2005 Microchip Technology Inc.

DS21710D-page 1

24AA08/24LC08B

Device Selection Table

Features:

· Single supply with operation down to 1.8V

· Low-power CMOS technology:

- 1 mA active current, typical

- 1

A standby current, typical (I-temp)

· Organized as 4 blocks of 256 bytes (4 x 256 x 8)

· 2-wire serial interface bus, I

CTM compatible

· Schmitt Trigger inputs for noise suppression

· Output slope control to eliminate ground bounce

· 100 kHz (<2.5V) and 400 kHz (

2.5V) compatibility

· Self-timed write cycle (including auto-erase)

· Page write buffer for up to 16 bytes

· 2 ms typical write cycle time for page write

· Hardware write-protect for entire memory

· Can be operated as a serial ROM

· Factory programming (QTP) available

· ESD protection > 4,000V

· 1,000,000 erase/write cycles

· Data retention > 200 years

· 8-lead PDIP, SOIC, TSSOP, DFN and MSOP

packages

· 5-lead SOT-23 package

· Standard and Pb-free finishes available

· Available for extended temperature ranges:

- Industrial (I): -40°C to +85°C

- Automotive (E): -40°C to +125°C

Description:

The Microchip Technology Inc. 24AA08/24LC08B
(24XX08*) is a 8 Kbit Electrically Erasable PROM. The
device is organized as four blocks of 256 x 8-bit
memory with a 2-wire serial interface. Low voltage
design permits operation down to 1.8V, with standby
and active currents of only 1

A and 1 mA,

respectively. The 24XX08 also has a page write
capability for up to 16 bytes of data. The 24XX08 is
available in the standard 8-pin PDIP, surface mount
SOIC, TSSOP, 2x3 DFN and MSOP packages, and is
also available in the 5-lead SOT-23 package.

Block Diagram

Package Types

Part

Number

Range

Max Clock

Frequency

Temp

Ranges

24AA08

1.8-5.5

400 kHz

(1)

24LC08B

2.5-5.5

400 kHz

I, E

Note 1:

100 kHz for V

<2.5V

EEPROM

Array

Page

YDEC

XDEC

Sense Amp.

Memory

Control

Logic

I/O

Control

Logic

I/O

SDA

SCL

R/W Control

Latches

Generator

SCL

SDA

PDIP, MSOP

SOIC, TSSOP

SCL

SDA

DFN

SCL

SDA

SOT-23-5

SCL

Vss

SDA

Vcc

Note:

Pins A0, A1 and A2 are not used by the 24XX08. (No
internal connections).

8K I

Serial EEPROM

*24XX08 is used in this document as a generic part
number for the 24AA08/24LC08B devices.

24AA08/24LC08B

DS21710D-page 2

2005 Microchip Technology Inc.

Package TypeElectrical Characteristics

Absolute Maximum Ratings

()

.............................................................................................................................................................................6.5V

All inputs and outputs w.r.t. V

......................................................................................................... -0.3V to V

+1.0V

Storage temperature ...............................................................................................................................-65°C to +150°C

Ambient temperature with power applied ................................................................................................-65°C to +125°C

ESD protection on all pins

......................................................................................................................................................

4 kV

TABLE 1-1:

DC CHARACTERISTICS

NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to
the device. This is a stress rating only and functional operation of the device at those or any other conditions
above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating
conditions for extended periods may affect device reliability.

DC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I):

= -40°C to +85°C

Automotive (E): T

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

WP, SCL and SDA pins

High-level input voltage

0.7 V

Low-level input voltage

0.3 V

HYS

Hysteresis of Schmitt
Trigger inputs

0.05 V

(Note)

Low-level output voltage

0.40

= 3.0 mA, V

= 2.5V

Input leakage current

±1

= .1V to V

Output leakage current

±1

OUT

= .1V to V

OUT

Pin capacitance
(all inputs/outputs)

= 5.0V (Note)

= 25°C, F

CLK

= 1 MHz

write

Operating current

0.1

= 5.5V, SCL = 400 kHz

D10

read

0.05

D11

CCS

Standby current

--
--

0.01

1
5

Industrial
Automotive
SDA = SCL = V

WP = V

Note:

This parameter is periodically sampled and not 100% tested.

