DESCRIPTION
s
Accepts up to 10.7Gbps data
s
< 45ps edge rate
s
Gain
4V/V
s
CML/PECL differential inputs
s
CML outputs
s
Internal 50
input termination
s
Internal 50
output load resistors
s
Available in die or 16-pin (3mm
3mm) MLF package
FEATURES
3.3V 10Gbps DIFFERENTIAL
CML LINE DRIVER/RECEIVER
WITH INTERNAL TERMINATION
SY58016L
FINAL
APPLICATIONS
s
Backplane buffering
s
OC-3/OC-192 SONET clock or data distribution/driver
s
All GigE clock or data distribution/driver
s
Fibre Channel distribution/driver
1
Rev.: A
Amendment: /0
Issue Date:
September 2002
The SY58016L is a high-speed, current mode logic (CML)
differential receiver. It is ideal for interfacing with high
frequency sources. It can be used as Line Receiver, Line
Driver and Limiting Amplifier. The device can be operated
from DC to 10Gbps. The input incorporates internal
temination resistors, and directly interfaces to a CML logic
signal. The output is CML compatible, and includes 50
load resistors.
FUNCTIONAL BLOCK DIAGRAM
TYPICAL PERFORMANCE
MLF and
Micro
LeadFrame are trademarks of Amkor Technology, Inc.
16
15
14
13
5
6
7
8
1
2
3
4
12
11
10
9
V
TR
*
V
TR
*
V
CC
V
EE
V
EE
V
CC
Q
V
TR
*
V
TR
*
/Q
D
/D
V
CC
V
EE
V
EE
V
CC
V
CC
50
50
V
CC
50
V
CC
V
CC
50
*V
TR
is not connected to the DIE.
400mV Output Swing
100mV Input Swing
50
50
Backplane
100mV In
400mV Out
(< 45ps Edge Rate)
SY58016L
2
SY58016L
Micrel
Pin Number
Pin Name
Pin Function
1, 4
D, /D
CML, PECL Differential Inputs with internal 50
pull-up resistors.
2, 3, 10, 11
VTR
Transmission Line Return: Normally connected to the most positive supply.
6, 7, 14, 15
VEE
Most Negative Supply. Exposed pad to be at the same electrical potential as VEE pins.
Exposed pad
12, 9
Q, /Q
CML Differential Outputs with internal 50
pull-up resistors.
5, 8, 13, 16
VCC
Positive Power Supply: +3.3V nominal.
PACKAGE/ORDERING INFORMATION
Ordering Information
Package
Operating
Package
Part Number
Type
Range
Marking
SY58016LXC
DIE
25
C
--
SY58016LMI
MLF-16
Industrial
016L
SY58016LMITR*
MLF-16
Industrial
016L
*Tape and Reel
PIN DESCRIPTION
1
2
3
4
12
11
10
9
16 15 14 13
5
6
7
8
D
VTR
VTR
/D
Q
VTR
VTR
/Q
VCC
VEE
VEE
VCC
VCC
VEE
VEE
VCC
16-pin
MLF
16-Pin MLF
(MLF-16)
3
SY58016L
Micrel
Absolute Maximum Ratings
(Note 1)
Supply Voltage
V
CC
V
EE
| ...........................................
+4.0V
Output Voltage (V
OUT
) .............................. Max. V
CC
+0.5V
........................................................... Min. V
CC
1.0V
Maximum Input Current (I
IN
) ....................................
25mA
Maximum Output Current (I
OUT
) ..............................
25mA
Lead Temperature (Soldering, 10 sec.) .................... 220
C
Operating Ratings
(Note 2)
Supply Voltage (V
IN
)
Input Voltage (V
CC
= 0V) ......................... 1.0V to +0.5V
Input Voltage (V
EE
= 0V) ........... V
CC
1.0V to V
CC
+0.5V
Ambient Temperature (T
A
) ......................... 40
C to +85
C
Storage Temperature (T
S
) ....................... 65
C to +150
C
Package Thermal Resistance
MLF
(
JA
)
Still Air ............................................................. 60
C/W
500lfpm ............................................................ 54
C/W
MLF (
JB
)
(Note 4) .............................................................
