ChipFind - документация

Электронный компонент: CMM1200-BD

Скачать:  PDF   ZIP

Document Outline

mOE"OEY@b~,,...,,"L@i"N@QPWYU@r`'^ @rNL@h>TMs"L@t^Y,,TM@WWPYY
t^'Z@RXQNYXXNTVPP@@f,,YZ@RXQNYXXNTVQU@@zzzN"OE"OEY...~,,...,,"N"
RPPU@mOE"OEY@b~,,...,,"L@i"N
CMM1200-BD
RNP@s@VNP@gh
g,,aTM@mmic@lzMnOETM^@a"'OE^~
3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
2.0 to 6.0 GHz
GaAs MMIC
Low-Noise Amplifier
Advanced Product Information
May 2005 V1.5
(1 of 5)
Features
Small Size: 1.60 x 1.55 x 0.076 mm
Integrated On-Chip Drain Bias Coil
Integrated On-Chip DC Blocking
Single Bias Operation
Directly Cascadable Fully Matched, Novel
Feedback & Distributed Amplifier Design
P1dB: 15.5 dBm @ 6 GHz, Typ.
High Linear Gain: 17.5 dB Typ.
Noise Figure: 3.3 dB Typ. @ 6 GHz
pHEMT Technology
Silicon Nitride Passivation
Specifications (TA = 25C, Vdd = 5V)
1
Parameters
Units
Min
Typ
Max
Frequency Range
GHz
2.0
6.0
Linear Gain
dB
16.0
17.5
Gain Variation (over operating frequency)
dB
2.0
Power Output (@1 dB Gain Compression)
dBm
14.0
15.5
P1dB Variation (over operating frequency)
dBm
1.0
Saturated Output Power
dBm
19.0
23.0
Third Order Intercept Point (@ 6 GHz)
dBm
25.5
Second Order Intercept Point (@ 6 GHz)
dBm
41.0
Noise Figure (@6 GHz)
dB
3.3
3.8
Input Return Loss 2
dB
-9.5
Output Return Loss 2
dB
-12.0
Current
mA
85
100
115
Thermal Resistance
C/W
34.0
Stability
Unconditionally Stable
Absolute Maximum Ratings
1
Parameter
Rating
Drain Voltage
4.5V (min.) / 8.0V (max.)
Drain Current
150 mA
Continuous Power Dissipation
1.2 W
Input Power
10 dBm
Storage Temperature
-50C to +150C
Channel Temperature
175C
Operating Backside Temperature
2
-40C Min.
Die Attach and Bonding Procedures
Die Attach: Eutectic die attach is recommended. For eutec-
tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290C, 5C; Handling Tool: Tweezers; Time: 1
min or less.
Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over ther-
mosonic bonding. For thermocompression bonding: Stage
Temperature: 250C; Bond Tip Temperature: 150C; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
CMM1200-BD
Chip Diagram
Notes: 1. Tested on Celeritek connectorized evaluation board.
2. Measured on wafer.
Notes: 1. Operation outside these limits can cause permanent damage.
2. Calculation maximum operating temperature:
Tmax = 175(Pdis [W] x 34) [C].
3236 Scott Boulevard, Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CMM1200-BD
Advanced Product Information - May 2005
V1.5
(2 of 5)
Typical On-Wafer Scattering Parameters
(Vd = +5.0V, Icc = 101 mA, T = 23C, device in a 50 ohm system)
Frequency
S11
S21
S12
S22
(MHz)
(Mag)
(Ang)
(Mag)
(Ang)
(Mag)
(Ang)
(Mag)
(Ang)
0.10
0.813
-0.57
0.001
0.00
0.000
0.00
0.970
-0.23
1.00
-0.461
0.50
-1.411
-3.07
0.004
0.00
-0.474
-0.44
1.90
0.060
0.07
1.612
7.22
-0.001
0.00
-0.245
-0.03
2.20
0.041
-0.01
5.064
6.32
0.000
0.00
-0.192
0.04
2.50
0.008
-0.05
7.462
3.94
-0.001
0.00
-0.127
0.04
3.40
-0.021
-0.09
7.667
-3.82
0.000
0.00
-0.077
0.00
3.70
-0.023
-0.10
6.413
-5.62
0.001
0.00
-0.074
-0.01
4.00
-0.027
-0.13
4.857
-6.95
0.002
0.00
-0.075
-0.02
4.90
-0.059
-0.20
-0.337
-8.14
0.003
0.00
-0.092
-0.03
5.20
-0.085
-0.22
-1.893
-7.81
0.003
0.00
-0.099
-0.03
5.50
-0.111
-0.24
-3.305
-7.21
0.004
0.00
-0.106
-0.03
5.80
-0.140
-0.26
-4.492
-6.28
0.004
0.00
-0.117
-0.03
6.10
-0.179
-0.26
-5.314
-5.42
0.005
0.00
-0.126
-0.01
7.00
-0.267
-0.25
-7.084
-2.16
0.005
0.00
-0.128
0.02
7.90
-0.338
-0.20
-7.165
1.27
0.004
0.00
-0.117
0.05
8.20
-0.355
-0.18
-6.874
2.35
0.004
0.00
-0.109