2005 Microchip Technology Inc.

DS21710D-page 3

24AA08/24LC08B

TABLE 1-2:

AC CHARACTERISTICS

= +1.8V to +5.5V

Industrial (I):

= -40°C to +85°C

Automotive (E):

= -40°C to +125°C

Param.

No.

Symbol

Characteristic

Min

Typ

Max

Units

Conditions

CLK

Clock frequency

--
--

400
100

kHz

2.5V

5.5V

1.8V

2.5V (24AA08)

HIGH

Clock high time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

LOW

Clock low time

1300
4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

SDA and SCL rise time
(Note 1)

--
--

300

1000

2.5V

5.5V (Note 1)

1.8V

2.5V (24AA08)

(Note 1)

SDA and SCL fall time

--
--

300

(Note 1)

STA

Start condition hold time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

STA

Start condition setup
time

600

4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

DAT

Data input hold time

--
--

(Note 2)

DAT

Data input setup time

100
250

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

STO

Stop condition setup
time

600

4000

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

Output valid from clock
(Note 2)

--
--

900

3500

2.5V

5.5V

1.8V

2.5V (24AA08)

BUF

Bus free time: Time the
bus must be free before
a new transmission can
start

1300
4700

--
--

2.5V

5.5V

1.8V

2.5V (24AA08)

Output fall time from V

minimum to V

maximum

20+0.1C

--
--

250
250

2.5V

5.5V

1.8V

2.5V (24AA08)

Input filter spike
suppression
(SDA and SCL pins)

(Notes 1 and 3)

Write cycle time (byte or
page)

Endurance

cycles

25°C, (Note 4)

Note 1:

Not 100% tested. C

= total capacitance of one bus line in pF.

As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.

The combined T

and V

HYS

specifications are due to new Schmitt Trigger inputs which provide improved

noise spike suppression. This eliminates the need for a

specification for standard operation.

This parameter is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total EnduranceTM Model which can be obtained from Microchip's web site:
www.microchip.com.

2005 Microchip Technology Inc.

DS21710D-page 5

24AA08/24LC08B

2.0

FUNCTIONAL DESCRIPTION

The 24XX08 supports a bidirectional, 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter, while a device
receiving data is defined as a receiver. The bus has to
be controlled by a master device which generates the
Serial Clock (SCL), controls the bus access and
generates the Start and Stop conditions, while the
24XX08 works as slave. Both master and slave can
operate as transmitter or receiver, but the master
device determines which mode is activated.

3.0

BUS CHARACTERISTICS

The following bus protocol has been defined:

· Data transfer may be initiated only when the bus

is not busy.

· During data transfer, the data line must remain

stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.

Accordingly, the following bus conditions have been
defined (Figure 2-1).

3.1

Bus Not Busy (A)

Both data and clock lines remain high.

3.2

Start Data Transfer (B)

A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.

3.3

Stop Data Transfer (C)

A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must be ended with a Stop condition.

3.4

Data Valid (D)

The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.

The data on the line must be changed during the low
period of the clock signal. There is one clock pulse per
bit of data.

Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device and is
theoretically unlimited, although only the last sixteen
will be stored when doing a write operation. When an
overwrite does occur it will replace data in a first-in first-
out (FIFO) fashion.

3.5

Acknowledge

Each receiving device, when addressed, is obliged to
generate an acknowledge after the reception of each
byte. The master device must generate an extra clock
pulse which is associated with this Acknowledge bit.

The device that acknowledges, has to pull down the
SDA line during the acknowledge clock pulse in such a
way that the SDA line is stable low during the high
period of the acknowledge related clock pulse. Of
course, setup and hold times must be taken into
account. During reads, a master must signal an end of
data to the slave by not generating an Acknowledge bit
on the last byte that has been clocked out of the slave.
In this case, the slave (24XX08) will leave the data line
high to enable the master to generate the Stop
condition.

