2
UTOPIA level 2
Micro-
processer
HTT &
control
memory
Cell buffer (Memory )
HTT: Header Translation Table
Physical
inport
#0
Physical
outport
#0
#1 #1
#2
#2
#3
#3
PD98412
NEASCOT/X15
Data Sheet S14237EJ2V0DS00
3



PD98412
BLOCK DIAGRAM
UTOPIA
receive
port 0
UTOPIA
receive
port 1
UTOPIA
receive
port 2
UTOPIA
receive
port 3
UTOPIA
transmit
port 0
UTOPIA
transmit
port 1
UTOPIA
transmit
port 2
UTOPIA
transmit
port 3
Input port interface
Output interface
Microprocessor
interface
Output
arbiter
Output
header
selector
Input
header
selector
Microprocessor
HTT & Control Memory
TEST
HTT &
Control memory
interface
Test
interface
Queue
controller
Input payload
separator
Output payload
selector
Cell Buffer Memory
Cell buffer interface
Data Sheet S14237EJ2V0DS00
4



PD98412
PIN CONFIGURATION
(1) 8-bit 12-PHY polling mode/15-PHY polling mode
JDI
JDO
JCK
JTAG
UTOPIA
Interface 3
UTOPIA
Interface 1
UTOPIA
Interface 2
UTOPIA
Interface 0
JMS
JRST_B
RXDATA3 [7:0]
TXDATA3 [7:0]
UCLK3
RXENB3_B
TXENB3_B
RXSOC3
TXSOC3
RXCLAV3
TXCLAV3
RXADDR3 [3:0]
RXDATA1 [7:0]
UCLK1
RXENB1_B
RXSOC1
RXCLAV1
RXADDR1 [3:0]
TXADDR3 [3:0]
TXDATA1 [7:0]
TXENB1_B
TXSOC1
TXCLAV1
TXADDR1 [3:0]
TXDATA2 [7:0]
TXENB2_B
TXSOC2
TXCLAV2
TXADDR2 [3:0]
TXDATA0 [7:0]
TXENB0_B
TXSOC0
TXCLAV0
TXADDR0 [3:0]
UCLK2
RXDATA2 [7:0]
RXENB2_B
RXSOC2
RXCLAV2
RXADDR2 [3:0]
UCLK0
RXDATA0 [7:0]
RXENB0_B
RXSOC0
RXCLAV0
RXADDR0 [3:0]
RDY_B
INT
HCLK
CBCS_B [1:0]
CBWE_B
CBOE_B
CBA [17:0]
CBD [91:0]
RESET_B
SWCLK
HTD [31:0]
HTP [3:0]
HTOE_B
HTWE_B
HTCS_B [1:0]
HTA [17:0]
AD [31:0]
UWE_B
R/W_B
MCS_B
IOCS_B
Cell Buffer
Interface
Control
HTT &
Control Memory
Interface
Microprocessor Interface
8
8
8
8
4
4
4
4
8
8
8
8
4
4
4
4
2
32
18
32
4
2
18 92
NEASCOT-X15
PD98412
Data Sheet S14237EJ2V0DS00
5



PD98412
(2) 16-bit multiplexed status polling mode
JDI
JDO
JCK
JTAG
UTOPIA
Interface 1
UTOPIA
Interface 0
JMS
JRST_B
RXDATA1 [15:0]
UCLK1
RXENB1_B
RXSOC1
RXCLAV1
RXADDR1 [4:0]
TXDATA1 [15:0]
TXENB1_B
TXSOC1
TXCLAV1
TXADDR1 [4:0]
TXDATA0 [15:0]
TXENB0_B
TXSOC0
TXCLAV0
TXADDR0 [4:0]
UCLK0
RXDATA0 [15:0]
RXENB0_B
RXSOC0
RXCLAV0
RXADDR0 [4:0]
RDY_B
INT
HCLK
CBCS_B [1:0]
CBWE_B
CBOE_B
CBA [17:0]
CBD [91:0]
RESET_B
SWCLK
HTD [31:0]
HTP [3:0]
HTOE_B
HTWE_B
HTCS_B [1:0]
HTA [17:0]
AD [31:0]
UWE_B
R/W_B
MCS_B
IOCS_B
Cell Buffer
Interface
Control
HTT &
Control Memory
Interface
Microprocessor Interface
16
16
5
5
16
16
5
5
2
32
18
32
4
2
18 92
NEASCOT-X15
PD98412
Data Sheet S14237EJ2V0DS00
6



PD98412
(3) 16-bit 2-group weighted polling mode
JDI
JDO
JCK
RXCLAV1A
RXADDR1A [3:0]
RXENB1A_B
RXDATA1 [15:0]
UCLK1
RXSOC1
RXCLAV1B
RXADDR1B [3:0]
RXENB1B_B
TXADDR1A [3:0]
TXCLAV1A
TXENB1A_B
TXADDR1B [3:0]
TXCLAV1B
TXENB1B_B
TXSOC1
TXDATA1 [15:0]
TXCLAV0A
TXADDR0A [3:0]
TXENB0A_B
TXDATA0 [15:0]
TXSOC0
TXCLAV0B
TXADDR0B [3:0]
TXENB0B_B
RXADDR0A [3:0]
RXCLAV0A
RXENB0A_B
RXSOC0
UCLK0
RXDATA0 [15:0]
RXADDR0B [3:0]
RXCLAV0B
RXENB0B_B
JTAG
JMS
JRST_B
RDY_B
INT
HCLK
CBCS_B [1:0]
CBWE_B
CBOE_B
CBA [17:0]
CBD [91:0]
RESET_B
SWCLK
HTD [31:0]
HTP [3:0]
HTOE_B
HTWE_B
HTCS_B [1:0]
HTA [17:0]
AD [31:0]
UWE_B
R/W_B
MCS_B
IOCS_B
Cell Buffer
Interface
Control
HTT &
Control Memory
Interface
Microprocessor Interface
2
32
18
32
4
2
18 92
NEASCOT-X15
PD98412
16
4
4
4
4
16
16
16
4
4
4
Group B
UTOPIA Interace 1
Group A
Group B
Group A
Group A
UTOPIA Interace 0
Group B
Group A
Group B
4
Data Sheet S14237EJ2V0DS00
7



PD98412
(4) 16-bit 1-group weighted polling mode
JDI
JDO
JCK
JTAG
UTOPIA
Interface 1
UTOPIA
Interface 0
JMS
JRST_B
RXDATA1 [15:0]
UCLK1
RXENB1_B
RXSOC1
RXCLAV1 [3:0]
RXADDR1 [4:0]
TXDATA1 [15:0]
TXENB1_B
TXSOC1
TXCLAV1 [3:0]
TXADDR1 [4:0]
TXDATA0 [15:0]
TXENB0_B
TXSOC0
TXCLAV0 [3:0]
TXADDR0 [4:0]
UCLK0
RXDATA0 [15:0]
RXENB0_B
RXSOC0
RXCLAV0 [3:0]
RXADDR0 [4:0]
RDY_B
INT
HCLK
CBCS_B [1:0]
CBWE_B
CBOE_B
CBA [17:0]
CBD [91:0]
RESET_B
SWCLK
HTD [31:0]
HTP [3:0]
HTOE_B
HTWE_B
HTCS_B [1:0]
HTA [17:0]
AD [31:0]
UWE_B
R/W_B
MCS_B
IOCS_B
Cell Buffer
Interface
Control
HTT &
Control Memory
Interface
Microprocessor Interface
16
16
5
5
16
16
5
5
2
32
18
32
4
2
18 92
NEASCOT-X15
PD98412
Data Sheet S14237EJ2V0DS00
8



PD98412
PIN CONFIGURATION (BOTTOM VIEW)
576-pin tape BGA (40



40)



PD98412N7-H6
59
171
198
275
300
371
394
459
480
539
30
144
250
348
438
520
558
88
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
09
08
07
06
05
04
03
02
01
AK AJ AH AG AF AE AD AC AB AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
117 116
225 224
325 324
417 416
501
576
500
1
Index area
Note
Note The index area is shown in Top View.
Data Sheet S14237EJ2V0DS00
9



PD98412
PIN NAME
1.
Power
4.
JTAG
V
DD
: Supply Voltage
JDI
: JTAG Data Input
GND
: Ground
JDO
: JTAG Data Output
JCK
: JTAG Data Clock
2.
Memory Interface
JMS
: JTAG Mode Select
HTA17 - HTA0
: HTT Memory Address
JRST_B
: JTAG Reset
HTD31 - HTD0
: HTT Memory Data Bus
HTP3 - HTP0
: HTT Memory Data Bus Parity
5.
Other
HTCS1_B, HTCS0_B : HTT Memory Chip Select
SWCLK
: System Clock
HTWE_B
: HTT Memory Write Enable
RESET_B
: Hardware Reset
HTOE_B
: HTT Memory Output Enable
IC
: Internal Connected
CBA17 - CBA0
: Cell Buffer Memory Address
CG
: Connect Ground
CBD91 - CBD0
: Cell Buffer Memory Data Bus
PU
: Pull-up
CBCS1_B, CBCS0_B : Cell Buffer Memory Chip Select
CBWE_B
: Cell Buffer Memory Write Enable
CBOE_B
: Cell Buffer Memory Output Enable
3.
CPU Interface
IOCS_B
: I/O Chip Select
MCS_B
: Memory Chip Select
RDY_B
: I/O Ready, Memory Ready
INT
: Interrupt Request
HCLK
: Host Clock
AD31 - AD00 : Address and Data
R/W_B
: Read/Write
UWE_B
: Upper Word Enable
Data Sheet S14237EJ2V0DS00
10



PD98412
6.
UTOPIA
(1) 8-bit 12-PHY Polling Mode/15-PHY Polling Mode
UCLK0
: UTOPIA Clock
RXADDR33-RXADDR30
: Receive Address
RXADDR03-RXADDR00
: Receive Address
RXDATA307-RXDATA300 : Receive Data Bus
RXDATA007-RXDATA000 : Receive Data Bus
RXSOC3
: Receive Start of Cell
RXSOC0
: Receive Start of Cell
RXENB3_B
: Receive Enable Data
RXENB0_B
: Receive Enable Data
Transfers
Transfers
RXCLAV3
: Receive Cell Buffer
RXCLAV0
: Receive Cell Buffer
Available
Available
TXADDR33-TXADDR30
: Transmit Address
TXADDR03-TXADDR00
: Transmit Address
TXDATA307-TXDATA300 : Transmit Data Bus
TXDATA007-TXDATA000 : Transmit Data Bus
TXSOC3
: Transmit Start of Cell
TXSOC0
: Transmit Start of Cell
TXENB3_B
: Transmit Enable Data
TXENB0_B
: Transmit Enable Data
Transfers
Transfers
TXCLAV3
: Transmit Cell Buffer
TXCLAV0
: Transmit Cell Buffer
Available
Available
UCLK1
: UTOPIA Clock
(2) 16-bit Multiplexed Status Polling Mode
RXADDR13-RXADDR10
: Receive Address
UCLK0
: UTOPIA Clock
RXDATA107-RXDATA100 : Receive Data Bus
RXADDR04-RXADDR00
: Receive Address
RXSOC1
: Receive Start of Cell
RXDATA015-RXDATA000 : Receive Data Bus
RXENB1_B
: Receive Enable Data
RXSOC0
: Receive Start of Cell
Transfers
RXENB0_B
: Receive Enable Data
RXCLAV1
: Receive Cell Buffer
Transfers
Available
RXCLAV0[3]-RXCLAV0[0] : Receive Cell Buffer
TXADDR13-TXADDR10
: Transmit Address
Available
TXDATA107-TXDATA100 : Transmit Data Bus
TXADDR04-TXADDR00
: Transmit Address
TXSOC1
: Transmit Start of Cell
TXDATA015-TXDATA000 : Transmit Data Bus
TXENB1_B
: Transmit Enable Data
TXSOC0
: Transmit Start of Cell
Transfers
TXENB0_B
: Transmit Enable Data
TXCLAV1
: Transmit Cell Buffer
Transfers
Available
TXCLAV0[3]-TXCLAV0[0] : Transmit Cell Buffer
UCLK2
: UTOPIA Clock
Available
RXADDR23-RXADDR20
: Receive Address
UCLK1
: UTOPIA Clock
RXDATA207-RXDATA200 : Receive Data Bus
RXADDR14-RXADDR10
: Receive Address
RXSOC2
: Receive Start of Cell
RXDATA115-RXDATA100 : Receive Data Bus
RXENB2_B
: Receive Enable Data
RXSOC1
: Receive Start of Cell
Transfers
RXENB1_B
: Receive Enable Data
RXCLAV2
: Receive Cell Buffer
Transfers
Available
RXCLAV1[3]-RXCLAV1[0] : Receive Cell Buffer
TXADDR23-TXADDR20
: Transmit Address
Available
TXDATA207-TXDATA200 : Transmit Data Bus
TXADDR14-TXADDR10
: Transmit Address
TXSOC2
: Transmit Start of Cell
TXDATA115-TXDATA100 : Transmit Data Bus
TXENB2_B
: Transmit Enable Data
TXSOC1
: Transmit Start of Cell
Transfers
TXENB1_B
: Transmit Enable Data
TXCLAV2
: Transmit Cell Buffer
TXCLAV1[3]-TXCLAV1[0] : Transmit Cell Buffer
Available
Available
UCLK3
: UTOPIA Clock
Data Sheet S14237EJ2V0DS00
11



