MLX902xx Name of Sensor
Rev Y.X
22/Aug/98
Page 1
MLX10410 8 Fold High Side Driver
Page 1
Rev 1.1 16/Apr/01
3901010410
Page 1
Aug/02
Rev. 003
Features and Benefits
Small package (SOIC20)
Short-circuit protection
Diagnostic features
Current limitation
Low-power consumption
Over-temperature protection
Direct micro controller compatible
Integrated free wheel diodes
Applications
Automotive climate Control
Dashboard
Industrial Actuator control
Ordering Information
Part No.
Temperature Suffix
Package Code
Option code
MLX10410
E (-40C to 85C)
DF (SOIC-20)
CA
The 10410 is a high-side driver for automotive applications. It can drive small lamps, relays, coils etc. The output current
can be up to 250mA per driver (current limit at minimum 250mA).
The IC will only react to commands on the bus if the CEN (chip enable) signal is high. The CEN signal has nothing to do
with the power down mode, the IC will react to the micro controller commands if CEN is high.
Functional Diagram
ADR2
ADR1
ADR0
CEN
DATAI
DATAO
STROBE
OTB
VCC1
VCC2
VDD
GND
OSCILLATOR
BG OVER-VOLT
PROTECT
OVER-TEMP
PROTECT
STAND-BY
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUTPUT
CURRENT LIMIT
DETECT C.C.
LOGIC
OUT7
OUT6
OUT5
OUT4
OUT3
OUT2
OUT1
OUT0
Figure 1
Description
MLX10410 8 Fold High Side Driver
Page 2
Rev 1.1 16/Apr/01
3901010410
Page 2
Aug/02
Rev. 003
In order to switch a particular output, it is necessary to apply its address on the 3 bit bus and the data on the input
DATAI. A high level on STROBE will latch the data and switch the output. When the IC is in active mode and CEN is
high, the logic level of the addressed output will be available on the pin DATAO.
When all 8 outputs are inactive (latched value is low) the circuit automatically switches to power down mode.
Diagnostic mode: when the DATAI is low and the STROBE is high, a 50K pull up to VCC is switched on, on the
corresponding output channel (addressed by ADR2, ADR1, ADR0) to see whether there is a load connected. The logic
level of the output can be observed on the pin DATAO. In this way, it is possible to scan all the outputs for an open
circuit.
When the IC is in active mode, then there is an over-temperature sensor that monitors the temperature of the IC. If the
die temperature goes above 165
C, all outputs are switched off and the output OTB will go low. As soon as the
temperature decreases below 125
C all outputs are switched back to their previous state.
The outputs are short-circuit proof against GND and VCC. When an output is shorted to GND, the current is limited and,
after a delay of typically 20ms, the output is switched off and the output OTB goes low. A delay is used to guarantee that
the output does not detect a short circuit when a normal lamp is driven. The latched value of the ouput is set to 0. A
rising edge on CEN will set OTB back to 1. When an output is shorted to a supply larger than VCC+100mV, the output
driver bulk is immediately disconnect from VCC, and after a delay of typically 20ms, the output is switched off and the
output OTB goes low. The latched value of the ouput is set to 0. A rising edge on CEN will set OTB back to 1
There is an over-voltage shut off that switches all the outputs off when the VCC voltage is above 18V for at least 1ms.
When an over-voltage occurs, CEN being low, DATAO pin will go low. The outputs will come on again as soon as the
voltage decreases below 18V. The status of all 8 outputs stays latched.
Every output stage is protected with a free wheel diode both to ground and to VCC.
Active mode
CEN
STROBE DATA I
Description
DATA O
OTB
0
0
0
0
0
1
Chip
0 Over-voltage
0
1
0
Disabled
1
No Over-
voltage
0
Over-temperature
0
1
1
OR
1
0
0
No Command
Addressed
output
Short-circuit to
GND
1
0
1
No Command
logic level
1
1
0
Addressed output
0
Load
1
No Over-
temperature
turned OFF
(Diagnostic mode)
1
No Load
1
1
1
Addressed output
turned ON
Addressed
output logic
level (always
1)
Table 1
MLX902xx Name of Sensor
Rev Y.X
22/Aug/98
Page 3
MLX10410 8 Fold High Side Driver
Page 3
Rev 1.1 16/Apr/01
3901010410
Page 3
Aug/02
Rev. 003
ABSOLUTE MAXIMUM RATINGS
VCC
-0.3 to 40V
VDD
-0.3 to 5.5V
Maximum Output Voltage
-0.3V to VCC+0.3V
Maximum Output Current
550mA
Maximum Free-Wheel Diodes Current
250mA
Die Temperature
+170C
Thermal Resistance Package
85
K/W
Storage Temperature
-55 C to 125C
ESD Protection all pins
(human body model)
2KV
Description
Limits
Min
Typ
Max
Units
t
sw
STROBE pulse width
1.0
us
t
sds
DATAI to STROBE setup time
0.1
us
t
hds
DATAI to STROBE hold time
0.1
us
t
scs
CEN to STROBE setup time
0.1
us
t
shs
CEN to STROBE hold time
0.1
us
t
dso
STROBE to OUTPUT delay (R
on
reached
20% of nominal value)
10
us
t
dov
Delay between Over voltage detection and
outputs switched off
0.5
1.0
2.0
ms
t
dso
Delay between short circuit detection and
output switched off
12
20
40
ms
t
rov
Recovery time from an over voltage detec-
tion
10
us
Characteristics
DYNAMIC CHARACTERISTICS
MLX10410 8 Fold High Side Driver
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Electrical Characteristics
Following characteristics are valid over the temperature range from 40C to +85C
unless otherwise specified.