FIGURE 3-1:

DATA TRANSFER SEQUENCE ON THE SERIAL BUS

Note:

The 24XX08 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress.

SCL

SDA

(A)

(B)

(D)

(A)

(C)

Start

Condition

Address or

Acknowledge

Valid

Data

Allowed

to Change

Stop

Condition

24AA08/24LC08B

DS21710D-page 6

2005 Microchip Technology Inc.

3.6

Device Addressing

A control byte is the first byte received following the
Start condition from the master device (Figure 2-2).
The control byte consists of a four-bit control code. For
the 24XX08, this is set as `

1010

binary for read and

write operations. The next three bits of the control byte
are the block-select bits (B2, B1, B0). B2 is a "don't
care" for the 24XX08. They are used by the master
device to select which of the four 256 word-blocks of
memory are to be accessed. These bits are in effect the
three Most Significant bits of the word address.

The last bit of the control byte defines the operation to
be performed. When set to `

' a read operation is

selected. When set to `

' a write operation is selected.

Following the Start condition, the 24XX08 monitors the
SDA bus, checking the device type identifier being
transmitted and, upon receiving a `

1010

code, the

slave device outputs an Acknowledge signal on the
SDA line. Depending on the state of the R/W bit, the
24XX08 will select a read or write operation.

FIGURE 3-2:

CONTROL BYTE
ALLOCATION

Operation

Control

Code

Block Select

R/W

Read

1010

Block Address

Write

1010

Block Address

R/W A

Start

Read/Write

SLAVE ADDRESS

x = "don't care"

2005 Microchip Technology Inc.

DS21710D-page 7

24AA08/24LC08B

4.0

WRITE OPERATION

4.1

Byte Write

Following the Start condition from the master, the
device code (4 bits), the block address (3 bits) and the
R/W bit, which is a logic-low, is placed onto the bus by
the master transmitter. This indicates to the addressed
slave receiver that a byte with a word address will
follow once it has generated an Acknowledge bit during
the ninth clock cycle. Therefore, the next byte transmit-
ted by the master is the word address and will be
written into the address pointer of the 24XX08. After
receiving another Acknowledge signal from the
24XX08, the master device will transmit the data word
to be written into the addressed memory location. The
24XX08 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and, during this time, the 24XX08 will not
generate Acknowledge signals (Figure 3-1).

4.2

Page Write

The write control byte, word address and the first data
byte are transmitted to the 24XX08 in the same way as
in a byte write. However, instead of generating a Stop
condition, the master transmits up to 16 data bytes to
the 24XX08, which are temporarily stored in the on-
chip page buffer and will be written into memory once
the master has transmitted a Stop condition. Upon
receipt of each word, the four lower-order address
pointer bits are internally incremented by `

'. The

higher-order 7 bits of the word address remain
constant. If the master should transmit more than 16
words prior to generating the Stop condition, the
address counter will roll over and the previously
received data will be overwritten. As with the byte write
operation, once the Stop condition is received an
internal write cycle will begin (Figure 3-2).

FIGURE 4-1:

BYTE WRITE

FIGURE 4-2:

PAGE WRITE

Note:

Page write operations are limited to writing
bytes within a single physical page,
regardless of the number of bytes
actually being written. Physical page
boundaries start at addresses that are
integer multiples of the page buffer size (or
`page-size') and end at addresses that are
integer multiples of [page size 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page, as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

Control

Byte

Word

Address

Data

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

Control

Byte

Word

Address (n)

Data (n)

Data (n + 15)

Data (n + 1)

24AA08/24LC08B

DS21710D-page 8

2005 Microchip Technology Inc.

5.0

ACKNOWLEDGE POLLING

Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally-timed write cycle and ACK polling
can then be initiated immediately. This involves the
master sending a Start condition followed by the control
byte for a Write command (R/W =

). If the device is still

busy with the write cycle, no ACK will be returned. If the
cycle is complete, the device will return the ACK and
the master can then proceed with the next Read or
Write command. See Figure 4-1 for a flow diagram of
this operation.

