1
HA-2515
12MHz, High Input Impedance,
Operational Amplifier
HA-2515 is a high performance operational amplifier which
sets the standards for maximum slew rate, highest accuracy
and widest bandwidths for internally compensated devices.
In addition to excellent dynamic characteristics, this
dielectrically isolated amplifier also offers low offset current
and high input impedance.
The
60V/
s slew rate and 250ns (0.1%) settling time of this
amplifier is ideally suited for high speed D/A, A/D, and pulse
amplification designs. HA-2515's superior 12MHz gain
bandwidth and 1000kHz power bandwidth is extremely useful
in RF and video applications. For accurate signal conditioning
this amplifier also provides 10nA offset current, coupled with
100M
input impedance, and offset trim capability.
Pinout
HA-2515 (PDIP)
TOP VIEW
Features
Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60V/
s
Fast Settling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250ns
Full Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . 1MHz
Gain Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . 12MHz
High Input Impedance . . . . . . . . . . . . . . . . . . . . . . 100M
Low Offset Current . . . . . . . . . . . . . . . . . . . . . . . . . . .10nA
Internally Compensated for Unity Gain Stability
Applications
Data Acquisition Systems
RF Amplifiers
Video Amplifiers
Signal Generators
Pulse Amplification
BAL
-IN
+IN
V-
1
2
3
4
8
7
6
5
COMP
V+
OUT
BAL
-
+
Part Number Information
PART NUMBER
TEMP.
RANGE (
o
C)
PACKAGE
PKG.
NO.
HA3-2515-5
0 to 75
8 Ld PDIP
E8.3
Data Sheet
May 2003
FN2893.5
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2003. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
OBSO
LETE
PRO
DUCT
POSS
IBLE
SUB
STITU
TE P
RODU
CT
HA-2
525
2
Absolute Maximum Ratings
Thermal Information
Voltage Between V+ and V- Terminals . . . . . . . . . . . . . . . . . . . 40V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15V
Peak Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Operating Conditions
Temperature Range
HA-2515-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0
o
C to 75
o
C
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
JC
(
o
C/W)
PDIP Package . . . . . . . . . . . . . . . . . . .
120
N/A
Maximum Junction Temperature (Plastic Package) . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300
o
C
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1.
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
V
SUPPLY
=
15V
PARAMETER
TEMP (
o
C)
MIN
TYP
MAX
UNITS
INPUT CHARACTERISTICS
Offset Voltage
25
-
5
10
mV
Full
-
-
14
mV
Offset Voltage Average Drift
Full
-
30
-
V/
o
C
Bias Current
25
-
125
250
nA
Full
-
-
500
nA
Offset Current
25
-
20
50
nA
Full
-
-
100
nA
Input Resistance (Note 2)
25
40
100
-
M
Common Mode Range
Full
10.0
-
-
V
TRANSFER CHARACTERISTICS
Large Signal Voltage Gain (Notes 3, 6)
25
7.5
15
-
kV/V
Full
5
-
-
kV/V
Common Mode Rejection Ratio (Note 4)
Full
74
90
-
dB
Gain Bandwidth Product (Note 5)
25
-
12
-
MHz
OUTPUT CHARACTERISTICS
Output Voltage Swing (Note 3)
Full
10.0
12.0
-
V
Output Current (Note 6)
25
10
20
-
mA
Full Power Bandwidth (Notes 6, 11)
25
600
1000
-
kHz
TRANSIENT RESPONSE
Rise Time (Notes 3, 7, 8, 9)
25
-
25
50
ns
Overshoot (Notes 3, 7, 8, 9)
25
-
25
50
%
Slew Rate (Notes 3, 7, 9, 12)
25
40
60
-
V/
s
Settling Time to 0.1% (Notes 3, 7, 9, 12)
25
-
0.25
-
s
POWER SUPPLY CHARACTERISTICS
Supply Current
25
-
4
6
mA
Power Supply Rejection Ratio (Note 10)
Full
74
90
-
dB
NOTES:
2. This parameter value is based on design calculations.
3. R
L
= 2k
.
4. V
CM
=
10V
5. A
V
>10.
6. V
O
=
10V.
7. C
L
= 50pF.
8. V
O
=
200mV.