PD98412
(3) 16-bit 2-Group Weighted Polling Mode
(4) 16-bit 1-Group Weighted Polling Mode
UCLK0
: UTOPIA Clock
UCLK0
: UTOPIA Clock
RXADDR0A3-RXADDR0A0 : Receive Address
RXADDR04-RXADDR00
: Receive Address
RXADDR0B3-RXADDR0B0 : Receive Address
RXDATA015-RXDATA000 : Receive Data Bus
RXDATA015-RXDATA000 : Receive Data Bus
RXSOC0
: Receive Start of Cell
RXSOC0
: Receive Start of Cell
RXENB0_B
: Receive Enable Data
RXENB0A_B, RXENB0B_B : Receive Enable Data
Transfers
Transfers
RXCLAV0
: Receive Cell Buffer
RXCLAV0A, RXCLAV0B
: Receive Cell Buffer
Available
Available
TXADDR04-TXADDR00
: Transmit Address
TXADDR0A3-TXADDR0A0 : Transmit Address
TXDATA015-TXDATA000 : Transmit Data Bus
TXADDR0B3-TXADDR0B0 : Transmit Address
TXSOC0
: Transmit Start of Cell
TXDATA015-TXDATA000
: Transmit Data Bus
TXENB0_B
: Transmit Enable Data
TXSOC0
: Transmit Start of Cell
Transfers
TXENB0A_B, TXENB0B_B : Transmit Enable Data
TXCLAV0
: Transmit Cell Buffer
Transfers
Available
TXCLAV0A, TXCLAV0B
: Transmit Cell Buffer
UCLK1
: UTOPIA Clock
Available
RXADDR14-RXADDR10
: Receive Address
UCLK1
: UTOPIA Clock
RXDATA115-RXDATA100 : Receive Data Bus
RXADDR1A3-RXADDR1A0 : Receive Address
RXSOC1
: Receive Start of Cell
RXADDR1B3-RXADDR1B0 : Receive Address
RXENB1_B
: Receive Enable Data
RXDATA115-RXDATA100 : Receive Data Bus
Transfers
RXSOC1
: Receive Start of Cell
RXCLAV1
: Receive Cell Buffer
RXENB1A_B, RXENB1B_B : Receive Enable Data
Available
Transfers
TXADDR14-TXADDR10
: Transmit Address
RXCLAV1A, RXCLAV1B
: Receive Cell Buffer
TXDATA115-TXDATA100 : Transmit Data Bus
Available
TXSOC1
: Transmit Start of Cell
TXADDR1A3-TXADDR1A0 : Transmit Address
TXENB1_B
: Transmit Enable Data
TXADDR1B3-TXADDR1B0 : Transmit Address
Transfers
TXDATA115-TXDATA100
: Transmit Data Bus
TXCLAV1
: Transmit Cell Buffer
TXSOC1
: Transmit Start of Cell
Available
TXENB1A_B, TXENB1B_B : Transmit Enable Data
Transfers
TXCLAV1A, TXCLAV1B
: Transmit Cell Buffer
Available
Data Sheet S14237EJ2V0DS00
12



PD98412
PIN LAYOUT
(1/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
1
A01
AD30
I/O
2
B01
GND
3
C01
AD24
I/O
4
D01
AD20
I/O
5
E01
AD16
I/O
6
F01
GND
7
G01
AD10
I/O
8
H01
AD06
I/O
9
J01
GND
10
K01
AD01
I/O
11
L01
HTA17
O
12
M01
HTA13
O
13
N01
HTA09
O
14
P01
GND
15
R01
HTA06
O
16
T01
HTA02
O
17
U01
HTCS0_B
O
18
V01
HTD31
I/O
19
W01
HTD29
I/O
20
Y01
V
DD
21
AA01
HTD24
I/O
22
AB01
HTD21
I/O
23
AC01
HTD17
I/O
24
AD01
HTP1
I/O
25
AE01
V
DD
26
AF01
GND
27
AG01
HTD06
I/O
28
AH01
HTD05
I/O
29
AJ01
HTD01
I/O
30
AK01
PU
I
31
AK02
V
DD
32
AK03
GND
33
AK04
JCK
I
34
AK05
RXDATA307
RXDATA115
RXDATA115
RXDATA115
I
35
AK06
V
DD
36
AK07
RXDATA301
RXDATA109
RXDATA109
RXDATA109
I
37
AK08
GND
38
AK09
RXCLAV3
RXCLAV1[2]
RXCLAV1B
CG
I
39
AK10
V
DD
40
AK11
TXADDR33
IC
TXADDR1B3
IC
O
Data Sheet S14237EJ2V0DS00
13



PD98412
(2/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
41
AK12
CG
TXCLAV1[3]
CG
CG
I
42
AK13
TXDATA307
TXDATA115
TXDATA115
TXDATA115
O
43
AK14
V
DD
44
AK15
TXDATA304
TXDATA112
TXDATA112
TXDATA112
O
45
AK16
TXDATA300
TXDATA108
TXDATA108
TXDATA108
O
46
AK17
RXDATA104
RXDATA104
RXDATA104
RXDATA104
I
47
AK18
RXDATA100
RXDATA100
RXDATA100
RXDATA100
I
48
AK19
UCLK1
UCLK1
UCLK1
UCLK1
I
49
AK20
RXCLAV1
RXCLAV1[0]
RXCLAV1A
RXCLAV1
I
50
AK21
RXADDR12
RXADDR12
RXADDR1A2
RXADDR12
O
51
AK22
TXADDR12
TXADDR12
TXADDR1A2
TXADDR12
O
52
AK23
TXCLAV1
TXCLAV1[0]
TXCLAV1A
TXCLAV1
I
53
AK24
TXDATA107
TXDATA107
TXDATA107
TXDATA107
O
54
AK25
TXDATA103
TXDATA103
TXDATA103
TXDATA103
O
55
AK26
CBD87
I/O
56
AK27
CBD84
I/O
57
AK28
V
DD
58
AK29
GND
59
AK30
CBD77
I/O
60
AJ30
GND
61
AH30
V
DD
62
AG30
CBD68
I/O
63
AF30
CBD64
I/O
64
AE30
V
DD
65
AD30
CBD58
I/O
66
AC30
CBD54
I/O
67
AB30
V
DD
68
AA30
CBD49
I/O
69
Y30
CBD47
I/O
70
W30
CBCS1_B
O
71
V30
CBA17
O
72
U30
V
DD
73
T30
CBA14
O
74
R30
CBA10
O
75
P30
CBA06
O
76
N30
CBA02
O
77
M30
CBA00
O
78
L30
V
DD
79
K30
CBD39
I/O
80
J30
CBD35
I/O
Data Sheet S14237EJ2V0DS00
14



PD98412
(3/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
81
H30
V
DD
82
G30
CBD29
I/O
83
F30
CBD25
I/O
84
E30
GND
85
D30
CBD18
I/O
86
C30
V
DD
87
B30
V
DD
88
A30
CBD11
I/O
89
A29
V
DD
90
A28
CBD05
I/O
91
A27
CBD01
I/O
92
A26
RXDATA005
RXDATA005
RXDATA005
RXDATA005
I
93
A25
RXDATA003
RXDATA003
RXDATA003
RXDATA003
I
94
A24
V
DD
95
A23
RXCLAV0
RXCLAV0[0]
RXCLAV0A
RXCLAV0
I
96
A22
V
DD
97
A21
TXADDR03
TXADDR03
TXADDR03
TXADDR03
O
98
A20
TXADDR01
TXADDR01
TXADDR01
TXADDR01
O
99
A19
TXSOC0
TXSOC0
TXSOC0
TXSOC0
O
100
A18
TXDATA005
TXDATA005
TXDATA005
TXDATA005
O
101
A17
GND
102
A16
TXDATA001
TXDATA001
TXDATA001
TXDATA001
O
103
A15
RXDATA205
RXDATA013
RXDATA013
RXDATA013
I
104
A14
RXDATA201
RXDATA009
RXDATA009
RXDATA009
I
105
A13
RXENB2_B
IC
RXENB0B_B
IC
O
106
A12
RXCLAV2
RXCLAV0[2]
RXCLAV0B
CG
I
107
A11
RXADDR21
IC
RXADDR0B1
IC
O
108
A10
TXADDR22
IC
TXADDR0B2
IC
O
109
A09
TXCLAV2
TXCLAV0[2]
TXCLAV0B
CG
I
110
A08
GND
111
A07
TXDATA203
TXDATA011
TXDATA011
TXDATA011
O
112
A06
V
DD
113
A05
GND
114
A04
R/W_B
I
115
A03
UWE_B
I
116
A02
CG
I
117
B02
AD29
I/O
118
C02
AD27
I/O
119
D02
V
DD
120
E02
AD19
I/O
Data Sheet S14237EJ2V0DS00
15



PD98412
(4/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
121
F02
AD15
I/O
122
G02
AD11
I/O
123
H02
AD09
I/O
124
J02
AD05
I/O
125
K02
AD04
I/O
126
L02
AD00
I/O
127
M02
HTA14
O
128
N02
HTA10
O
129
P02
V
DD
130
R02
HTA05
O
131
T02
HTA01
O
132
U02
HTWE_B
O
133
V02
HTD30
I/O
134
W02
HTD26
I/O
135
Y02
HTD25
I/O
136
AA02
HTD22
I/O
137
AB02
HTD20
I/O
138
AC02
HTD16
I/O
139
AD02
HTD13
I/O
140
AE02
HTD10
I/O
141
AF02
HTD07
I/O
142
AG02
HTD02
I/O
143
AH02
GND
144
AJ02
GND
145
AJ03
CBD91
I/O
146
AJ04
JDO
O
147
AJ05
V
DD
148
AJ06
RXDATA306
RXDATA114
RXDATA114
RXDATA114
I
149
AJ07
RXDATA302
RXDATA110
RXDATA110
RXDATA110
I
150
AJ08
RXDATA300
RXDATA108
RXDATA108
RXDATA108
I
151
AJ09
RXENB3_B
IC
RXENB1B_B
IC
O
152
AJ10
V
DD
153
AJ11
RXADDR30
RXADDR14
RXADDR1B0
RXADDR14
O
154
AJ12
TXADDR30
TXADDR14
TXADDR1B0
TXADDR14
O
155
AJ13
TXENB3_B
IC
TXENB1B_B
IC
O
156
AJ14
GND
157
AJ15
TXDATA303
TXDATA111
TXDATA111
TXDATA111
O
158
AJ16
RXDATA107
RXDATA107
RXDATA107
RXDATA107
I
159
AJ17
RXDATA103
RXDATA103
RXDATA103
RXDATA103
I
160
AJ18
V
DD
Data Sheet S14237EJ2V0DS00
16