FIGURE 5-1:

ACKNOWLEDGE POLLING
FLOW

6.0

WRITE PROTECTION

The 24XX08 can be used as a serial ROM when the
WP pin is connected to V

. Programming will be

inhibited and the entire memory will be write-protected.

Send

Write Command

Send Stop

Condition to

Initiate Write Cycle

Send Start

Send Control Byte

with R/W =

Did Device

Acknowledge

(ACK =

Operation

Yes

2005 Microchip Technology Inc.

DS21710D-page 9

24AA08/24LC08B

7.0

READ OPERATION

Read operations are initiated in the same way as write
operations, with the exception that the R/W bit of the
slave address is set to `

'. There are three basic types

of read operations: current address read, random read
and sequential read.

7.1

Current Address Read

The 24XX08 contains an address counter that main-
tains the address of the last word accessed, internally
incremented by `

'. Therefore, if the previous access

(either a read or write operation) was to address

, the

next current address read operation would access data
from address

n + 1

. Upon receipt of the slave address

with R/W bit set to `

', the 24XX08 issues an acknowl-

edge and transmits the 8-bit data word. The master will
not acknowledge the transfer but does generate a Stop
condition and the 24XX08 discontinues transmission
(Figure 6-1).

7.2

Random Read

Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, the word address must first
be set. This is accomplished by sending the word
address to the 24XX08 as part of a write operation.
Once the word address is sent, the master generates a
Start condition following the acknowledge. This
terminates the write operation, but not before the
internal address pointer is set. The master then issues
the control byte again, but with the R/W bit set to a `

The 24XX08 will then issue an acknowledge and trans-
mit the 8-bit data word. The master will not acknowl-
edge the transfer but does generate a Stop condition
and the 24XX08 will discontinue transmission
(Figure 6-2).

7.3

Sequential Read

Sequential reads are initiated in the same way as a
random read, except that once the 24XX08 transmits
the first data byte, the master issues an acknowledge
as opposed to a Stop condition in a random read. This
directs the 24XX08 to transmit the next sequentially-
addressed 8-bit word (Figure 6-3).

To provide sequential reads, the 24XX08 contains an
internal address pointer that is incremented by one
upon completion of each operation. This address
pointer allows the entire memory contents to be serially
read during one operation.

7.4

Noise Protection

The 24XX08 employs a V

threshold detector circuit

which disables the internal erase/write logic if the V

is below 1.5V at nominal conditions.

The SCL and SDA inputs have Schmitt Trigger and
filter circuits which suppress noise spikes to assure
proper device operation, even on a noisy bus.

FIGURE 7-1:

CURRENT ADDRESS READ

BUS ACTIVITY
MASTER

SDA LINE

BUS ACTIVITY

Control

Byte

Data (n)

R
T

2005 Microchip Technology Inc.

DS21710D-page 11

24AA08/24LC08B

8.0

PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 7-1.

TABLE 8-1:

PIN FUNCTION TABLE

8.1

Serial Address/Data Input/Output
(SDA)

SDA is a bidirectional pin used to transfer addresses
and data into and out of the device. Since it is an open-
drain terminal, the SDA bus requires a pull-up resistor
to V

(typical 10 k

for 100 kHz, 2 k

for 400 kHz).

For normal data transfer, SDA is allowed to change
only during SCL low. Changes during SCL high are
reserved for indicating Start and Stop conditions.

8.2

Serial Clock (SCL)

The SCL input is used to synchronize the data transfer
to and from the device.

8.3

Write-Protect (WP)

The WP pin must be connected to either V

or V

If tied to V

, normal memory operation is enabled

(read/write the entire memory

00-03FFH

If tied to V

, write operations are inhibited. The entire

memory will be write-protected. Read operations are
not affected.

