SPEC NO:DSAD1103
REV NO: V.1 DATE:MAR/19/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu DRAWN:Y.H.LI
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
Package Dimensions
3.2x2.4mm SMD CHIP LED LAMP
Features
l
3.2x2.4mm SMT LED, 2.4mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE : 1500PCS / REEL.
APBD3224ESGC HIGH EFFICIENCY RED
SUPER BRIGHT GREEN
Description
The High Efficiency Red source color devices are made
with Gallium Arsenide Phosphide on Gallium Phosphide
Orange Light Emitting Diode.
The Super Bright Green source color devices are made
with Gallium Phosphide Green Light Emitting Diode.
SPEC NO:DSAD1103
REV NO: V.1 DATE:MAR/19/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu DRAWN:Y.H.LI
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Absolute Maximum Ratings at T
A
=25
C
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
ne
er
G
th
gir
B
re
pu
S
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
52
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
06
1
04
1
A
m
eg
atl
oV
es
re
ve
R
5
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
G
S
E4
22
3
D
B
P
A
)P
a
G/
Ps
Aa
G(
D
E
R
Y
C
N
EI
CI
F
F
E
H
GI
H
R
A
EL
C
R
ET
A
W
81
06
0
2
)P
a
G(
N
E
E
R
G
T
H
GI
R
B
R
E
P
U
S
01
04
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
yc
ne
icif
fE
hg
iH
ne
er
G
th
gir
B
re
pu
S
72
6 56
5
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
yc
ne
icif
fE
hg
iH
ne
er
G
th
gir
B
re
pu
S
52
6 86
5
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
yc
ne
icif
fE
hg
iH
ne
er
G
th
gir
B
re
pu
S
54
03
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
yc
ne
icif
fE
hg
iH
ne
er
G
th
gir
B
re
pu
S
51
51
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
yc
ne
icif
fE
hg
iH
ne
er
G
th
gir
B
re
pu
S
0.
2 2.
2
5.
2 5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
llA
01
A
u
V
R
V
5
=
SPEC NO:DSAD1103
REV NO: V.1 DATE:MAR/19/2003
PAGE: 3 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu DRAWN:Y.H.LI
High Efficiency Red / Super Bright Green APBD3224ESGC
SPEC NO:DSAD1103
REV NO: V.1 DATE:MAR/19/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED :Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APBD3224ESGC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP