DEVICES INCORPORATED
LF2246
11 x 10-bit Image Filter
Video Imaging Products
08/16/2000LDS.2246-K
2-11
u
u
u
u
u
66 MHz Data and Coefficient Input
and Computation Rate
u
u
u
u
u Four 11 x 10-bit Multipliers with
Individual Data and Coefficient
Inputs and a 25-bit Accumulator
u
u
u
u
u User-Selectable Fractional or
Integer Two's Complement Data
Formats
u
u
u
u
u Fully Registered, Pipelined Archi-
tecture
u
u
u
u
u Input and Output Data Registers,
with User-Configurable Enables
u
u
u
u
u Three-State Outputs
u
u
u
u
u Fully TTL Compatible
u
u
u
u
u Ideally Suited for Image Processing
and Filtering Applications
u
u
u
u
u Replaces TRW/Raytheon/Fairchild
TMC2246
u
u
u
u
u 120-pin PQFPP
FEATURES
DESCRIPTION
LF2246
11 x 10-bit Image Filter
DEVICES INCORPORATED
The LF2246 consists of an array of
four 11 x 10-bit registered multipliers
followed by a summer and a 25-bit
accumulator. All multiplier inputs
are user accessible and can be up-
dated every clock cycle with either
fractional or integer two's comple-
ment data. The pipelined architecture
has fully registered input and output
ports and an asynchronous three-state
output enable control to simplify the
design of complex systems. The
pipeline latency for all inputs is five
clock cycles.
Storage for mixing and filtering
coefficients can be accomplished by
holding the data or coefficient inputs
over multiple clock cycles. A 25-bit
accumulator path allows cumulative
word growth which may be internally
rounded to 16 bits. Output data is
updated every clock cycle and may be
held under user control. All inputs,
outputs, and controls are registered
on the rising edge of clock, except for
OEN. The LF2246 operates at a clock
rate of 66 MHz over the full tempera-
ture and supply voltage ranges.
The LF2246 is applicable for perform-
ing pixel interpolation in image
manipulation and filtering applica-
tions. The LF2246 can perform a
bilinear interpolation of an image (4-
pixel kernels) at real-time video rates
when used with an image resampling
sequencer. Larger kernels or more
complex functions can be realized by
utilizing multiple devices.
Unrestricted access to all data and
coefficient input ports provides the
LF2246 with considerable flexibility in
applications such as digital filters,
adaptive FIR filters, mixers, and other
similar systems requiring high-speed
processing.
LF2246 B
LOCK
D
IAGRAM
D1
90
C1
100
ENB1
D2
90
C2
100
ENB2
10
25
MS
LS
OCEN
ACC
FSEL
CLK
OEN
TO ALL REGISTERS
S
150
ENSEL
22
22
D3
90
C3
100
ENB3
D4
90
C4
100
ENB4
11
10
11
10
11
10
11
DEVICES INCORPORATED
LF2246
11 x 10-bit Image Filter
Video Imaging Products
2-12
08/16/2000LDS.2246-K
F
IGURE
1
A
.
I
NPUT
F
ORMATS
INPUT REGISTER
ENB1-4
ENSEL
HELD
1
1
Data `
N
'
1
0
Coefficient `
N
'
0
X
None
X = "Don't Care"
`
N
' = 1, 2, 3, or 4
T
ABLE
1.
I
NPUT
R
EGISTER
C
ONTROL
SIGNAL DEFINITIONS
Power
V
CC
and GND
+5 V power supply. All pins must be
connected.
Clock
CLK -- Master Clock
The rising edge of CLK strobes all en-
abled registers. All timing specifica-
tions are referenced to the rising edge of
CLK.
Inputs
D1
90
D4
90
-- Data Input
D1D4 are 10-bit data input registers.
The LSB is D
N0
(Figure 1a).
C1
100
C4
100
-- Coefficient Input
C1C4 are 11-bit coefficient input regis-
ters. The LSB is C
N0
(Figure 1a).