PD98412
(5/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
161
AJ19
V
DD
162
AJ20
GND
163
AJ21
TXADDR13
TXADDR13
TXADDR1A3
TXADDR13
O
164
AJ22
TXADDR10
TXADDR10
TXADDR1A0
TXADDR10
O
165
AJ23
TXENB1_B
TXENB1_B
TXENB1A_B
TXENB1_B
O
166
AJ24
TXDATA104
TXDATA104
TXDATA104
TXDATA104
O
167
AJ25
TXDATA101
TXDATA101
TXDATA101
TXDATA101
O
168
AJ26
CBD85
I/O
169
AJ27
V
DD
170
AJ28
CBD80
I/O
171
AJ29
CBD76
I/O
172
AH29
CBD74
I/O
173
AG29
GND
174
AF29
CBD67
I/O
175
AE29
CBD63
I/O
176
AD29
CBD59
I/O
177
AC29
CBD57
I/O
178
AB29
CBD53
I/O
179
AA29
CBD52
I/O
180
Y29
CBD48
I/O
181
W29
CBD44
I/O
182
V29
CBOE_B
O
183
U29
GND
184
T29
CBA13
O
185
R29
CBA09
O
186
P29
CBA05
O
187
N29
CBA01
O
188
M29
CBD41
I/O
189
L29
CBD40
I/O
190
K29
CBD36
I/O
191
J29
CBD34
I/O
192
H29
CBD30
I/O
193
G29
CBD26
I/O
194
F29
CBD23
I/O
195
E29
CBD19
I/O
196
D29
GND
197
C29
CBD14
I/O
198
B29
CBD10
I/O
199
B28
CBD08
I/O
200
B27
CBD02
I/O
Data Sheet S14237EJ2V0DS00
17



PD98412
(6/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
201
B26
CBD00
I/O
202
B25
RXDATA004
RXDATA004
RXDATA004
RXDATA004
I
203
B24
RXDATA000
RXDATA000
RXDATA000
RXDATA000
I
204
B23
RXENB0_B
RXENB0_B
RXENB0A_B
RXENB0_B
O
205
B22
RXADDR03
RXADDR03
RXADDR0A3
RXADDR03
O
206
B21
RXADDR02
RXADDR02
RXADDR0A2
RXADDR02
O
207
B20
TXADDR02
TXADDR02
TXADDR0A2
TXADDR02
O
208
B19
TXCLAV0
TXCLAV0[0]
TXCLAV0A
TXCLAV0
I
209
B18
TXDATA006
TXDATA006
TXDATA006
TXDATA006
O
210
B17
TXDATA002
TXDATA002
TXDATA002
TXDATA002
O
211
B16
TXDATA000
TXDATA000
TXDATA000
TXDATA000
O
212
B15
RXDATA204
RXDATA012
RXDATA012
RXDATA012
I
213
B14
RXDATA200
RXDATA008
RXDATA008
RXDATA008
I
214
B13
RXSOC2
RXLLAV0[3]
CG
CG
I
215
B12
GND
216
B11
TXADDR23
IC
TXADDR0B3
IC
O
217
B10
CG
TXCLAV0[3]
CG
CG
I
218
B09
TXENB2_B
IC
TXENB0B_B
IC
O
219
B08
TXDATA204
TXDATA012
TXDATA012
TXDATA012
O
220
B07
TXDATA200
TXDATA008
TXDATA008
TXDATA008
O
221
B06
IOCS_B
I
222
B05
CG
I
223
B04
CG
I
224
B03
IC
O
225
C03
AD28
I/O
226
D03
AD26
I/O
227
E03
AD22
I/O
228
F03
AD18
I/O
229
G03
AD14
I/O
230
H03
V
DD
231
J03
AD08
I/O
232
K03
V
DD
233
L03
GND
234
M03
HTA15
O
235
N03
HTA11
O
236
P03
HTA07
O
237
R03
HTA03
O
238
T03
HTA00
O
239
U03
HTOE_B
O
240
V03
V
DD
Data Sheet S14237EJ2V0DS00
18



PD98412
(7/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
241
W03
GND
242
Y03
HTD23
I/O
243
AA03
V
DD
244
AB03
GND
245
AC03
HTD14
I/O
246
AD03
HTD11
I/O
247
AE03
HTP0
I/O
248
AF03
HTD03
I/O
249
AG03
HTD00
I/O
250
AH03
IC
O
251
AH04
CBD90
I/O
252
AH05
JDI
I
253
AH06
JMS
I
254
AH07
RXDATA305
RXDATA113
RXDATA113
RXDATA113
I
255
AH08
GND
256
AH09
GND
257
AH10
RXSOC3
RXCLAV1[3]
CG
CG
I
258
AH11
RXADDR31
IC
RXADDR1B1
IC
O
259
AH12
TXADDR31
IC
TXADDR1B1
IC
O
260
AH13
TXSOC3
IC
IC
IC
O
261
AH14
TXDATA305
TXDATA113
TXDATA113
TXDATA113
O
262
AH15
TXDATA301
TXDATA109
TXDATA109
TXDATA109
O
263
AH16
RXDATA106
RXDATA106
RXDATA106
RXDATA106
I
264
AH17
RXDATA102
RXDATA102
RXDATA102
RXDATA102
I
265
AH18
GND
266
AH19
RXADDR13
RXADDR13
RXADDR1A3
RXADDR13
O
267
AH20
RXADDR10
RXADDR10
RXADDR1A0
RXADDR10
O
268
AH21
TXADDR11
TXADDR11
TXADDR1A1
TXADDR11
O
269
AH22
TXSOC1
TXSOC1
TXSOC1
TXSOC1
O
270
AH23
TXDATA105
TXDATA105
TXDATA105
TXDATA105
O
271
AH24
TXDATA102
TXDATA102
TXDATA102
TXDATA102
O
272
AH25
CBD86
I/O
273
AH26
CBD81
I/O
274
AH27
CBD79
I/O
275
AH28
CBD75
I/O
276
AG28
CBD73
I/O
277
AF28
CBD69
I/O
278
AE28
CBD66
I/O
279
AD28
CBD62
I/O
280
AC28
GND
Data Sheet S14237EJ2V0DS00
19



PD98412
(8/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
281
AB28
CBD56
I/O
282
AA28
GND
283
Y28
V
DD
284
W28
CBD45
I/O
285
V28
CBWE_B
O
286
U28
CBA15
O
287
T28
CBA11
O
288
R28
CBA08
O
289
P28
CBA04
O
290
N28
V
DD
291
M28
GND
292
L28
CBD37
I/O
293
K28
V
DD
294
J28
CBD31
I/O
295
H28
CBD27
I/O
296
G28
CBD24
I/O
297
F28
CBD20
I/O
298
E28
CBD15
I/O
299
D28
CBD13
I/O
300
C28
CBD09
I/O
301
C27
CBD07
I/O
302
C26
CBD03
I/O
303
C25
RXDATA007
RXDATA007
RXDATA007
RXDATA007
I
304
C24
GND
305
C23
GND
306
C22
RXSOC0
RXSOC0
RXSOC0
RXSOC0
I
307
C21
GND
308
C20
V
DD
309
C19
CG
TXCLAV0[1]
CG
CG
I
310
C18
TXDATA007
TXDATA007
TXDATA007
TXDATA007
O
311
C17
TXDATA003
TXDATA003
TXDATA003
TXDATA003
O
312
C16
RXDATA206
RXDATA014
RXDATA014
RXDATA014
I
313
C15
GND
314
C14
GND
315
C13
V
DD
316
C12
RXADDR20
RXADDR04
RXADDR0B0
RXADDR04
O
317
C11
TXADDR20
TXADDR04
TXADDR0B0
TXADDR04
O
318
C10
TXSOC2
IC
IC
IC
O
319
C09
TXDATA205
TXDATA013
TXDATA013
TXDATA013
O
320
C08
TXDATA201
TXDATA009
TXDATA009
TXDATA009
O
Data Sheet S14237EJ2V0DS00
20



PD98412
(9/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
321
C07
CG
I
322
C06
RDY_B
O
323
C05
GND
324
C04
V
DD
325
D04
V
DD
326
E04
AD25
I/O
327
F04
GND
328
G04
AD17
I/O
329
H04
V
DD
330
J04
GND
331
K04
AD07
I/O
332
L04
V
DD
333
M04
HTA16
O
334
N04
HTA12
O
335
P04
HTA08
O
336
R04
HTA04
O
337
T04
V
DD
338
U04
HTP3
I/O
339
V04
GND
340
W04
HTP2
I/O
341
Y04
GND
342
AA04
V
DD
343
AB04
HTD15
I/O
344
AC04
HTD12
I/O
345
AD04
HTD08
I/O
346
AE04
HTD04
I/O
347
AF04
RESET_B
I
348
AG04
IC
O
349
AG05
CBD89
I/O
350
AG06
IC
351
AG07
JRST_B
I
352
AG08
GND
353
AG09
V
DD
354
AG10
UCLK3
CG
CG
CG
I
355
AG11
RXADDR32
IC
RXADDR1B2
IC
O
356
AG12
TXADDR32
IC
TXADDR1B2
IC
O
357
AG13
TXCLAV3
TXCLAV1[2]
TXCLAV1B
CG
I
358
AG14
TXDATA306
TXDATA114
TXDATA114
TXDATA114
O
359
AG15
TXDATA302
TXDATA110
TXDATA110
TXDATA110
O
360
AG16
V
DD
Data Sheet S14237EJ2V0DS00
21



PD98412
(10/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
361
AG17
RXDATA101
RXDATA101
RXDATA101
RXDATA101
I
362
AG18
RXENB1_B
RXENB1_B
RXENB1A_B
RXENB1_B
O
363
AG19
RXADDR11
RXADDR11
RXADDR1A1
RXADDR11
O
364
AG20
GND
365
AG21
GND
366
AG22
TXDATA106
TXDATA106
TXDATA106
TXDATA106
O
367
AG23
GND
368
AG24
GND
369
AG25
CBD82
I/O
370
AG26
GND
371
AG27
V
DD
372
AF27
CBD72
I/O
373
AE27
CBD70
I/O
374
AD27
CBD65
I/O
375
AC27
GND
376
AB27
V
DD
377
AA27
CBD55
I/O
378
Y27
GND
379
W27
CBD46
I/O
380
V27
CBCS0_B
O
381
U27
CBA16
O
382
T27
CBA12
O
383
R27
V
DD
384
P27
CBA03
O
385
N27
GND
386
M27
CBD38
I/O
387
L27
GND
388
K27
GND
389
J27
CBD28
I/O
390
H27
GND
391
G27
CBD21
I/O
392
F27
CBD16
I/O
393
E27
V
DD
394
D27
GND
395
D26
CBD06
I/O
396
D25
GND
397
D24
RXDATA006
RXDATA006
RXDATA006
RXDATA006
I
398
D23
V
DD
399
D22
UCLK0
UCLK0
UCLK0
UCLK0
I
400
D21
CG
RXCLAV0[1]
CG
CG
I
Data Sheet S14237EJ2V0DS00
22



