SPEC NO: DSAC3740
REV NO: V.1
DATE:FEB/14/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
SUBMINIATURE SOLID STATE LAMP
AM2520SURC03 HYPER RED
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the lead emerge package.
4. Specifications are subject to change without notice.
Package Dimensions
Description
The Hyper Red source color devices are made
with DH InGaAlP on GaAs substrate Light Emitting
Diode.
Features
!
SUBMINIA TURE PACKAGE.
!
WIDE VIEWING ANGLE.
!
GULL WING LEAD.
!
LONG LIFE - SOLID STATE RELIABILITY.
!
LOW PACKAGE PROFILE.
!
PACKAGE : 1000PCS / REEL.
SPEC NO: DSAC3740
REV NO: V.1
DATE:FEB/14/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
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m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
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D
e
c
i
v
e
D
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M
.
x
a
M
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
d
e
R
r
e
p
y
H
0
4
6
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
d
e
R
r
e
p
y
H
8
2
6
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-
fl
a
H
e
n
i
L
l
a
r
t
c
e
p
S
d
e
R
r
e
p
y
H
7
2
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
d
e
R
r
e
p
y
H
5
4
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
d
e
R
r
e
p
y
H
9
.
1
5
.
2
V
I
F
A
m
0
2
=
I
R
t
n
e
r
r
u
C
e
s
r
e
v
e
R
d
e
R
r
e
p
y
H
0
1
A
u
V
R
V
5
=
r
e
t
e
m
a
r
a
P
r
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t
e
m
a
r
a
P
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a
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r
a
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d
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R
r
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p
y
H
d
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R
r
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p
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H
d
e
R
r
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p
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H
d
e
R
r
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p
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d
e
R
r
e
p
y
H
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
s
ti
n
U
n
o
it
a
p
i
s
s
i
d
r
e
w
o
P
0
7
1
W
m
t
n
e
r
r
u
C
d
r
a
w
r
o
F
C
D
0
3
A
m
]
1
[
t
n
e
r
r
u
C
d
r
a
w
r
o
F
k
a
e
P
5
8
1
A
m
e
g
a
tl
o
V
e
s
r
e
v
e
R
5
V
e
r
u
t
a
r
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p
m
e
T
e
g
a
r
o
t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
o
T
C
C
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
o
N
t
r
a
P
.
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N
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a
P
.
o
N
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c
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c
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D e
c
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D e
c
i
D e
c
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D
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p
y
T
s
n
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L
e
p
y
T
s
n
e
L
e
p
y
T
s
n
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L
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p
y
T
s
n
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L
e
p
y
T
s
n
e
L
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
)
d
c
m
(
v
I
A
m
0
2
@
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
g
n
i
w
e
i
V
e
l
g
n
A
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
.
p
y
T
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
3
0
C
R
U
S
0
2
5
2
M
A
)
P
l
A
a
G
n
I
(
D
E
R
R
E
P
Y
H
R
A
E
L
C
R
E
T
A
W
0
8
2
0
6
6
0
2
SPEC NO: DSAC3740
REV NO: V.1
DATE:FEB/14/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: X.T.HU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
AM2520SURC03
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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