Outputs
S
150
-- Data Output
The current 16-bit result is available on
the S
150
outputs (Figure 1b).
OCEN -- Clock Enable
When OCEN is LOW, data in the pre-
mux register (accumulator output) is
loaded into the output register on the
next rising edge of CLK. When OCEN
is HIGH, data in the pre-mux register is
held preventing the output register's
contents from changing (if FSEL does
not change). Accumulation continues
internally as long as ACC is HIGH,
despite the state of OCEN.
FSEL -- Format Select
When the FSEL input is LOW, the data
input during the current clock cycle is
assumed to be in fractional two's
complement format, and the upper 16
bits of the accumulator are presented at
the output. Rounding of the accumula-
tor result to 16 bits is performed if the
accumulator control input ACC is
LOW. When FSEL is HIGH, the data
input is assumed to be in integer two's
complement format, and the lower 16
bits of the accumulator are presented at
the output. No rounding is performed
when FSEL is HIGH.
ACC -- Accumulator Control
The ACC input determines whether in-
ternal accumulation is performed on
the data input during the current clock
cycle. If ACC is LOW, no accumulation
is performed, the prior accumulated
sum is cleared, and the current sum of
products is output. If FSEL is also LOW,
one-half LSB rounding to 16 bits is per-
formed on the result. This allows sum-
mations without propagating roundoff
errors. When ACC is HIGH, the emerg-
ing product is added to the sum of the
previous products, without additional
rounding.
F
IGURE
1
B
.
O
UTPUT
F
ORMATS
15 14 13
10
9
8
12 11
7
6
5
4
3
2
1
0
2
6
(Sign)
2
5
2
4
2
1
2
0
2
1
2
3
2
2
2
2
2
3
2
4
2
5
2
6
2
7
2
8
2
9
Fractional Two's Complement (FSEL = 0)
15 14 13
10
9
8
12 11
7
6
5
4
3
2
1
0
2
15
(Sign)
2
14
2
13
2
10
2
9
2
8
2
12
2
11
2
7
2
6
2
5
2
4
2
3
2
2
2
1
2
0
Integer Two's Complement (FSEL = 1)
Data
9
8
7
2
1
0
2
9
(Sign)
2
8
2
7
2
2
2
1
2
0
10
9
8
2
1
0
2
10
(Sign)
2
9
2
8
2
2
2
1
2
0
Integer Two's Complement (FSEL = 1)
9
8
7
2
1
0
2
0
(Sign)
2
1
2
2
2
7
2
8
2
9
10
9
8
2
1
0
2
1
(Sign)
2
0
2
1
2
7
2
8
2
9
Fractional Two's Complement (FSEL = 0)
Coefficient
Controls
ENB1ENB4 -- Input Enable
The ENB
N
(
N
= 1, 2, 3, or 4) input allows
either or both the D
N
and C
N
registers to
be updated on each clock cycle. When
ENB
N
is LOW, registers D
N
and C
N
are
both strobed by the next rising edge of
CLK. When ENB
N
is HIGH and ENSEL
is LOW, register D
N
is strobed while
register C
N
is held. If both ENB
N
and
ENSEL are HIGH, register D
N
is held,
and register C
N
is strobed (Table 1).
ENSEL -- Enable Select
The ENSEL input in conjunction with
the individual input enables ENB1
ENB4 determines whether the data or
the coefficient input registers will be
held on the next rising edge of CLK
(Table 1).
OEN -- Output Enable
When the OEN signal is LOW, the cur-
rent data in the output register is avail-
able on the S
150
pins. When OEN is
HIGH, the outputs are in a high-imped-
ance state.