PD98412
(11/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
401
D20
GND
402
D19
TXADDR00
TXADDR00
TXADDR0A0
TXADDR00
O
403
D18
TXENB0_B
TXENB0_B
TXENB0A_B
TXENB0_B
O
404
D17
TXDATA004
TXDATA004
TXDATA004
TXDATA004
O
405
D16
RXDATA207
RXDATA015
RXDATA015
RXDATA015
I
406
D15
V
DD
407
D14
UCLK2
CG
CG
CG
I
408
D13
RXADDR23
IC
RXADDR0B3
IC
O
409
D12
TXADDR21
IC
TXADDR0B1
IC
O
410
D11
GND
411
D10
TXDATA206
TXDATA014
TXDATA014
TXDATA014
O
412
D09
TXDATA202
TXDATA010
TXDATA010
TXDATA010
O
413
D08
GND
414
D07
INT
O
415
D06
CG
I
416
D05
AD31
I/O
417
E05
V
DD
418
F05
V
DD
419
G05
AD21
I/O
420
H05
V
DD
421
J05
AD12
I/O
422
K05
V
DD
423
L05
AD02
I/O
424
M05
V
DD
425
N05
GND
426
P05
V
DD
427
R05
V
DD
428
T05
HTCS1_B
O
429
U05
V
DD
430
V05
HTD28
I/O
431
W05
V
DD
432
Y05
HTD19
I/O
433
AA05
V
DD
434
AB05
GND
435
AC05
V
DD
436
AD05
V
DD
437
AE05
SWCLK
I
438
AF05
V
DD
439
AF06
CBD88
I/O
440
AF07
GND
Data Sheet S14237EJ2V0DS00
23



PD98412
(12/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
441
AF08
V
DD
442
AF09
RXDATA303
RXDATA111
RXDATA111
RXDATA111
I
443
AF10
V
DD
444
AF11
GND
445
AF12
V
DD
446
AF13
V
DD
447
AF14
V
DD
448
AF15
V
DD
449
AF16
RXDATA105
RXDATA105
RXDATA105
RXDATA105
I
450
AF17
V
DD
451
AF18
RXSOC1
RXSOC1
RXSOC1
RXSOC1
I
452
AF19
V
DD
453
AF20
V
DD
454
AF21
V
DD
455
AF22
V
DD
456
AF23
V
DD
457
AF24
CBD83
I/O
458
AF25
V
DD
459
AF26
V
DD
460
AE26
GND
461
AD26
V
DD
462
AC26
V
DD
463
AB26
CBD60
I/O
464
AA26
V
DD
465
Y26
CBD50
I/O
466
W26
V
DD
467
V26
V
DD
468
U26
V
DD
469
T26
V
DD
470
R26
CBA07
O
471
P26
V
DD
472
N26
CBD43
I/O
473
M26
V
DD
474
L26
CBD33
I/O
475
K26
V
DD
476
J26
V
DD
477
H26
V
DD
478
G26
CBD17
I/O
479
F26
GND
480
E26
V
DD
Data Sheet S14237EJ2V0DS00
24



PD98412
(13/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
481
E25
V
DD
482
E24
V
DD
483
E23
V
DD
484
E22
RXDATA001
RXDATA001
RXDATA001
RXDATA001
I
485
E21
V
DD
486
E20
RXADDR00
RXADDR00
RXADDR0A0
RXADDR00
O
487
E19
V
DD
488
E18
V
DD
489
E17
V
DD
490
E16
V
DD
491
E15
RXDATA202
RXDATA010
RXDATA010
RXDATA010
I
492
E14
V
DD
493
E13
RXADDR22
IC
RXADDR0B2
IC
O
494
E12
V
DD
495
E11
V
DD
496
E10
V
DD
497
E09
HCLK
I
498
E08
V
DD
499
E07
V
DD
500
E06
IC
501
F06
GND
502
G06
AD23
I/O
503
H06
GND
504
J06
AD13
I/O
505
K06
GND
506
L06
AD03
I/O
507
M06
GND
508
N06
V
DD
509
P06
GND
510
R06
GND
511
T06
GND
512
U06
GND
513
V06
HTD27
I/O
514
W06
GND
515
Y06
HTD18
I/O
516
AA06
GND
517
AB06
HTD09
I/O
518
AC06
GND
519
AD06
V
DD
520
AE06
GND
Data Sheet S14237EJ2V0DS00
25



PD98412
(14/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
521
AE07
V
DD
522
AE08
GND
523
AE09
RXDATA304
RXDATA112
RXDATA112
RXDATA112
I
524
AE10
GND
525
AE11
RXADDR33
IC
RXADDR1B3
IC
O
526
AE12
GND
527
AE13
GND
528
AE14
GND
529
AE15
GND
530
AE16
GND
531
AE17
GND
532
AE18
CG
RXCLAV1[1]
CG
CG
I
533
AE19
GND
534
AE20
CG
TXCLAV1[1]
CG
CG
I
535
AE21
GND
536
AE22
TXDATA100
TXDATA100
TXDATA100
TXDATA100
O
537
AE23
GND
538
AE24
CBD78
I/O
539
AE25
GND
540
AD25
CBD71
I/O
541
AC25
GND
542
AB25
CBD61
I/O
543
AA25
GND
544
Y25
CBD51
I/O
545
W25
GND
546
V25
GND
547
U25
GND
548
T25
GND
549
R25
GND
550
P25
GND
551
N25
CBD42
I/O
552
M25
GND
553
L25
CBD32
I/O
554
K25
GND
555
J25
CBD22
I/O
556
H25
GND
557
G25
CBD12
I/O
558
F25
GND
559
F24
CBD04
I/O
560
F23
GND
Data Sheet S14237EJ2V0DS00
26



PD98412
(15/15)
Pin No.
Address
12-PHY Polling Mode/
15-PHY Polling Mode
Multiplexed Status
Polling Mode
2-Group Weighted
Polling Mode
1-Group Weighted
Polling Mode
I/O
561
F22
RXDATA002
RXDATA002
RXDATA002
RXDATA002
I
562
F21
GND
563
F20
RXADDR01
RXADDR01
RXADDR0A1
RXADDR01
O
564
F19
GND
565
F18
GND
566
F17
GND
567
F16
GND
568
F15
RXDATA203
RXDATA011
RXDATA011
RXDATA011
I
569
F14
GND
570
F13
V
DD
571
F12
GND
572
F11
TXDATA207
TXDATA015
TXDATA015
TXDATA015
O
573
F10
GND
574
F09
MCS_B
I
575
F08
GND
576
F07
GND
Data Sheet S14237EJ2V0DS00
27



PD98412
CONTENTS
1. PIN FUNCTIONS ........................................................................................................................... 28
1.1 Power Supply ........................................................................................................................ 28
1.2 UTOPIA Interface .................................................................................................................. 29
1.3 Memory Interface Signals .................................................................................................... 41
1.4 Microprocessor Interface Signals ....................................................................................... 42
1.5 JTAG ...................................................................................................................................... 43
1.6 Others .................................................................................................................................... 43
1.7 Recommended Connections of Unused Pins.................................................................... 44
1.8 Pin Status at Reset ............................................................................................................... 45
2. ELECTRICAL SPECIFICATIONS ................................................................................................. 46
3. PACKAGE DRAWING .................................................................................................................. 60
4. RECOMMENDED SOLDERING CONDITIONS........................................................................... 61
Data Sheet S14237EJ2V0DS00
28



PD98412
1. PIN FUNCTIONS
Although the
PD98412 is a device operating at 3.3 V, it can be directly connected to a PHY device, CPU, and
memory with a 5-V TTL interface.
1.1 Power Supply
Table 1-1. Power Supply
Pin Name
Pin No.
I/O
Function
V
DD
20, 25, 31, 35, 39, 43, 57, 61, 64, 67, 72, 78, 81, 86, 87, 89, 94, 96,
112, 119, 129, 147, 152, 160, 161, 169, 230, 232, 240, 243, 283, 290,
293, 308, 315, 324, 325, 329, 332, 337, 342, 353, 360, 371, 376, 383,
393, 398, 406, 417, 418, 420, 422, 424, 426, 427, 429, 431, 433, 435,
436, 438, 441, 443, 445 - 448, 450, 452 - 456, 458, 459, 461, 462, 464,
466 - 469, 471, 473, 475 - 477, 480 - 483, 485, 487 - 490, 492, 494 -
496, 498, 499, 508, 519, 521, 570
--
These pins supply a
power of +3.3 V
5%.
GND
2, 6, 9, 14, 26, 32, 37, 58, 60, 84, 101, 110, 113, 143, 144, 156, 162,
173, 183, 196, 215, 233, 241, 244, 255, 256, 265, 280, 282, 291, 304,
305, 307, 313, 314, 323, 327, 330, 339, 341, 352, 364, 365, 367, 368,
370, 375, 378, 385, 387, 388, 390, 394, 396, 401, 410, 413, 425, 434,
440, 444, 460, 479, 501, 503, 505, 507, 509 - 512, 514, 516, 518, 520,
522, 524, 526 - 531, 533, 535, 537, 539, 541, 543, 545 - 550, 552, 554,
556, 558, 560, 562, 564 - 567, 569, 571, 573, 575, 576
--
These are ground
pins.
Data Sheet S14237EJ2V0DS00
29



PD98412
1.2 UTOPIA Interface
The
PD98412 employs a UTOPIA Level2 (cell level transfer) interface between PHY layer and ATM layer.
Symbol, pim number, and function are varied depending on the polling mode.
(1) 8-bit 12-PHY polling mode/15-PHY polling mode
Table 1-2. Receive Interface Signals (1/2)
Symbol
Pin No.
I/O
Function
RXADDR03 -
RXADDR00
205, 206, 563, 486
O
Multi-PHY select address of receive interface 0.
RXADDR03 is the MSB.
RXDATA007 -
RXDATA000
303, 397, 92, 202, 93, 561,
484, 203
I
Cell data input of receive interface 0.
Cell data is input from a PHY layer device in byte units.
The
PD98412 reads the data at the rising edge of UCLK0.
RXDATA007 is the MSB.
RXSOC0
306
I
Cell transfer start signal of receive interface 0.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB0_B
204
O
Transfer enable signal of receive interface 0.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV0
95
I
Cell transfer enable signal of receive interface 0.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK0
399
I
UTOPIA clock input of receive interface 0.
Data is transferred/received at the rising edge of this clock.
RXADDR13 -
RXADDR10
266, 50, 363, 267
O
Multi-PHY select address of receive interface 1.
RXADDR13 is the MSB.
RXDATA107 -
RXDATA100
158, 263, 449, 46, 159, 264,
361, 47
I
Cell data input of receive interface 1.
Cell data is input from a PHY layer device in byte units. The
PD98412 reads the data at the rising edge of UCLK1.
RXDATA107 is the MSB.
RXSOC1
451
I
Cell transfer start signal of receive interface 1.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB1_B
362
O
Transfer enable signal of receive interface 1.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV1
49
I
Cell transfer enable signal of receive interface 1.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK1
48
I
UTOPIA clock input of receive interface 1.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
30