9. See Transient Response Test Circuits and Waveforms.
10.
V =
5V.
11. Full Power Bandwidth guaranteed based on slew rate measurement using: FPBW = Slew Rate/2
V
PEAK
.
12. V
OUT
=
5V.
HA-2515
3
Test Circuits and Waveforms
FIGURE 1. SLEW RATE AND SETTLING TIME
NOTE: Measured on both positive and negative transitions from 0V
to +200mV and 0V to -200mV at the output.
FIGURE 2. TRANSIENT RESPONSE
FIGURE 3. SLEW RATE AND TRANSIENT RESPONSE
FIGURE 4. VOLTAGE FOLLOWER PULSE RESPONSE
NOTES:
13. A
V
= -1.
14. Feedback and summing resistor ratios should be 0.1% matched.
15. Clipping diodes CR
1
and CR
2
are optional. HP5082-2810
recommended.
FIGURE 5. SETTLING TIME TEST CIRCUIT
NOTE: Tested offset adjustment range is IVOS + 1mVI minimum
referred to output. Typical ranges are
6mV with R
T
= 20k
.
FIGURE 6. SUGGESTED V
OS
ADJUSTMENT AND
COMPENSATION HOOK UP
+5V
INPUT
+5V
75%
OUTPUT
25%
ERROR BAND
10mV FROM
FINAL VALUE
t
SLEW
=
V/
t
-5V
SETTLING
TIME
V
-5V
RATE
INPUT
90%
OUTPUT
10%
0mV
RISE TIME
+200mV
0mV
+200mV
OVERSHOOT
OUT
IN
+
2k
50pF
-
R
L
= 2k
, C
L
= 50pF
Upper Trace: Input
Lower Trace: Output
Vertical = 5V/Div.
Horizontal = 200ns/Div.
T
A
= 25
o
C, V
S
=
15V
OUTPUT
INPUT
+
2k
5k
2
3
4
6
7
50pF
V+
V-
D
G
S
2N4416
CR
1
CR
2
SETTLING TIME
TEST POINT
1
F
0.01
F
1
F
0.01
F
2k
5k
2k
-
OUT
IN
BAL.
V-
V+
20k
COMP
C
C
R
T
HA-2515
4
Schematic
Q
37
Q
28
R
26
Q
32
Q
35
Q
4
Q
2
Q
34
Q
33
Q
24
Q
23
Q
22
Q
19
Q
13
Q
25
Q
20
-IN
R
2
2K
Q
1
Q
27
Q
18
Q
21
R
15
740
R
16
1.48K
R
17
1.48K
R
18
1.48K
Q
3
COMP
Q
6
Q
8
Q
7
Q
9
Q
40
Q
39
Q
38
1.68K
1.68K
R
25
Q
29
Q
26
Q
30
Q
31
Q
36
R
4
11.13K
R
20
3.0K
R
23
3.0K
R
22
240
R
14
30
Q
12
Q
15
Q
17
R
10
1.8K
R
7
1.8K
200
R
9
200
R
6
Q
16
R
12
1.1K
Q
14
Q
11
R
13
30
C
1
10pF
2.7pF
C
2
Q10
R
11
2K
R
1
4K
200
R
5
200
R
8
+IN
R
3
960
Q
5
R
19
6.3K
BAL
BAL
V-
V+
OUT
HA-2515
5
Typical Performance Curves
FIGURE 7. POWER SUPPLY CURRENT vs TEMPERATURE
FIGURE 8. INPUT BIAS AND OFFSET CURRENT vs
TEMPERATURE
FIGURE 9. EQUIVALENT INPUT NOISE vs BANDWIDTH
(WITH 10Hz HIGH PASS FILTER)
FIGURE 10. NORMALIZED AC PARAMETERS vs
TEMPERATURE
FIGURE 11. OPEN LOOP GAIN AND PHASE RESPONSE
FIGURE 12. NORMALIZED AC PARAMETERS vs SUPPLY
VOLTAGE AT 25
o
C
TEMPERATURE (
o
C)
-50
-25
0
25
50
75
100
125
3.2
3.4
3.6
3.8
4.0
4.2
4.4
S
U
PPLY CURRENT
(mA)
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
TEMPERATURE (
o
C)
-20
0
20
40
60
80
100
C
URRENT (nA)
BIAS CURRENT
OFFSET CURRENT
-50
-25
0
25
50
75
100
125
FREQUENCY (Hz)
100
10
1.0
0.1
100Hz
1kHz
10kHz
100kHz
1MHz
EQUIV
A
L
E