0.06
8.50
-0.368
-0.16
-6.436
3.37
0.004
0.00
-0.100
0.07
9.10
-0.387
-0.11
-5.152
5.20
0.003
-0.01
-0.077
0.08
10.00
-0.395
-0.06
-2.289
7.12
0.001
-0.01
-0.036
0.09
10.90
-0.392
-0.01
1.328
7.55
0.000
-0.01
0.000
0.07
12.10
-0.394
0.05
5.852
5.16
-0.004
-0.01
0.027
0.02
13.00
-0.394
0.12
7.603
1.63
-0.007
-0.01
0.024
-0.02
13.90
-0.368
0.21
7.341
-2.28
-0.009
0.00
0.002
-0.04
14.50
-0.324
0.28
6.104
-4.58
-0.009
0.00
-0.016
-0.05
15.10
-0.253
0.34
4.167
-6.32
-0.010
0.00
-0.033
-0.04
16.00
-0.101
0.39
0.436
-7.50
-0.010
0.00
-0.053
-0.03
17.20
0.125
0.35
-4.701
-5.86
-0.006
0.01
-0.072
0.00
18.10
0.262
0.25
-7.183
-2.26
-0.003
0.01
-0.065
0.04
19.00
0.369
0.13
-7.082
2.49
0.003
0.01
-0.021
0.09
20.20
0.501
-0.10
-1.719
6.64
0.010
0.01
0.117
0.07
21.10
0.481
-0.36
2.707
4.90
0.012
0.00
0.152
-0.06
22.00
0.348
-0.53
4.002
1.55
0.008
-0.01
0.080
-0.14
23.20
0.198
-0.65
2.532
-1.66
0.000
-0.01
-0.012
-0.12
24.10
0.078
-0.78
0.354
-2.02
-0.005
-0.01
-0.019
-0.09
25.00
-0.150
-0.85
-0.597
-0.90
-0.006
0.00
-0.022
-0.09
26.20
-0.437
-0.73
-0.379
-0.17
-0.006
0.00
-0.033
-0.07
26.80
-0.537
-0.60
-0.265
-0.05
-0.004
0.00
-0.033
-0.07
28.00
-0.204
-0.39
-0.136
-0.02
-0.002
0.00
-0.028
-0.05
29.20
-0.466
-0.67
-0.076
0.03
-0.003
0.00
-0.011
-0.04
30.10
-0.637
-0.58
-0.040
0.03
-0.001
0.00
0.011
-0.04
S-Parameter Data Files are available on-line at: www.celeritek.com
3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CMM1200 Typical Small-Signal Data
RF-probe Test; 5V, 100mA
10
11
12
13
14
15
16
17
18
19
20
2
3
4
5
6
Frequency (GHz)
Linear Gain (dB)
-30
-25
-20
-15
-10
-5
0
5
10
15
20
I/O Return Loss (dB)
Gain
S11
S22
CMM1200-BD
Advanced Product Information - May 2005 V1.5
(3 of 5)
Typical Narrow and Wideband S-Parameter Performance
3236 Scott Boulevard, Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CMM1200-BD
Advanced Product Information - May 2005
V1.5
(4 of 5)
CMM1200 Typical Noise Figure Data
Connectorized Fixture; Vdd=5V
0.0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
8.0
2
3
4
5
6
7
8
Frequency (GHz)
Noise Figure (dB)
130mA
100mA
CMM1200 Typical Power Data
Connectorized Fixture; 5V, 100mA
10
11
12
13
14
15
16
17
18
19
20
2
3
4
5
6
7
8
Frequency (GHz)
Pout (dBm)
Psat
P1dB
Typical Noise and Power Performance
3236 Scott Boulevard
Santa Clara, California 95054
Phone: (408) 986-5060
Fax: (408) 986-5095
CMM1200-BD
Advanced Product Information - May 2005 V1.5
(3 of 5)
Celeritek reserves the right to make changes without further notice to any products herein. Celeritek makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Celeritek assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters can and do vary in different applications. All operating
parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Celeritek does not convey any license under its patent
rights nor the rights of others. Celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Celeritek product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Celeritek products for any such unintended or unauthorized application, Buyer shall indemnify and hold Celeritek and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Celeritek was negligent
regarding the design or manufacture of the part. Celeritek is a registered trademark of Celeritek, Inc. Celeritek, Inc. is an Equal Opportunity/Affirmative Action Employer.
Ordering Information
The CMM1200-BD is available in bare die and is shipped in Gel Pak.
Part Number for Ordering
Package
CMM1200-BD
Bare Die
Assembly Example