PD98412
Table 1-2. Receive Interface Signals (2/2)
Symbol
Pin No.
I/O
Function
RXADDR23 -
RXADDR20
408, 493, 107, 316
O
Multi-PHY select address of receive interface 2.
RXADDR23 is the MSB.
RXDATA207 -
RXDATA200
405, 312, 103, 212, 568, 491,
104, 213
I
Cell data input of receive interface 2.
Cell data is input from a PHY layer device in byte units.
The
PD98412 reads the data at the rising edge of UCLK2.
RXDATA207 is the MSB.
RXSOC2
214
I
Cell transfer start signal of receive interface 2.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB2_B
105
O
Transfer enable signal of receive interface 2.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV2
106
I
Cell transfer enable signal of receive interface 2.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK2
407
I
UTOPIA clock input of receive interface 2.
Data is transferred/received at the rising edge of this clock.
RXADDR33 -
RXADDR30
525, 355, 258, 153
O
Multi-PHY select address of receive interface 3.
RXADDR33 is the MSB.
RXDATA307 -
RXDATA300
34, 148, 254, 523, 442, 149,
36, 150
I
Cell data input of receive interface 3.
Cell data is input from a PHY layer device in byte units.
The
PD98412 reads the data at the rising edge of UCLK3.
RXDATA307 is the MSB.
RXSOC3
257
I
Cell transfer start signal of receive interface 3.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB3_B
151
O
Transfer enable signal of receive interface 3.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV3
38
I
Cell transfer enable signal of receive interface 3.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK3
354
I
UTOPIA clock input of receive interface 3.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
31



PD98412
Table 1-3. Transmit Interface Signals (1/2)
Symbol
Pin No.
I/O
Function
TXADDR03 -
TXADDR00
97, 207, 98, 402
O
Multi-PHY select address of transmit interface 0.
TXADDR03 is the MSB.
TXDATA007 -
TXDATA000
310, 209, 100, 404, 311, 210,
102, 211
O
Cell data output of transmit interface 0.
Cell data is output to a PHY layer device in byte units.
The
PD98412 outputs the data at the rising edge of UCLK0.
TXDATA007 is the MSB.
(3-state buffer)
TXSOC0
99
O
Cell transfer start signal of transmit interface 0.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB0_B
403
O
Transfer enable signal of transmit interface 0.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV0
208
I
Cell transfer enable signal of transmit interface 0.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXADDR13 -
TXADDR10
163, 51, 268, 164
O
Multi-PHY select address of transmit interface 1.
TXADDR13 is the MSB.
TXDATA107 -
TXDATA100
53, 366, 270, 166, 54, 271,
167, 536
O
Cell data output of transmit interface 1.
The
PD98412 outputs the data at the rising edge of UCLK1.
TXDATA107 is the MSB.
(3-state buffer)
TXSOC1
269
O
Cell transfer start signal of transmit interface 1.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB1_B
165
O
Transfer enable signal of transmit interface 1.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV1
52
I
Cell transfer enable signal of transmit interface 1.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
Data Sheet S14237EJ2V0DS00
32



PD98412
Table 1-3. Transmit Interface Signals (2/2)
Symbol
Pin No.
I/O
Function
TXADDR23 -
TXADDR20
216, 108, 409, 317
O
Multi-PHY select address of transmit interface 2.
TXADDR23 is the MSB.
TXDATA207 -
TXDATA200
572, 411, 319, 219, 111, 412,
320, 220
O
Cell data output of transmit interface 2.
The
PD98412 outputs the data at the rising edge of UCLK2.
TXDATA207 is the MSB.
(3-state buffer)
TXSOC2
318
O
Cell transfer start signal of transmit interface 2.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB2_B
218
O
Transfer enable signal of transmit interface 2.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV2
109
I
Cell transfer enable signal of transmit interface 2.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXADDR33 -
TXADDR30
40, 356, 259, 154
O
Multi-PHY select address of transmit interface 3.
TXADDR33 is the MSB.
TXDATA307 -
TXDATA300
42, 358, 261, 44, 157, 359,
262, 45
O
Cell data output of transmit interface 3.
The
PD98412 outputs the data at the rising edge.
TXDATA307 is the MSB.
(3-state buffer)
TXSOC3
260
O
Cell transfer start signal of transmit interface 3.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB3_B
155
O
Transfer enable signal of transmit interface 3.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV3
357
I
Cell transfer enable signal of transmit interface 3.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
Data Sheet S14237EJ2V0DS00
33



PD98412
(2) 16-bit multiplexed status polling mode
Table 1-4. Receive Interface Signals
Symbol
Pin No.
I/O
Function
RXADDR04 -
RXADDR00
316, 205, 206, 563, 486
O
Multi-PHY select address of receive interface 0.
RXADDR04 is the MSB.
RXDATA015 -
RXDATA000
405, 312, 103, 212, 568, 491,
104, 213, 303, 397, 92, 202,
93, 561, 484, 203
I
Cell data input of receive interface 0.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK0.
RXDATA015 is the MSB.
RXSOC0
306
I
Cell transfer start signal of receive interface 0.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB0_B
204
O
Transfer enable signal of receive interface 0.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV0[0] -
RXCLAV0[3]
95, 400, 106, 214
I
Cell transfer enable signal of receive interface 0.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412. Pins to be connected (RXCLAV0[0]-
[3]) differ depending on PHY address of the connected PHY
device.
UCLK0
399
I
UTOPIA clock input of receive interface 0.
Data is transferred/received at the rising edge of this clock.
RXADDR14 -
RXADDR10
153, 266, 50, 363, 267
O
Multi-PHY select address of receive interface 1.
RXADDR14 is the MSB.
RXDATA115 -
RXDATA100
34, 148, 254, 523, 442, 149,
36, 150, 158, 263, 449, 46,
159, 264, 361, 47
I
Cell data input of receive interface 1.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK1.
RXDATA115 is the MSB.
RXSOC1
451
I
Cell transfer start signal of receive interface 1.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB1_B
362
O
Transfer enable signal of receive interface 1.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV1[0] -
RXCLAV1[3]
49, 532, 38, 257
I
Cell transfer enable signal of receive interface 1.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred. Pins to be connected (RXCLAV1[0]-[3]) differ
depending on PHY address of the connected PHY device.
UCLK1
48
I
UTOPIA clock input of receive interface 1.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
34



PD98412
Table 1-5. Transmit Interface Signals
Symbol
Pin No.
I/O
Function
TXADDR04 -
TXADDR00
317, 97, 207, 98, 402
O
Multi-PHY select address of transmit interface 0.
TXADDR04 is the MSB.
TXDATA015 -
TXDATA000
572, 411, 319, 219, 111, 412,
320, 220, 310, 209, 100, 404,
311, 210, 102, 211
O
Cell data output of transmit interface 0.
Cell data is output to a PHY layer device in 16-bit units.
The
PD98412 outputs the data at the rising edge of UCLK0.
TXDATA015 is the MSB.
(3-state buffer)
TXSOC0
99
O
Cell transfer start signal of transmit interface 0.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB0_B
403
O
Transfer enable signal of transmit interface 0.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV0[0] -
TXCLAV0[3]
208, 309, 109, 217
I
Cell transfer enable signal of transmit interface 0.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed. Pins to be connected (TXCLAV0[0]-[3]) differ
depending on PHY address of the connected PHY device.
TXADDR14 -
TXADDR10
154, 163, 51, 268, 164
O
Multi-PHY select address of transmit interface 1.
TXADDR14 is the MSB.
TXDATA115 -
TXDATA100
42, 358, 261, 44, 157, 359,
262, 45, 53, 366, 270, 166,
54, 271, 167, 536
O
Cell data output of transmit interface 1.
The
PD98412 outputs the data at the rising edge of UCLK1.
TXDATA115 is the MSB.
(3-state buffer)
TXSOC1
269
O
Cell transfer start signal of transmit interface 1.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB1_B
165
O
Transfer enable signal of transmit interface 1.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV1[0] -
TXCLAV1[3]
52, 534, 357, 41
I
Cell transfer enable signal of transmit interface 1.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed. Pins to be connected (TXCLAV1[0]-[3]) differ
depending on PHY address of the connected PHY device.
Data Sheet S14237EJ2V0DS00
35



PD98412
(3) 16-bit 2-group weighted polling mode
Table 1-6. Receive Interface Signals (1/2)
Symbol
Pin No.
I/O
Function
RXADDR0A3 -
RXADDR0A0
205, 206, 563, 486
O
Multi-PHY select address of receive interface 0, group A.
RXADDR0A3 is the MSB.
RXADDR0B3 -
RXADDR0B0
408, 493, 107, 316
O
Multi-PHY select address of receive interface 0, group B.
RXADDR0B3 is the MSB.
RXENB0A_B
204
O
Transfer enable signal of receive interface 0, group A.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXENB0B_B
105
O
Transfer enable signal of receive interface 0, group B.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV0A
95
I
Cell transfer enable signal of receive interface 0, group A.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
RXCLAV0B
106
I
Cell transfer enable signal of receive interface 0, group B.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
RXDATA015 -
RXDATA000
405, 312, 103, 212, 568, 491,
104, 213, 303, 397, 92, 202,
93, 561, 484, 203
I
Cell data input of receive interface 0.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK0.
RXDATA015 is the MSB.
RXSOC0
306
I
Cell transfer start signal of receive interface 0.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
UCLK0
399
I
UTOPIA clock input of receive interface 0.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
36



PD98412
Table 1-6. Receive Interface Signals (2/2)
Symbol
Pin No.
I/O
Function
RXADDR1A3 -
RXADDR1A0
266, 50, 363, 267
O
Multi-PHY select address of receive interface 1, group A.
RXADDR1A3 is the MSB.
RXADDR1B3 -
RXADDR1B0
525, 355, 258, 153
O
Multi-PHY select address of receive interface 1, group B.
RXADDR1B3 is the MSB.
RXENB1A_B
362
O
Transfer enable signal of receive interface 1, group A.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXENB1B_B
151
O
Transfer enable signal of receive interface 1, group B.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV1A
49
I
Cell transfer enable signal of receive interface 1, group A.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
RXCLAV1B
38
I
Cell transfer enable signal of receive interface 1, group B.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
RXDATA115 -
RXDATA100
34, 148, 254, 523, 442, 149,
36, 150, 158, 263, 449, 46,
159, 264, 361, 47
I
Cell data input of receive interface 1.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK1.
RXDATA115 is the MSB.
RXSOC1
451
I
Cell transfer start signal of receive interface 1.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
UCLK1
48
I
UTOPIA clock input of receive interface 1.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
37



PD98412
Table 1-7. Transmit Interface Signals (1/2)
Symbol
Pin No.
I/O
Function
TXADDR0A3 -
TXADDR0A0
97, 207, 98, 402
O
Multi-PHY select address of transmit interface 0, group A.
TXADDR0A3 is the MSB.
TXADDR0B3 -
TXADDR0B0
216, 108, 409, 317
O
Multi-PHY select address of transmit interface 0, group B.
TXADDR0B3 is the MSB.
TXENB0A_B
403
O
Transfer enable signal of transmit interface 0, group A.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXENB0B_B
218
O
Transfer enable signal of transmit interface 0, group B.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV0A
208
I
Cell transfer enable signal of transmit interface 0, group A.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXCLAV0B
109
I
Cell transfer enable signal of transmit interface 0, group B.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXDATA015 -
TXDATA000
572, 411, 319, 219, 111, 412,
320, 220, 310, 209, 100, 404,
311, 210, 102, 211
O
Cell data output of transmit interface 0.
Cell data is output to a PHY layer device in 16-bit units.
The
PD98412 outputs the data at the rising edge of UCLK0.
TXDATA015 is the MSB.
(3-state buffer)
TXSOC0
99
O
Cell transfer start signal of transmit interface 0.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
Data Sheet S14237EJ2V0DS00
38



