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Электронный компонент: AM27SEC08

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SPEC NO: DSAD1314
REV NO: V.1
DATE:MAR/29/2003 PAGE: 1 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
SUBMINIATURE SOLID STATE LAMP
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Features
l
SUBMINIATURE PACKAGE.
l
WIDE VIEWING ANGLE.
l
YOKE LEAD.
l
LONG LIFE - SOLID STATE RELIABILITY.
l
LOW PACKAGE PROFILE.
l
PACKAGE :1000PCS / REEL.
Package Dimensions
AM27SEC08 SUPER BRIGHT ORANGE
Description
The Super Bright Orange source color devices are
made with DH InGaAlP on GaAs substrate Light
Emitting Diode.
SPEC NO: DSAD1314
REV NO: V.1
DATE:MAR/29/2003 PAGE: 2 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Electrical / Optical Characteristics at T
A
=25


C
Absolute Maximum Ratings at T
A
=25


C
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Selection Guide
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
eg
na
rO
th
gir
B
re
pu
S
01
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
eg
na
rO
th
gir
B
re
pu
S
10
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
eg
na
rO
th
gir
B
re
pu
S
92
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
eg
na
rO
th
gir
B
re
pu
S
03
F
p
V
F
z
H
M
1=
f;
V
0=
V
F
eg
atl
oV
dr
a
wr
oF
eg
na
rO
th
gir
B
re
pu
S
0.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
eg
na
rO
th
gir
B
re
pu
S
01
A
u
V
R
V
5
=
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
eg
na
rO
th
gir
B
re
pu
S
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
57
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
59
1
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m
eg
atl
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es
re
ve
R
5
V
er
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ot
S/
gn
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O
04
-
58
+
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C
C
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N
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P
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N
tra
P
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N
tra
P
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N
tra
P
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N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
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ep
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eL
ep
yT
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yT
sn
eL
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c
m(
vI
)d
c
m(
vI
)d
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m(
vI
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c
m(
vI
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m(
vI
A
m
02
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gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
80
C
E
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2
M
A
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E
G
N
A
R
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T
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B
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EL
C
R
ET
A
W
08
4
00
31
0
2
SPEC NO: DSAD1314
REV NO: V.1
DATE:MAR/29/2003 PAGE: 3 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Super Bright Orange AM27SEC08
SPEC NO: DSAD1314
REV NO: V.1
DATE:MAR/29/2003 PAGE: 4 OF 4
APPROVED:J.LU
CHECKED:Allen Liu DRAWN:Y.H.LI
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM27SEC08
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.