This feature allows the user to use the 24XX08 as a
serial ROM when WP is enabled (tied to V

8.4

A0, A1, A2

The A0, A1 and A2 pins are not used by the 24XX08.
They may be left floating or tied to either V

or V

Name

PDIP

SOIC

TSSOP

DFN

MSOP

SOT-23

Description

Not Connected

Ground

SDA

Serial Address/Data I/O

SCL

Serial Clock

Write-Protect Input

+1.8V to 5.5V Power Supply

2005 Microchip Technology Inc.

DS21710D-page 13

24AA08/24LC08B

Legend: XX...X

Part number or part number code

Temperature (I, E)

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week `01')

NNN

Alphanumeric traceability code (2 characters for small packages)

Pb-free JEDEC designator for Matte Tin (Sn)

Note:

For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.

Note:

In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

Note:

Please visit www.microchip.com/Pbfree for the latest information on Pb-free conversion.

*Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

8-Lead 2x3 DFN

XXX

YWW

244

527

Example:

24AA08/24LC08B

DS21710D-page 14

2005 Microchip Technology Inc.

8-Lead Plastic Dual In-line (P) 300 mil (PDIP)

Units

INCHES*

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

.100

2.54

Top to Seating Plane

.140

.155

.170

3.56

3.94

4.32

Molded Package Thickness

.115

.130

.145

2.92

3.30

3.68

Base to Seating Plane

.015

0.38

Shoulder to Shoulder Width

.300

.313

.325

7.62

7.94

8.26

Molded Package Width

.240

.250

.260

6.10

6.35

6.60

Overall Length

.360

.373

.385

9.14

9.46

9.78

Tip to Seating Plane

.125

.130

.135

3.18

3.30

3.43

Lead Thickness

.008

.012

.015

0.20

0.29

0.38

Upper Lead Width

.045

.058

.070

1.14

1.46

1.78

Lower Lead Width

.014

.018

.022

0.36

0.46

0.56

Overall Row Spacing

.310

.370

.430

7.87

9.40

10.92

Mold Draft Angle Top

Mold Draft Angle Bottom

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

JEDEC Equivalent: MS-001
Drawing No. C04-018

.010" (0.254mm) per side.

§ Significant Characteristic

2005 Microchip Technology Inc.

DS21710D-page 15

24AA08/24LC08B

8-Lead Plastic Small Outline (SN) Narrow, 150 mil (SOIC)

Foot Angle

Mold Draft Angle Bottom

Mold Draft Angle Top

0.51

0.42

0.33

.020

.017

.013

Lead Width

0.25

0.23

0.20

.010

.009

.008

Lead Thickness

0.76

0.62

0.48

.030

.025

.019

Foot Length

0.51

0.38

0.25

.020

.015

.010

Chamfer Distance

5.00

4.90

4.80

.197

.193

.189

Overall Length

3.99

3.91

3.71

.157

.154

.146

Molded Package Width

6.20

6.02

5.79

.244

.237

.228

Overall Width

0.25

0.18

0.10

.010

.007

.004

Standoff

1.55

1.42

1.32

.061

.056

.052

Molded Package Thickness

1.75

1.55

1.35

.069

.061

.053

Overall Height

1.27

.050

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

§ Significant Characteristic

24AA08/24LC08B

DS21710D-page 16

2005 Microchip Technology Inc.

8-Lead Plastic Thin Shrink Small Outline (ST) 4.4 mm (TSSOP)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.30

0.25

0.19

.012

.010

.007

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

0.70

0.60

0.50

.028

.024

.020

Foot Length

3.10

3.00

2.90

.122

.118

.114

Molded Package Length

4.50

4.40

4.30

.177

.173

.169

Molded Package Width

6.50

6.38

6.25

.256

.251

.246

Overall Width

0.15

0.10

0.05

.006

.004

.002

Standoff

0.95

0.90

0.85

.037

.035

.033

Molded Package Thickness

1.10

.043

Overall Height

0.65

.026

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS*

INCHES

Units

Foot Angle

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005" (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086

§ Significant Characteristic

2005 Microchip Technology Inc.

DS21710D-page 17

24AA08/24LC08B

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

(F)

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

.037 REF

Footprint (Reference)

exceed .010" (0.254mm) per side.