32
C/W
V
EE
= GND, V
CC
= +3.3V
10%
Symbol
Parameter
Condition
Min
Typ
Max
Units
I
EE
Power Supply Current
--
50
75
mA
R
IN
Input Resistance
40
50
60
R
OUT
Output Source Impedance
40
50
60
V
IH
Input HIGH Voltage
V
CC
0.9
--
V
CC
V
V
IL
Input LOW Voltage
V
CC
1.0
--
V
CC
0.1
V
V
OH
Output HIGH Voltage
Note 1
V
CC
0.040 V
CC
0.010
V
CC
V
V
OL
Outuput LOW Voltage
Note 1
--
V
CC
0.400 V
CC
0.325
V
V
OUT(swing)
Output Voltage Swing
Note 1
325
400
--
mVp-p
Note 1. 50
output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition.
DC ELECTRICAL CHARACTERISTICS
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is
not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG
conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. The device
is tested in a socket such that transverse airflow of
500lfpm is maintained.
Note 4.
Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
Q
OUT
/Q
OUT
V
IN
,
V
OUT
400mV (typical)
Q
OUT
/Q
OUT
V
DIFF--IN
,V
DIFF--OU
800mV
Q
OUT
--
/Q
OUT
Figure 1. Input/Output Swing
4
SY58016L
Micrel
V
EE
= GND, V
CC
= +3.3V
10%
Symbol
Parameter
Condition
Min
Typ
Max
Units
f
MAX
Maximum Data Rate
10.7
--
--
Gbps
t
PLH
Propagation Delay
--
100
150
ps
t
PHL
t
JITTER
Random Jitter
Note 1
--
--
1.5
ps(rms)
Deterministic Jitter
Note 2
--
--
15
ps(pk-pk)
V
IN
Minimum Input Swing
Note 3
100
--
--
mVp-p
t
r
, t
f
Output Rise/Fall Times
Note 4
--
30
45
ps
(20% to 80%)
Note 1.
Measured with a K28.7 comma detect character pattern, measured at 10Gbps. See "Figure 2. Eye Diagram."
Note 2.
Measured with a K28.5 pattern 2
23
1 PRBS pattern at 10Gbps.
Note 3.
Minimum input swing for which AC parameters are guaranteed. See Figure 1. Reduced input swing will impact maximum data rate and the
resulting eye pattern.
Note 4.
50
load and input swing is more than 100mVp-p.
AC ELECTRICAL CHARACTERISTICS
EYE DIAGRAM
Figure 2. Eye Diagram
5
SY58016L
Micrel
MICREL, INC.
1849 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 944-0970
WEB
http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or
other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc.
2002 Micrel, Incorporated.
16 LEAD
MicroLeadFrameTM (MLF-16)
3.00BSC
2.75BSC
0.50 DIA
3.00BSC
12
max
SEATING
PLANE
2.75BSC
16
1
1
2
3
4
N
2
3
4
0.85
+0.15
0.65
0.65
+0.15
0.65
0.01
+0.04
0.01
0.23
+0.07
0.05
0.01
+0.04
0.01
0.42
+0.18
0.18
0.42
+0.18
0.18
0.23
+0.07
0.05
1.60
+0.10
0.10
PIN 1 ID
0.5 BSC
1.5 REF
0.42
+0.18
0.18
1.60
+0.10
0.10
0.40
+0.05
0.05
0.20 REF.
0.5BSC
SECTION "C-C"
SCALE: NONE
TOP VIEW
BOTTOM VIEW
1. DIMENSIONS ARE IN mm.
2. DIE THICKNESS ALLOWABLE IS 0.305mm MAX.
3. PACKAGE WARPAGE MAX 0.05mm.
4. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED
BETWEEN 0.20mm AND 0.25mm FROM TIP.
5. APPLIES ONLY FOR TERMINALS
C C
CL
4
Rev. 02
Package Notes:
1.
Package meets Level 2 Moisture Sensitivity Classification and is shipped in Dry-pack form.
2.
Expose pad must be soldered to a ground for proper thermal management.
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