PD98412
Table 1-7. Transmit Interface Signals (2/2)
Symbol
Pin No.
I/O
Function
TXADDR1A3 -
TXADDR1A0
163, 51, 268, 164
O
Multi-PHY select address of transmit interface 1, group A.
TXADDR1A3 is the MSB.
TXADDR1B3 -
TXADDR1B0
40, 356, 259, 154
O
Multi-PHY select address of transmit interface 1, group B.
TXADDR1B3 is the MSB.
TXENB1A_B
165
O
Transfer enable signal of transmit interface 1, group A.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXENB1B_B
155
O
Transfer enable signal of transmit interface 1, group B.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV1A
52
I
Cell transfer enable signal of transmit interface 1, group A.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXCLAV1B
357
I
Cell transfer enable signal of transmit interface 1, group B.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXDATA115 -
TXDATA100
42, 358, 261, 44, 157, 359,
262, 45, 53, 366, 270, 166,
54, 271, 167, 536
O
Cell data output of transmit interface 1.
Cell data is output to a PHY layer device in 16-bit units.
The
PD98412 outputs the data at the rising edge of UCLK1.
TXDATA115 is the MSB.
(3-state buffer)
TXSOC1
269
O
Cell transfer start signal of transmit interface 1.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
Data Sheet S14237EJ2V0DS00
39



PD98412
(4) 16-bit 1-group weighted polling mode
Table 1-8. Receive Interface Signals
Symbol
Pin No.
I/O
Function
RXADDR04 -
RXADDR00
316, 205, 206, 563, 486
O
Multi-PHY select address of receive interface 0.
RXADDR04 is the MSB.
RXDATA015 -
RXDATA000
405, 312, 103, 212, 568, 491,
104, 213, 303, 397, 92, 202,
93, 561, 484, 203
I
Cell data input of receive interface 0.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK0.
RXDATA015 is the MSB.
RXSOC0
306
I
Cell transfer start signal of receive interface 0.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB0_B
204
O
Transfer enable signal of receive interface 0.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV0
95
I
Cell transfer enable signal of receive interface 0.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK0
399
I
UTOPIA clock input of receive interface 0.
Data is transferred/received at the rising edge of this clock.
RXADDR14 -
RXADDR10
153, 266, 50, 363, 267
O
Multi-PHY select address of receive interface 1.
RXADDR14 is the MSB.
RXDATA115 -
RXDATA100
34, 148, 254, 523, 442, 149,
36, 150, 158, 263, 449, 46,
159, 264, 361, 47
I
Cell data input of receive interface 1.
Cell data is input from a PHY layer device in 16-bit units.
The
PD98412 reads the data at the rising edge of UCLK1.
RXDATA115 is the MSB.
RXSOC1
451
I
Cell transfer start signal of receive interface 1.
This signal is input from a PHY layer device in synchronization with
the first byte of cell data.
RXENB1_B
362
O
Transfer enable signal of receive interface 1.
This signal informs a PHY layer device that the
PD98412 is ready
for reception in the next clock cycle.
RXCLAV1
49
I
Cell transfer enable signal of receive interface 1.
This pin inputs a signal that indicates that no more cells will be
supplied to the
PD98412 after the current cell has been
transferred.
UCLK1
48
I
UTOPIA clock input of receive interface 1.
Data is transferred/received at the rising edge of this clock.
Data Sheet S14237EJ2V0DS00
40



PD98412
Table 1-9. Transmit Interface Signals
Symbol
Pin No.
I/O
Function
TXADDR04 -
TXADDR00
317, 97, 207, 98, 402
O
Multi-PHY select address of transmit interface 0.
TXADDR04 is the MSB.
TXDATA015 -
TXDATA000
572, 411, 319, 219, 111, 412,
320, 220, 310, 209, 100, 404,
311, 210, 102, 211
O
Cell data output of transmit interface 0.
Cell data is output to a PHY layer device in 16-bit units.
The
PD98412 outputs the data at the rising edge of UCLK0.
TXDATA015 is the MSB.
(3-state buffer)
TXSOC0
99
O
Cell transfer start signal of transmit interface 0.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB0_B
403
O
Transfer enable signal of transmit interface 0.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV0
208
I
Cell transfer enable signal of transmit interface 0.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
TXADDR14 -
TXADDR10
154, 163, 51, 268, 164
O
Multi-PHY select address of transmit interface 1.
TXADDR14 is the MSB.
TXDATA115 -
TXDATA100
42, 358, 261, 44, 157, 359,
262, 45, 53, 366, 270, 166,
54, 271, 167, 536
O
Cell data output of transmit interface 1.
The
PD98412 outputs the data at the rising edge of UCLK1.
TXDATA115 is the MSB.
(3-state buffer)
TXSOC1
269
O
Cell transfer start signal of transmit interface 1.
This signal is output to a PHY layer device in synchronization with
the first byte of cell data.
(3-state buffer)
TXENB1_B
165
O
Transfer enable signal of transmit interface 1.
This signal informs a PHY layer device that the
PD98412 outputs
data in the current clock cycle.
TXCLAV1
52
I
Cell transfer enable signal of transmit interface 1.
This pin inputs a signal that indicates that the
PD98412 is ready
to receive the next cell after transfer of the current cell is
completed.
Data Sheet S14237EJ2V0DS00
41



PD98412
1.3 Memory Interface Signals
The
PD98412 has two types of memory interfaces. One of them is used to store a cell header translation table
and an address pointer to the cell buffer to the HTT & control memory, and the other is used to store cell data to the
cell buffer memory. Table 1-10 shows the interface signals of the HTT & control memory. Table 1-11 shows the
interface signals of the cell buffer memory.
Table 1-10. HTT & Control Memory Interface Signals
Symbol
Pin No.
I/O
Function
HTA17 -
HTA00
11, 333, 234, 127, 12, 334, 235, 128,
13, 335, 236, 15, 130, 336, 237, 16,
131, 238
O
Address output
HTD31 -
HTD00
18, 133, 19, 430, 513, 134, 135, 21,
242, 136, 22, 137, 432, 515, 23, 138,
343, 245, 139, 344, 246, 140, 517, 345,
141, 27, 28, 346, 248, 142, 29, 249
I/O
Data I/O bus (32-bit/word units)
(w/pull-down resistor)
HTP3 -
HTP0
338, 340, 24, 247
I/O
Parity I/O (w/pull-down resistor)
HTCS1_B,
HTCS0_B
428, 17
O
Chip select signal
HTWE_B
132
O
Write enable signal
HTOE_B
239
O
Output enable signal
Table 1-11. Cell Buffer Memory Interface Signals
Symbol
Pin No.
I/O
Function
CBA17 -
CBA00
71, 381, 286, 73, 184, 382, 287, 74,
185, 288, 470, 75, 186, 289, 384, 76,
187, 77
O
Address output
CBD91 -
CBD00
145, 251, 349, 439, 55, 272, 168, 56,
457, 369, 273, 170, 274, 538, 59, 171,
275, 172, 276, 372, 540, 373, 277, 62,
174, 278, 374, 63, 175, 279, 542, 463,
176, 65, 177, 281, 377, 66, 178, 179,
544, 465, 68, 180, 69, 379, 284, 181,
472, 551, 188, 189, 79, 386, 292, 190,
80, 191, 474, 553, 294, 192, 82, 389,
295, 193, 83, 296, 194, 555, 391, 297,
195, 85, 478, 392, 298, 197, 299, 557,
88, 198, 300, 199, 301, 395, 90, 559,
302, 200, 91, 201
I/O
Data bus (92-bit/word units)
(w/pull-down resistor)
CBCS1_B,
CBCS0_B
70, 380
O
Chip select signal
CBWE_B
285
O
Write enable signal
CBOE_B
182
O
Output enable signal
Data Sheet S14237EJ2V0DS00
42



PD98412
1.4 Microprocessor Interface Signals
The
PD98412 supports a 32-bit address/data multiplexed synchronous bus type microprocessor interface.
Table 1-12. Microprocessor Interface Signal
Symbol
Pin No.
I/O
Function
IOCS_B
221
I
I/O chip select signal
MCS_B
574
I
Memory chip select signal
INT
414
O
Interrupt request signal
HCLK
497
I
Microprocessor bus clock (8 to 33 MHz)
AD31 - AD0
416, 1, 117, 225, 118, 226, 326, 3, 502,
227, 419, 4, 120, 228, 328, 5, 121, 229,
504, 421, 122, 7, 123, 231, 331, 8, 124,
125, 506, 423, 10, 126
I/O
Address/data bus
R/W_B
114
I
Read/write select signal
UWE_B
115
I
High-order word enable signal
RDY_B
322
O
Ready signal (3-state buffer)
Data Sheet S14237EJ2V0DS00
43



PD98412
1.5 JTAG
Table 1-13. JTAG Interface Signals
Symbol
Pin No.
I/O
Function
JDI
252
I
JTAG serial data input
JDO
146
O
JTAG serial data output (normally open)
(3-state buffer)
JCK
33
I
JTAG serial clock input
JMS
253
I
JTAG mode select signal
JRST_B
351
I
JTAG reset signal
1.6 Others
Table 1-14. Other Interface Signals
Symbol
Pin No.
I/O
Function
SWCLK
437
I
System clock input (8 to 40 MHz)
RESET_B
347
I
Hardware reset signal (Schmitt input buffer)
CG
116, 222, 223, 321, 415
I
Always connect to GND.
PU
30
I
Always pull up to V
DD
.
IC
224, 250, 348, 350, 500
O
Internally connected (always open).
Data Sheet S14237EJ2V0DS00
44



PD98412
1.7 Recommended Connections of Unused Pins
Table 1-15. Recommended Connections of Unused Pins
Pin Name
I/O
Recommended Connections
RXDATA***
I
Connect to GND.
RXSOC*
I
Connect to GND.
RXCLAV*
I
Connect to GND.
UCLK*
I
Connect to GND.
TXCLAV*
I
Connect to GND.
HTD31 - HTD00
I/O (w/pull-down resistor)
Open.
HTP3 - HTP0
I/O (w/pull-down resistor)
Open.
CBD91 - CBD00
I/O (w/pull-down resistor)
Open.
IOCS_B
I
Pull up to V
DD.
MCS_B
I
Pull up to V
DD.
AD31 - AD00
I/O
Pull up to V
DD.
R/W_B
I
Pull up to V
DD.
UWE_B
I
Pull up to V
DD.
JDI
I
Connect to GND.
JCK
I
Connect to GND.
JMS
I
Connect to GND.
JRST_B
I
Connect to GND.
All output pins
O
Open.
Data Sheet S14237EJ2V0DS00
45



PD98412
1.8 Pin Status at Reset
Table 1-16. Pin Status at Reset
Pin Name
I/O
Pin Status at Reset
RXADDR*
O
High level
RXENB*_B
O
High level
TXADDR*
O
High level
TXDATA***
O (3-state buffer)
Hi-Z
TXSOC*
O (3-state buffer)
Hi-Z
TXENB*_B
O
High level
HTA17 - HTA00
O
Low level
HTCS1_B, HTCS0_B
O
High level
HTWE_B
O
High level
HTOE_B
O
High level
HTP3 - HTP0
I/O (w/pull-down resistor)
Low level
HTD31 - HTD00
I/O (w/pull-down resistor)
Low level
CBD91 - CBD00
I/O (w/pull-down resistor)
Low level
CBA17 - CBA00
O
Low level
CBOE_B
O
High level
CBWE_B
O
High level
CBCS1_B, CBCS0_B
O
High level
INT
O
Low level
RDY_B
O (3-state buffer)
Hi-Z
AD31 - AD00
I/O
Hi-Z
JDO
O (3-state buffer)
Hi-Z
Data Sheet S14237EJ2V0DS00
46