Notes:

Drawing No. C04-111

*Controlling Parameter

Mold Draft Angle Top

Mold Draft Angle Bottom

Foot Angle

Lead Width

Lead Thickness

.003

.009

.006

.012

Dimension Limits

Overall Height

Molded Package Thickness

Molded Package Width

Overall Length

Foot Length

Standoff

Overall Width

Number of Pins

Pitch

.016

.024

.118 BSC

.000

.030

.193 TYP.

.033

MIN

Units

.026 BSC

NOM

INCHES

0.95 REF

.009

.016

0.08

0.22

0°

0.23

0.40

8°

MILLIMETERS*

0.65 BSC

0.85

3.00 BSC

0.60

4.90 BSC

.043

.031

.037

.006

0.40

0.00

0.75

MIN

MAX

NOM

1.10

0.80

0.15

0.95

MAX

15°

5°

15°

5°

JEDEC Equivalent: MO-187

0°

8°

5°

15°

24AA08/24LC08B

DS21710D-page 18

2005 Microchip Technology Inc.

5-Lead Plastic Small Outline Transistor (OT) (SOT-23)

Mold Draft Angle Bottom

Mold Draft Angle Top

0.50

0.43

0.35

.020

.017

.014

Lead Width

0.20

0.15

0.09

.008

.006

.004

Lead Thickness

Foot Angle

0.55

0.45

0.35

.022

.018

.014

Foot Length

3.10

2.95

2.80

.122

.116

.110

Overall Length

1.75

1.63

1.50

.069

.064

.059

Molded Package Width

3.00

2.80

2.60

.118

.110

.102

Overall Width

0.15

0.08

0.00

.006

.003

.000

Standoff

1.30

1.10

0.90

.051

.043

.035

Molded Package Thickness

1.45

1.18

0.90

.057

.046

.035

Overall Height

1.90

.075

Outside lead pitch (basic)

0.95

.038

Pitch

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

* Controlling Parameter

Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010" (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091

§ Significant Characteristic

2005 Microchip Technology Inc.

DS21710D-page 19

24AA08/24LC08B

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) Saw Singulated

Exposed Pad Width

Exposed Pad Length

Contact Length

*Controlling Parameter

Contact Width

Drawing No. C04-123

Notes:

Exposed pad dimensions vary with paddle size.

Overall Width

.016

.012

.008

.047

.055

.010

.118 BSC

Number of Pins

Standoff

Contact Thickness

Overall Length

Overall Height

Pitch

Units

Dimension Limits

.000

.001

.008 REF.

.079 BSC

.031

.020 BSC

MIN

INCHES

NOM

0.40

0.25

3.00 BSC

0.30

.020

.071

.012

.064

0.20

1.20

1.39

0.50

0.30

1.80

1.62

0.02

0.80

2.00 BSC

0.20 REF.

0.50 BSC

MILLIMETERS*

.002

.039

0.00

MIN

MAX

NOM

0.05

1.00

MAX

Package may have one or more exposed tie bars at ends.

Pin 1 visual index feature may vary, but must be located within the hatched area.

0.90

.035

(Note 3)

4. JEDEC equivalent: MO-229

TOP VIEW

EXPOSED

PAD

METAL

BOTTOM VIEW

(NOTE 1)

EXPOSED

TIE BAR

PIN 1

(NOTE 2)

ID INDEX

AREA

Revised 05/24/04

2005 Microchip Technology Inc.

DS21710D-page 21

24AA08/24LC08B

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:

· Product Support Data sheets and errata,

application notes and sample programs, design
resources, user's guides and hardware support
documents, latest software releases and archived
software

· General Technical Support Frequently Asked

Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing

· Business of Microchip Product selector and

ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION
SERVICE

Microchip's customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.

To register, access the Microchip web site at
www.microchip.com, click on Customer Change
Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance
through several channels:

· Distributor or Representative

· Local Sales Office

· Field Application Engineer (FAE)

· Technical Support

· Development Systems Information Line

Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.

