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DW9270
The DW9270 has been designed specifically for the Digital
Wireless Communications market, as an IF filter with a centre
frequency of 240MHz. The filter utilises Mitel Semiconductor's
low loss (8.5dB typical), Transversal filter technology based on a
Quartz substrate for excellent temperature stability.
With a typical 3dB passband of 1MHz, and an adjacent
channel rejection of 12dB (min.) the device exhibits excellent
close-in and ultimate rejection, which combined with a Group
Delay Ripple of 200ns (max.) makes the DW9270 an ideal IF filter
for Digital Wireless Communications systems.
The device is available in a surface mount ceramic chip
carrier suited to high volume automated assembly systems.
FEATURES
s
240MHz Centre Frequency (fo)
s
Low Insertion Loss (10dB max.)
s
3dB Passband 1.05MHz (typ.)
s
Quartz Temperature Stability
s
Low Profile Ceramic LCC Package
ABSOLUTE MAXIMUM RATINGS
DC Voltage
VDC
0V
Input Power Max.
PIN
10dBm
NOMINAL IMPEDANCE
Input:
255
// 14pF
Output:
400
// 11.5pF
50
TEST BOARD COMPONENTS
Input:
Shunt Cap. 27pF, Series Ind. 47nH, Shunt Cap. 1.5pF
Output:
Shunt Cap. 1.5pF, Series Ind. 47nH, Shunt Cap. 30pF
Components: Coilcraft 1008CS Inductors : Murata 0805 Capacitors
PACKAGE
13.5mm x 6.5mm : 12 Lead SMD
OPERATION
Balanced or Unbalanced configuration available.
ORDER INFORMATION
Order as: DW9270
OUTPUT
OUTPUT
RETURN
GND
GND
GND
GND
GND
GND
GND
GND
3
4
5
6
12
11
10
9
DW9270
INPUT
INPUT
RETURN
2
1
7
8
LCS12/1
DW9270
240MHz IF SAW Filter
Replaces January 2000 version, DS4024-2.0
DS4024-2.1 July 2002
Fig. 1 Pin connections
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages
and current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today.
The Assembly group offers high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks which have been designed to
optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow
rates) is available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or
Customer Services.
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
SALES OFFICES
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe, Spain & Rest Of World: Tel: +44 (0)1522 502753 / 502901.
Fax: +44 (0)1522 500020
North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
Dynex Semiconductor 2002 TECHNICAL DOCUMENTATION NOT FOR RESALE. PRODUCED IN
UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: +44-(0)1522-500500
Fax: +44-(0)1522-500550
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee
that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure
that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
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