DEVICES INCORPORATED
LF2246
11 x 10-bit Image Filter
Video Imaging Products
08/16/2000LDS.2246-K
2-13
Symbol
Parameter
Test Condition
Min
Typ
Max
Unit
V
OH
Output High Voltage
V
CC
= Min., I
OH
= 2.0 mA
2.4
V
V
OL
Output Low Voltage
V
CC
= Min., I
OL
= 4.0 mA
0.4
V
V
IH
Input High Voltage
2.0
V
CC
V
V
IL
Input Low Voltage
(Note 3)
0.0
0.8
V
I
IX
Input Current
Ground
V
IN
V
CC
(Note 12)
10
A
I
OZ
Output Leakage Current
(Note 12)
40
A
I
CC1
V
CC
Current, Dynamic
(Notes 5, 6)
100
mA
I
CC2
V
CC
Current, Quiescent
(Note 7)
6
mA
C
IN
Input Capacitance
T
A
= 25C, f = 1 MHz
10
pF
C
OUT
Output Capacitance
T
A
= 25C, f = 1 MHz
10
pF
Storage temperature ........................................................................................................... 65C to +150C
Operating ambient temperature ........................................................................................... 55C to +125C
V
CC
supply voltage with respect to ground ............................................................................ 0.5 V to +7.0 V
Input signal with respect to ground ............................................................................... 0.5 V to V
CC
+ 0.5 V
Signal applied to high impedance output ...................................................................... 0.5 V to V
CC
+ 0.5 V
Output current into low outputs ............................................................................................................. 25 mA
Latchup current ............................................................................................................................... > 400 mA
M
AXIMUM
R
ATINGS
Above which useful life may be impaired (Notes 1, 2, 3, 8)
O
PERATING
C
ONDITIONS
To meet specified electrical and switching characteristics
E
LECTRICAL
C
HARACTERISTICS
Over Operating Conditions (Note 4)
Mode
Temperature Range (Ambient)
Supply
Voltage
Active Operation, Commercial
0C to +70C
4.75 V
V
CC
5.25 V
Active Operation, Military
55C to +125C
4.50 V
V
CC
5.50 V
DEVICES INCORPORATED
LF2246
11 x 10-bit Image Filter
Video Imaging Products
2-14
08/16/2000LDS.2246-K
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LF2246
33*
25
15
Symbol
Parameter
Min
Max
Min
Max
Min
Max
t
CYC
Cycle Time
33
25
15
t
PWL
Clock Pulse Width Low
15
10
7
t
PWH
Clock Pulse Width High
10
10
7
t
S
Input Setup Time
10
8
5
t
H
Input Hold Time
0
0
0
t
D
Output Delay
15
13
11
t
DIS
Three-State Output Disable Delay
(Note 11)
15
15
15
t
ENA
Three-State Output Enable Delay
(Note 11)
15
15
15
SWITCHING CHARACTERISTICS
C
OMMERCIAL
O
PERATING
R
ANGE
(0C to +70C)
Notes 9, 10 (ns)
LF2246
33*
25*
Symbol
Parameter
Min
Max
Min
Max
t
CYC
Cycle Time
33
25
t
PWL
Clock Pulse Width Low
15
10
t
PWH
Clock Pulse Width High
10
10
t
S
Input Setup Time
10
8
t
H
Input Hold Time
0
0
t
D
Output Delay
15
13
t
DIS
Three-State Output Disable Delay
(Note 11)
15
15
t
ENA
Three-State Output Enable Delay
(Note 11)
15
15
M
ILITARY
O
PERATING
R
ANGE
(55C to +125C)
Notes 9, 10 (ns)
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*D
ISCONTINUED
S
PEED
G
RADE
S
WITCHING
W
AVEFORMS
CLK
t
H
t
DIS
D1
9-0
D4
9-0
C1
10-0
C4
10-0
OEN
S
15-0
D
N
C
N
t
S
D
N+1
C
N+1
t
ENA
HIGH IMPEDANCE
t
PWH
t
PWL
t
D
S
N1
S
N
S
N+1
1
2
3
4
5
6
CONTROLS
(Except OEN)
DEVICES INCORPORATED
LF2246
11 x 10-bit Image Filter
Video Imaging Products
08/16/2000LDS.2246-K
2-15
1. Maximum Ratings indicate stress
specifications only. Functional oper-
ation of these products at values beyond
those indicated in the Operating Condi-
tions table is not implied. Exposure to
maximum rating conditions for ex-
tended periods may affect reliability.