Technical support is available through the web site
at: http://support.microchip.com

In addition, there is a Development Systems
Information Line which lists the latest versions of
Microchip's development systems software products.
This line also provides information on how customers
can receive currently available upgrade kits.

The Development Systems Information Line
numbers are:

1-800-755-2345 United States and most of Canada

1-480-792-7302 Other International Locations

24AA08/24LC08B

DS21710D-page 22

2005 Microchip Technology Inc.

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To:

Technical Publications Manager

RE:

Reader Response

Total Pages Sent ________

From: Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature

Number:

Questions:

FAX: (______) _________ - _________

DS21710D

24AA08/24LC08B

What are the best features of this document?

How does this document meet your hardware and software development needs?

Do you find the organization of this document easy to follow? If not, why?

What additions to the document do you think would enhance the structure and subject?

What deletions from the document could be made without affecting the overall usefulness?

Is there any incorrect or misleading information (what and where)?

How would you improve this document?

2005 Microchip Technology Inc.

DS21710D-page 23

24AA08/24LC08B

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office

Sales and Support

Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

Your local Microchip sales office

The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

PART NO.

/XX

Package

Temperature

Range

Device

24AA08:

1.8V, 16 Kbit I

C Serial EEPROM

24AA08T:

1.8V, 16 Kbit I

C Serial EEPROM

(Tape and Reel)

24LC08B:

2.5V, 16 Kbit I

C Serial EEPROM

24LC08BT: =

2.5V, 16 Kbit I

C Serial EEPROM

(Tape and Reel)

Temperature
Range:

= -40°C to +85°C

= -40°C to +125°C

Package:

Plastic DIP (300 mil body), 8-lead

Plastic SOIC (150 mil body), 8-lead

Plastic TSSOP (4.4 mm), 8-lead

2x3 DFN, 8-lead

Plastic Micro Small Outline (MSOP), 8-lead

SOT-23, 5-lead (Tape and Reel only)

Lead Finish

Blank =

Standard 63% / 37% SnPb

Matte Tin (Pure Sn)

Examples:

24AA08-I/P: Industrial Temperature,1.8V,
PDIP package

24AA08-I/SN: Industrial Temperature,1.8V,
SOIC package

24AA08T-I/OT: Industrial Temperature,
1.8V, SOT-23 package, Tape and Reel

24LC08B-I/P: Industrial Temperature, 2.5V,
PDIP package

24LC08B-E/SN: Automotive Temp.,2.5V
SOIC package

24LC08BT-I/OT: Industrial Temperature,
2.5V, SOT-23 package, Tape and Reel

24LC08B-I/PG: Industrial Temperature,
2.5V, PDIP package, Pb-free

24LC08BT-I/SNG: Industrial Temperature,
2.5V, SOIC package, Tape and Reel,
Pb-free

Lead Finish

2005 Microchip Technology Inc.

DS21710D-page 25

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR-
RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip's products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

, micro

, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

Printed on recycled paper.

Note the following details of the code protection feature on Microchip devices:

Microchip products meet the specification contained in their particular Microchip Data Sheet.

Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

Microchip is willing to work with the customer who is concerned about the integrity of their code.

Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company's quality system processes and
procedures are for its PICmicro

8-bit MCUs, K

code hopping

devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip's quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

DS21710D-page 26

2005 Microchip Technology Inc.

AMERICAS

Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com

Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307

Boston
Westford, MA
Tel: 978-692-3848
Fax: 978-692-3821

Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075

Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924

Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260

Kokomo
Kokomo, IN
Tel: 765-864-8360
Fax: 765-864-8387

Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608

San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286

Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509

ASIA/PACIFIC

Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755

China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104

China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599

China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521

China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431

China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393

China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760

China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571

China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205

ASIA/PACIFIC

India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062

India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632

Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122

Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934

Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850

Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803

Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102

Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459

EUROPE

Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829

France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79

Germany - Ismaning
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44

Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781

Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340

England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820

ORLDWIDE

ALES

AND

ERVICE

10/20/04

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24LC08B

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24LC08B

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: 24LC08B