Characteristics
Limits
Min
Typ
Max
Units
Supply voltage VDD
4.5
5.0
5.5
V
Supply voltage VCC
4.5
25
V
Supply current Iccs
all outputs switched off
200
A
Supply current Icca
all outputs on and no
load
1000
A
Supply current Icci
VCC=12V, one output
on and no load
200
A
Supply current Iccm
VCC=12V, one output
on, no load, per supple-
mentary output on
25
A
Supply current Idds
all outputs switched off
100
A
Supply current Idda
all outputs on and no
load
500
A
Supply current Iddi
one output on and no
load
150
A
Input threshold
ADR2, ADR1, ADR0, DATAI,
STROBE, CEN
0.25*VDD
0.75*VDD
V
Input hysteresis
ADR2, ADR1, ADR0, DATAI,
STROBE, CEN
0.1*VDD
V
Input current
ADR2, ADR1, ADR0, DATAI,
STROBE, CEN
V D D = 5 V
a n d
0<Vin<VDD
-1.0
0.0
1.0
A
Vol
DATAO, OTB
Iout=1mA
0.5
V
Voh
DATAO
Iout=1mA
VDD-0.5
V
Iohl
OTB
Vout=5V
-1.0
1.0
A
Input threshold
OUT7-0
diagnostic mode
0.2*VDD
0.3*VDD
V
Pull up resistor
diagnostic mode
25
50
100
K
W
Output resistance
Ron(OUT7-0)
active mode
Iout=200mA, VCC=12V
2.5
4.0
W
Output current limitation
Ilim(OUT7-0)
VCC=12V and Vout=0V
250
500
mA
Output short circuit threshold
(OUT7-0)
2/3VCC -0.5
2/3VCC
2/3VCC +0.5
V
Over voltage Shut-Off threshold
VCC
18.0
21.0
24
V
Over voltage Shut-Off Hysteresis
VCC
1.0
V
Over temperature Shut-Off
Tj
150
165
180
C
Test Conditions
MLX902xx Name of Sensor
Rev Y.X
22/Aug/98
Page 5
MLX10410 8 Fold High Side Driver
Page 5
Rev 1.1 16/Apr/01
3901010410
Page 5
Aug/02
Rev. 003
Name
Function
VCC1, VCC2
power inputs, both inputs need to be connected.
GND
circuit ground
VDD
5V logic supply
OUT7,
OUT0 power outputs
DATAI
data input
STROBE
data is latched on the high level of strobe
ADR2, ADR1, ADR0
address for output selection
DATAO
data output
OTB
open drain output that indicates that the IC is in over
temperature protection
CEN
chip enable signal (in a system with only one IC, it is
possible to connect this signal directly to VDD).
Pin 1: VDD
Pin 20: CEN
Pin 2: OTB
Pin 19: DATAO
Pin 3: GND
Pin 18: OUT7
Pin 4: OUT0
Pin 17: OUT6
Pin 5: OUT1
Pin 16: VCC
Pin 6: VCC
Pin 15: OUT5
Pin 7: OUT2
Pin 14: OUT4
Pin 8: OUT3
Pin 13:STROBE
Pin 9:ADR2
Pin 12:DATAI
Pin 10:ADR1
Pin 11: ADR0
Pin Assignment
MLX10410 8 Fold High Side Driver
Page 6
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Rev. 003
Reliability Information
Melexis devices are classified and qualified regarding suitability for infrared, vapor phase and wave
soldering with usual (63/37 SnPb-) solder (melting point at 183degC).
The following test methods are applied:
IPC/JEDEC J-STD-020A (issue April 1999)
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
CECC00802 (issue 1994)
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
MIL 883 Method 2003 / JEDEC-STD-22 Test Method B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification
tests have to be agreed upon with Melexis.
The application of Wave Soldering for SMD's is allowed only after consulting Melexis regarding as-
surance of adhesive strength between device and board.
For more information on manufacturability/solderability see quality page at our website:
http://www.melexis.com/
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products
MLX902xx Name of Sensor
Rev Y.X
22/Aug/98
Page 7
MLX10410 8 Fold High Side Driver
Page 7
Rev 1.1 16/Apr/01
3901010410
Page 7
Aug/02
Rev. 003
Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the informati-
on set forth herein or regarding the freedom of the described devices from patent infringement. Melexis reser-
ves the right to change specifications and prices at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with Melexis for current information. This product is intended
for use in normal commercial applications. Applications requiring extended temperature range, unusual environ-
mental requirements, or high reliability applications, such as military, medical life-support or life-sustaining
equipment are specifically not recommended without additional processing by Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be lia-
ble to recipient or any third party for any damages, including but not limited to personal injury, property damage,
loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obli-
gation or liability to recipient or any third party shall arise or flow out of Melexis' rendering of technical or other
services.
2002 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at:
www.melexis.com
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