2. The products described by this spec-
ification include internal circuitry de-
signed to protect the chip from damag-
ing substrate injection currents and ac-
cumulations of static charge. Neverthe-
less, conventional precautions should
be observed during storage, handling,
and use of these circuits in order to
avoid exposure to excessive electrical
stress values.
3. This device provides hard clamping of
transient undershoot and overshoot. In-
put levels below ground or above V
CC
will be clamped beginning at 0.6 V and
V
CC
+ 0.6 V. The device can withstand
indefinite operation with inputs in the
range of 0.5 V to +7.0 V. Device opera-
tion will not be adversely affected, how-
ever, input current levels will be well in
excess of 100 mA.
4. Actual test conditions may vary from
those designated but operation is guar-
anteed as specified.
5. Supply current for a given applica-
tion can be accurately approximated by:
where
N = total number of device outputs
C = capacitive load per output
V = supply voltage
F = clock frequency
6. Tested with all outputs changing ev-
ery cycle and no load, at a 30 MHz clock
rate.
7. Tested with all inputs within 0.1 V of
V
CC
or Ground, no load.
8. These parameters are guaranteed
but not 100% tested.
NCV F
4
2
NOTES
9. AC specifications are tested with
input transition times less than 3 ns,
output reference levels of 1.5 V (except
t
DIS
test), and input levels of nominally
0 to 3.0 V. Output loading may be a
resistive divider which provides for
specified I
OH
and I
OL
at an output
voltage of V
OH
min and V
OL
max
respectively. Alternatively, a diode
bridge with upper and lower current
sources of I
OH
and I
OL
respectively,
and a balancing voltage of 1.5 V may be
used. Parasitic capacitance is 30 pF
minimum, and may be distributed.
This device has high-speed outputs ca-
pable of large instantaneous current
pulses and fast turn-on/turn-off times.
As a result, care must be exercised in the
testing of this device. The following
measures are recommended:
a. A 0.1 F ceramic capacitor should be
installed between V
CC
and Ground
leads as close to the Device Under Test
(DUT) as possible. Similar capacitors
should be installed between device V
CC
and the tester common, and device
ground and tester common.
b. Ground and V
CC
supply planes
must be brought directly to the DUT
socket or contactor fingers.
c. Input voltages should be adjusted to
compensate for inductive ground and V
CC
noise to maintain required DUT input
levels relative to the DUT ground pin.
10. Each parameter is shown as a min-
imum or maximum value. Input re-
quirements are specified from the point
of view of the external system driving
the chip. Setup time, for example, is
specified as a minimum since the exter-
nal system must supply at least that
much time to meet the worst-case re-
quirements of all parts. Responses from
the internal circuitry are specified from
the point of view of the device. Output
delay, for example, is specified as a
maximum since worst-case operation of
any device always provides data within
that time.
11. For the t
ENA
test, the transition is
measured to the 1.5 V crossing point
with datasheet loads. For the t
DIS
test,
the transition is measured to the
200mV level from the measured
steady-state output voltage with
10mA loads. The balancing volt-
age, V
TH
, is set at 3.5 V for Z-to-0
and 0-to-Z tests, and set at 0 V for Z-
to-1 and 1-to-Z tests.
12. These parameters are only tested at
the high temperature extreme, which is
the worst case for leakage current.
S1
I
OH
I
OL
V
TH
C
L
DUT
OE
0.2 V
t
DIS
t
ENA
0.2 V
1.5 V
1.5 V
3.5V Vth
1
Z
0
Z
Z
1
Z
0
1.5 V
1.5 V
0V Vth
V
OL
*
V
OH
*
V
OL
*
V
OH
*
Measured V
OL
with I
OH
= 10mA and I
OL
= 10mA
Measured V
OH
with I
OH
= 10mA and I
OL
= 10mA
F
IGURE
B. T
HRESHOLD
L
EVELS
F
IGURE
A. O
UTPUT
L
OADING
C
IRCUIT