PD98412
2. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings
Parameter
Symbol
Test Conditions
Rating
Unit
Supply voltage
V
DD
-
0.5 to +4.6
V
Input voltage
V
I
V
I
< V
DD
+ 3.0 V
-
0.5 to +6.6
V
Output voltage
V
O
V
O
< V
DD
+ 3.0 V
-
0.5 to +6.6
V
Storage temperature
T
stg
-
65 to +150
C
Caution If any of the parameters exceeds the absolute maximum ratings, even momentarily, the quality of
the product may be impaired. The absolute maximum ratings are values that may physically
damage the product(s). Be sure to use the product(s) within the ratings.
Capacitance
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Input capacitance
C
I
Frequency = 1 MHz
-
10
20
pF
Output capacitance
C
O
Frequency = 1 MHz
-
10
20
pF
Input/output capacitance
C
IO
Frequency = 1 MHz
-
10
20
pF
Recommended Operating Condition
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Supply voltage
V
DD
3.135
3.300
3.465
V
Low-level input voltage
V
IL
Other than RESET_B
signal
0
-
0.8
V
High-level input voltage
V
IH
Other than RESET_B
signal
2.0
-
5.5
V
Negative trigger voltage
V
N
RESET_B signal
0.6
1.8
V
Positive trigger voltage
V
P
RESET_B signal
1.2
2.4
V
Hysteresis voltage
V
H
0.3
1.5
V
Operating temperature
T
A
-
40
-
+85
C
Data Sheet S14237EJ2V0DS00
47



PD98412
DC Characteristics (T
A
=
-
-
-
-
40 to +85



C, V
DD
= 3.3 V



5%)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Output leakage current
I
OZ
V
O
= V
DD
or GND
-
-
10
A
I
LI1
V
I
= V
DD
or GND, Note 1
-
-
10
A
Input leakage current
I
LI2
V
I
= V
DD
Note 2 (50 k
pull-down)
25
120
220
A
I
OL1
V
OL
= 0.4 V, Note 3
6.0
-
-
mA
I
OL2
V
OL
= 0.4 V, Note 4, 5
9.0
-
-
mA
Low-level output leakage current
I
OL3
V
OL
= 0.4 V, Note 6
12.0
-
-
mA
I
OH1
V
OH
= 2.4 V, Note 3
-
3.0
-
-
mA
I
OH2
V
OH
= 2.4 V, Note 4
-
4.0
-
-
mA
I
OH2
V
OH
= 2.4 V, Note 5 (UTOPIA)
-
6.0
-
-
mA
High-level output leakage current
I
OH3
V
OH
= 2.4 V, Note 6
-
5.0
-
-
mA
Low-level output leakage voltage
V
OL
I
OL
= 0 mA
-
-
0.1
V
V
OH1
I
OH
= 0 mA, Note 7
V
DD
-
0.2
-
-
V
High-level output leakage voltage
V
OH2
I
OH
= 0 mA, Note 8
V
DD
-
0.4
-
-
V
Operating current
I
DD
V
I
= V
DD
or GND
-
Note 9
1300
mA
Notes 1. RXDATA***, RXSOC*, RXCLAV*, UCLK*, TCLAV*, AD31-AD00, MCS_B, IOCS_B, R/W_B, UWE_B,
HCLK, JDI, JCK, JMS, JRST_B, SWCLK, RESET_B pins
2. HTD31-HTD00, HTP3-HTP0, CBD91-CBD00 pins
3. INT, JDO pins
4. HTA17-HTA00, HTWE_B, HTOE_B, CBA17-CBA00, CBCS0_B, CBWE_B, CBOE_B, HTCS1_B,
HTCS0_B, CBCS1_B, HTD31-HTD00, HTP3-HTP0, CBD91-CBD00 pins
5. RXADDR**, TXADDR**, RXENB*_B, TXENB*_B, TXDATA***, TXSOC* pins
6. RDY_B, AD31-AD00 pins
7. INT, JDO, RXADDR**, TXADDR**, RXENB*_B, TXENB*_B, TXDATA***, TXSOC*, HTCS1_B,
HTCS0_B, CBCS1_B, HTA17-HTA00, HTWE_B, HTOE_B, CBA17-CBA00, CBCS0_B, CBWE_B,
CBOE_B, RDY_B, AD31-AD00 pins
8. HTD31-HTD00, HTP3-HTP0, CBD91-CBD00 pins
9. The approximate TYP. value of the operating current (I
DD
) depends on the throughput of switching.
For example with the following conditions, it is calculated as shown below.
Conditions: 8-bit UTOPIA interface
4 ports, SWCLK = 40 MHz, UCLK0 to UCLK3 = 50 MHz
Calculation formula: I
DD
(TYP.) = 267
t + 600 mA, t (throughput): 0
-
1.5 [Unit: Gbps]
Data Sheet S14237EJ2V0DS00
48



PD98412
AC Test Output Waveform
2.0 V
2.2 V
0.4 V
0.8 V
2.0 V
0.8 V
Test point
AC Characteristics (T
A
=
-
-
-
-
40 to +85



C, V
DD
= 3.3 V



5%)
(1) Control Signal
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
SWCLK cycle time
t
CYSL
25
125
ns
SWCLK high-level width
t
WSKH
10.5
-
ns
SWCLK low-level width
t
WSKL
10.5
-
ns
SWCLK rise time
t
SKR
-
2
ns
SWCLK fall time
t
SKF
-
2
ns
RESET_B low-level width
t
WRSL
16
-
t
CYSK
Control Signal
t
CYSK
SWCLK
in
RESET_B
in
t
WSKL
t
WSKH
t
SKR
t
SKF
t
WRSL
Data Sheet S14237EJ2V0DS00
49



PD98412
(2) Processor interface (32-bit mode, read/write)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
HCLK cycle time
t
CYHK
30
125
ns
HCLK high-level width
t
WHKH
12
-
ns
HCLK low-level width
t
WHKL
12
-
ns
HCLK rise time
t
HKR
-
3
ns
HCLK fall time
t
HKF
-
3
ns
HCLK
INT output delay time
t
DHKIT
Load capacitance 30 pF
1
17
ns
HCLK
RDY_B output delay
time
t
DHKRY
Load capacitance 70 pF
1
17
ns
HCLK
RDY_B float output
delay time
t
FHKRY
Load capacitance 70 pF
1
17
ns
HCLK
AD output delay time
t
DHKAD
Load capacitance 70 pF
1
17
ns
HCLK
AD float output delay
time
t
FHKAD
Load capacitance 70 pF
1
17
ns
AD setup time (vs. HCLK
)
t
SADHK
8
-
ns
AD hold time (vs. HCLK
)
t
HHKAD
1
-
ns
IOCS_B setup time (vs. HCLK
)
t
SIOHK
8
-
ns
IOCS_B hold time (vs. HCLK
)
t
HHKIO
1
-
ns
IOCS_B recovery time
t
IORV
Note
-
ns
MCS_B setup time (vs. HCLK
)
t
SMHK
8
-
ns
MCS_B hold time (vs. HCLK
)
t
HHKM
1
-
ns
MCS_B recovery time
t
MRV
Note
-
ns
UWE_B setup time (vs. HCLK
)
t
SUWHK
8
-
ns
UWE_B hold time (vs. HCLK
)
t
HHKUW
1
-
ns
R/W_B setup time (vs. HCLK
)
t
SRWHK
8
-
ns
R/W_B hold time (vs. HCLK
)
t
HHKRW
1
-
ns
Note
(1) When HCLK cycle time (t
CYHK
) < 4
SWCLK cycle time (t
CYSK
):
IOCS_B recovery time (t
IORV
) = MCS_B recovery time (t
MRV
) = t
CYHK
(2) When HCLK cycle time (t
CYHK
)
4
SWCLK cycle time (t
CYSK
):
IOCS_B recovery time (t
IORV
) = MCS_B recovery time (t
MRV
) = t
CYHK
2
Data Sheet S14237EJ2V0DS00
50



PD98412
Processor interface (32-bit mode, read)
HCLK
in
AD31 - AD00
in/out
IOCS_B
in
MCS_B
in
UME_B
in
R/W_B
in
RDY_B
out
HCLK
in
INT
out
t
CYHK
t
WHKH
t
HKR
t
HKF
t
WHKL
t
SADHK
t
SIOHK
t
SMHK
t
SUWHK
t
SRWHK
t
DHKRY
t
DHKIT
t
DHKIT
t
DHKRY
t
FHKRY
t
HHKRW
t
HHKUW
t
HHKW
t
HHKIO
data
address
t
DHKAD
t
FHKAD
t
MRV
t
IORV
(Hi-Z)
(Hi-Z)
address
t
HHKAD
Data Sheet S14237EJ2V0DS00
51



PD98412
Processor interface (32-bit mode, write)
HCLK
in
AD31 - AD00
in/out
IOCS_B
in
MOS_B
in
UME_B
in
R/W_B
in
RDY_B
out
t
CYHK
t
WHKH
t
HKR
t
HKF
t
WHKL
t
SADHK
t
SIOHK
t
SMHK
t
SUWHK
t
SRWHK
t
DHKRY
t
DHKRY
t
FHKRY
t
HHKRW
t
HHKUW
t
HHKW
t
HHKIO
data
Don't care
t
SADHK
t
HHKAD
t
MRV
t
IORV
(Hi-Z)
(Hi-Z)
address
t
HHKAD
Data Sheet S14237EJ2V0DS00
52



PD98412
(3) HTT & control memory interface
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
HTA cycle time
t
CYHA
Load capacitance 50 pF
t
CYSK
-
2
ns
HTD, HTP setup time (vs. HTA)
t
SHDHA
9
ns
HTD, HTP hold time (vs. HTA)
t
HHAHD
1
ns
HTCS_B cycle time
t
CYHC
Load capacitance 50 pF
t
CYSK
-
2
ns
HTD, HTP setup time
(vs. HTCS_B)
t
SHDHC
9
ns
HTD, HTP hold time
(vs. HTCS_B)
t
HHCHD
1
ns
HTOE_B cycle time
t
CYHO
Load capacitance 50 pF
t
CYSK
-
2
ns
HTD, HTP setup time
(vs. HTOE_B)
t
SHDHO
9
ns
HTD, HTP hold time
(vs. HTOE_B)
t
HHOHD
1
ns
HTWE_B low-level width
t
WHWL
Load capacitance 50 pF
t
WSKL
-
1.5
ns
Data
HTWE_B
output delay
time
t
DHDHW
Load capacitance 50 pF
t
WSKL
-
3
ns
HTWE_B
Data float output
delay time
t
FHWHD
Load capacitance 50 pF
0
ns
HTA
HTWE_B
output delay
time
t
DHAHW
Load capacitance 50 pF
t
WSKH
-
5
ns
HTCS_B
HTWE_B
output
delay time
t
DHCHW
Load capacitance 50 pF
t
CYSK
-
6
ns
HTOE_B
HTWE_B
output
delay time
t
DHOHW
Load capacitance 50 pF
t
CYSK
-
6
ns
HTWE_B
HTA output delay
time
t
DHWHA
Load capacitance 50 pF
0
ns
HTWE_B
HTCS_B
output
delay time
t
DHWHC
Load capacitance 50 pF
0
ns
HTWE_B
HTOE_B
output
delay time
t
DHWHO
Load capacitance 50 pF
0
ns
HTD float
HTOE_B
output
delay time
t
DHDHO
Load capacitance 50 pF
0
ns
HTOE_B
Data output delay
time
t
DHOHD
Load capacitance 50 pF
t
WSKH
-
3
ns
Data Sheet S14237EJ2V0DS00
53