NT
INPUT NOISE
(
V
RM
S
)
THERMAL NOISE
OF 10K RESISTOR
10K SOURCE RESISTANCE
0K SOURCE RESISTANCE
TEMPERATURE (
o
C)
0.8
0.9
1.0
1.1
BANDWIDTH
SLEW RATE
-50
-25
0
25
50
75
100
125
BANDWIDTH
SLEW RATE
NORMALIZED PARAMETERS
REFERRE
D
TO VALUES AT
2
5
o
C
FREQUENCY (Hz)
120
0
100
10K
1M
10M
100M
OPE
N
L
O
O
P
VOL
T
A
GE
G
A
IN
(d
B) 100
80
60
40
20
-20
10
100K
1K
180
30
60
90
120
150
PHASE
GAIN
0
P
H
A
S
E (DEGRE
ES)
SUPPLY VOLTAGE (V)
0.8
0.9
1.0
1.1
BANDWIDTH
SLEW RATE
20
BANDWIDTH
SLEW RATE
NOR
M
ALIZED P
ARA
ME
TERS
REFERRED TO VALU
E
S
AT
15
V
15
10
HA-2515
6
FIGURE 13. OPEN LOOP GAIN RESPONSE FOR VARIOUS
VALUES OF CAPACITORS FROM COMPENSATION
PIN TO GROUND
FIGURE 14. OPEN LOOP VOLTAGE GAIN vs TEMPERATURE
FIGURE 15. OUTPUT VOLTAGE SWING vs FREQUENCY
Typical Performance Curves
(Continued)
FREQUENCY (Hz)
-20
80
100
120
0pF
100M
OP
EN LO
OP VO
LTAG
E GAI
N
(dB)
10M
1M
100K
10K
1K
100
10
60
40
20
0
30pF
100pF
300pF
1000pF
TEMPERATURE (
o
C)
-50
-25
0
25
50
75
100
125
75
80
85
90
GA
IN (
d
B
)
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
0
10K
100K
1MEG
10MEG
FREQUENCY (Hz)
5
15
20
25
30
35
10
OUTP
UT
VO
LTA
GE
S
W
ING
(
V
P-P
)
V
SUPPLY
=
20V
V
SUPPLY
=
15V
V
SUPPLY
=
10V
T
A
= 25
o
C
HA-2515
7
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Die Characteristics
DIE DIMENSIONS:
65 mils x 57 mils x 19 mils
1650
m x 1450
m x 483
m
METALLIZATION:
Type: Al, 1% Cu
Thickness: 16k
2k
PASSIVATION:
Type: Nitride (Si
3
N
4
) over Silox (SiO
2
, 5% Phos.)
Silox Thickness: 12k
2k
Nitride Thickness: 3.5k
1.5k
SUBSTRATE POTENTIAL (Powered Up):
Unbiased
TRANSISTOR COUNT:
40
PROCESS:
Bipolar Dielectric Isolation
Metallization Mask Layout
HA-2515
V-
+IN
OUT
BAL
-IN
V+
COMP
BAL
HA-2515
8
FN
Dual-In-Line Plastic Packages (PDIP)
CL
E
e
A
C
e
B
e
C
-B-
E1
INDEX
1 2 3
N/2
N
AREA
SEATING
BASE
PLANE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A
1
-A-
0.010 (0.25)
C A
M
B S
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the "MO Series Symbol List" in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and
are measured with the leads constrained to be per-
pendicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
e
A
-C-
E8.3
(JEDEC MS-001-BA ISSUE D)
8 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.15
1.77
8, 10
C
0.008
0.014
0.204
0.355
-
D
0.355
0.400
9.01
10.16
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
0.300 BSC
7.62 BSC
6
e
B
-
0.430
-
10.92
7
L
0.115
0.150
2.93
3.81
4
N
8
8
9
Rev. 0 12/93
HA-2515
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