PD98412
HTT & control memory interface (read)
t
CYHA
t
CYHC
t
CYHO
t
SHDHC
t
SHDHA
t
HHAHD
t
SHDHO
t
HHCHD
t
HHOHD
address
data
(Hi-Z)
(Hi-Z)
(SWCLK)
in
HTA17 - HTA00
out
HTD31 - HTD00,
HTP3-HTP0
in/out
HTCS1_B,
HTCS0_B
out
HTOE_B
out
HTWE_B
out
HTT & control memory interface (write)
t
CYHA
t
DHOHD
t
DHCHW
t
DHDHW
t
FHWHD
t
DHDHO
t
DHAHW
t
DHDHW
t
WHWL
t
DHWHC
t
DHWHA
t
DHWHO
address
Valid
(Hi-Z)
(Hi-Z)
(SWCLK)
in
HTA17 - HTA00
out
HTD31 - HTD00,
HTP3 - HTP0
in/out
HTCS1_B,
HTCS0_B
out
HTOE_B
out
HTWE_B
out
Data Sheet S14237EJ2V0DS00
54



PD98412
(4) Cell buffer memory interface
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
CBA cycle time
t
CYCA
Load capacitance 50 pF
t
CYSK
-
2
ns
CBD setup time (vs. CBA)
t
SCDCA
9
ns
CBD hold time (vs. CBA)
t
HCACD
1
ns
CBCS_B cycle time
t
CYCC
Load capacitance 50 pF
t
CYSK
-
2
ns
CBD setup time (vs. CBCS_B)
t
SCDCC
9
ns
CBD hold time (vs. CBCS_B)
t
HCCCD
1
ns
CBOE_B cycle time
t
CYCO
Load capacitance 50 pF
t
CYSK
-
2
ns
CBD setup time (vs. CBOE_B)
t
SCDCO
9
ns
CBD hold time (vs. CBOE_B)
t
HCOCD
1
ns
CBWE_B low-level width
t
WCWL
Load capacitance 50 pF
t
WSKL
-
1.5
ns
Data
CBWE_B
output delay
time
t
DCDCW
Load capacitance 50 pF
t
WSKL
-
3
ns
CBWE_B
Data float output
delay time
t
FCWCD
Load capacitance 50 pF
0
ns
CBA
CBWE_B
output delay
time
t
DCACW
Load capacitance 50 pF
t
WSKH
-
5
ns
CBCS_B
CBWE_B
output
delay time
t
DCCCW
Load capacitance 50 pF
t
CYSK
-
6
ns
CBOE_B
CBWE_B
output
delay time
t
DCOCW
Load capacitance 50 pF
t
CYSK
-
6
ns
CBWE_B
CBA output delay
time
t
DCWCA
Load capacitance 50 pF
0
ns
CBWE_B
CBCS_B
output
delay time
t
DCWCC
Load capacitance 50 pF
0
ns
CBWE_B
CBOE_B
output
delay time
t
DCWCO
Load capacitance 50 pF
0
ns
CBD float
CBOE_B
output
delay time
t
DCDCO
Load capacitance 50 pF
0
ns
CBOE_B
Data output delay
time
t
DCOCD
Load capacitance 50 pF
t
WSKH
-
3
ns
Data Sheet S14237EJ2V0DS00
55



PD98412
Cell buffer memory interface (read)
t
CYCA
t
CYCC
t
CYCO
t
SCDCC
t
SCDCA
t
HCACD
t
SCDCO
t
HCCCD
t
HCOCD
address
data
(Hi-Z)
(Hi-Z)
(SWCLK)
in
CBA17 - CBA00
out
CBD91 - CBD00
in/out
CBCS1_B,
CBCS0_B
out
CBOE_B
out
CBWE_B
out
Cell buffer memory interface (write)
t
CYCA
t
DCOCD
t
DCCCW
t
DCDCW
t
FCWCD
t
DCDCO
t
DCACW
t
DCOCW
t
WCWL
t
DCWCC
t
DCWCA
t
DCWCO
address
Valid
(Hi-Z)
(Hi-Z)
(SWCLK)
in
CBA17 - CBA00
out
CBD91 - CBD00,
in/out
CBCS1_B,
CBCS0_B
out
CBOE_B
out
CBWE_B
out
Data Sheet S14237EJ2V0DS00
56



PD98412
(5) UTOPIA interface (reception)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
UCLK cycle time
t
CYRK
20
125
ns
UCLK high-level width
t
WRKH
8
ns
UCLK low-level width
t
WRKL
8
ns
UCLK rise time
t
RKR
2
ns
UCLK fall time
t
RKF
2
ns
UCLK
RXADDR output delay
time
t
DRKA
Load capacitance 50 pF
1
14
ns
UCLK
RXENB_B output
delay time
t
DRKE
Load capacitance 50 pF
1
14
ns
RXCLAV setup time (vs. UCLK
)
t
SCARK
4
ns
RXCLAV hold time (vs. UCLK
)
t
HRKCA
1
ns
RXDATA setup time (vs. UCLK
)
t
SDRK
4
ns
RXDATA hold time (vs. UCLK
)
t
HRKD
1
ns
RXSOC setup time (vs. UCLK
)
t
SSCRK
4
ns
RXSOC hold time (vs. UCLK
)
t
HRKSC
1
ns
Data Sheet S14237EJ2V0DS00
57



PD98412
UTOPIA interface (reception) (n = 0 - 3)
8-bit mode
UCLKn
in
RXADDRn3 -
RXADDRn0
out
RXCLAVn
in
RXNBn_B
out
RXDATAn7 -
RXDATAn0
in
RXSOCn
in
t
CYRK
t
WRKH
t
RKR
t
RKF
"F(h)"
P47
P48
H1
H2
H3
"F(h)"
"F(h)"
N+1
N+2
N
t
WRKL
(Hi-Z)
(Hi-Z)
(Hi-Z)
(Hi-Z)
(Hi-Z)
(Hi-Z)
t
DRKE
t
DRKE
t
HRKSC
t
SSCRK
t
SDRK
t
HRKD
t
HRKSC
t
SSCRK
t
DRKA
t
SCARK
t
HRKCA
t
SCARK
t
HRKCA
16-bit mode
UCLKn
in
RXADDRn4 -
RXADDRn0
out
RXCLAVn
in
RXENBn_B
out
RXDATAn15 -
RXDATAn8
in
RXSOCn
in
RXDATAn7 -
RXDATAn0
in
"1F(h)"
N
"1F(h)"
N+1
"1F(h)"
N+2
H1
H3
H2
P45
P46
P47
P48
H4
(Hi-Z)
(Hi-Z)
(Hi-Z)
(Hi-Z)
t
DRKE
t
DRKE
t
HRKSC
t
HRKSC
t
DRKA
t
SCARK
t
HR KCA
t
SCARK
t
HRKCA
t
RKR
t
RKF
t
CYRK
t
WRKH
t
WRKL
t
SSCRK
t
SDRK
t
SSCRK
t
SDRK
t
HRKD
t
HRKD
(Hi-Z)
(Hi-Z)
(Hi-Z)
Data Sheet S14237EJ2V0DS00
58



PD98412
(6) UTOPIA interface (transmission)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
UCLK
TXADDR output delay
time
t
DTKA
Load capacitance 50 pF
1
14
ns
UCLK
TXENB_B output
delay time
t
DTKE
Load capacitance 50 pF
1
14
ns
UCLK
TXDATA output delay
time
t
DTKD
Load capacitance 50 pF
1
14
ns
UCLK
TXDATA float output
delay time
t
FTKD
Load capacitance 50 pF
1
14
ns
UCLK
TXSOC output delay
time
t
DTKSC
Load capacitance 50 pF
1
14
ns
UCLK
TXSOC float output
delay time
t
FTKSC
Load capacitance 50 pF
1
14
ns
TXCLAV setup time (vs. UCLK
)
t
SCATK
4
ns
TXCLAV hold time (vs. UCLK
)
t
HTKCA
1
ns
Data Sheet S14237EJ2V0DS00
59



PD98412
UTOPIA interface (transmission) (n = 0 - 3)
8-bit mode
UCLKn
in
TXADDRn3 -
TXADDRn0
out
TXCLAVn
in
TXENBn_B
out
TXDATAn7 -
TXDATAn0
out
TXSOCn
out
"F(h)"
P48
H2
H3
H4
"F(h)"
"F(h)"
0
1
N
(Hi-Z)
(Hi-Z)
H1
(Hi-Z)
(Hi-Z)
t
DTKE
t
FTKD
t
FTKSC
t
DTKE
t
DTKSC
t
DTKD
t
DTKSC
t
DTKA
t
SCATK
t
HTKCA
t
SCATK
t
HTKCA
(Hi-Z)
(Hi-Z)
16-bit mode
UCLKn
in
TXADDRn4 -
TXADDRn0
out
TXCLAVn
in
TXENBn_B
out
TXDATAn15 -
TXDATAn8
out
TXSOCn
out
TXDATAn7-
TXDATAn0
out
"1F(h)"
N
"1F(h)"
0
"1F(h)"
1
H1
H3
H2
P47
P48
H4
(Hi-Z)
(Hi-Z)
(Hi-Z)
(Hi-Z)
t
DTKE
t
DTKE
t
FTKSC
t
DTKSC
t
FTKD
t
DTKD
t
FTKD
t
DTKD
t
DTKSC
t
DTKA
t
SCATK
t
HTKCA
t
SCATK
t
HTKCA
(Hi-Z)
Data Sheet S14237EJ2V0DS00
60



PD98412
3. PACKAGE DRAWING
K S
E
ITEM
MILLIMETERS
A
D
G
H
J
K
40.00
0.20
40.00
0.20
0.80
1.40
0.15
0.60
0.10
B
39.60
0.15
C
39.60
0.15
F
1.27 (T.P.)
E
1.585
N
0.25 MIN.
M
0.30
S
2.0
R
2.0
T
3.0
X
22.73
W
22.73
P
0.10
Q
3.0
L
0.75
0.15
A
1
23.00 MAX.
A
2
23.00 MAX.
+
0.30
-
0.20
+
0.20
-
0.10
S576N7-127-H6-1
Z
0.20
Y
C 0.40
A
Q
R
Index area
Y
N
detail of A part
S
T
detail of B part
(Z)
A
1
B
A
S
AJ AG AE AC AA W U R N L J G E C A
AK AH AF AD AB Y V T P M K H F D B
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
29
27
25
23
21
19
17
15
13
11
9
7
5
3
1
X
C
J
H
G
A
B
F
M
M
A
S
L
S
M
P
B
B W
D
A
2
Data Sheet S14237EJ2V0DS00
61



PD98412
4. RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For details of the recommended soldering conditions, refer to information document Semiconductor Device
Mounting Technology Manual (C10535E).
For soldering methods and conditions other than those recommended, consult NEC.
Surface-mount type



PD98412N7-H6: 576-pin tape BGA (40



40)
Soldering Method(s)
Soldering Conditions
Recommended
Conditions Symbol
Infrared reflow
Package peak temperature: 235
C, Time: 30 sec max. (210
C min.),
Number of times: three times max., Number of days: 7
Note
(after that,
prebaking is necessary at 125
C for 10 hours)
IR35-107-3
Partial heating
Pin temperature: 300
C max. (per device side), Time: 3 sec max. (per
device side)
-
Note Number of days in storage after the dry pack has been opened. The storage conditions are at 25
C, 65%
RH MAX.
Data Sheet S14237EJ2V0DS00
62



PD98412
[MEMO]
Data Sheet S14237EJ2V0DS00
63



PD98412
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V
DD
or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.



PD98412
NEASCOT-X15 is a trademark of NEC Corporation.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8