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Электронный компонент: HMBT5401

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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 1/3
HMBT5401
HSMC Product Specification
HMBT5401
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HMBT5401 is designed for general purpose applications
requiring high breakdown voltages.
Features
High Collector-Emitter Breakdown Voltage (BVCEO=150V@ IC=1mA)
Complements to NPN Type HMBT5551
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature .................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................ 225 mW
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ...................................................................................... -160 V
VCEO Collector to Emitter Voltage ................................................................................... -150 V
VEBO Emitter to Base Voltage ............................................................................................. -5 V
IC Collector Current....................................................................................................... -600 mA
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
-160
-
-
V
IC=-100uA
BVCEO
-150
-
-
V
IC=-1mA
BVEBO
-5
-
-
V
IE=-10uA
ICBO
-
-
-50
nA
VCB=-120V
*VCE(sat)1
-
-
-200
mV
IC=-10mA, IB=-1mA
*VCE(sat)2
-
-
-500
mV
IC=-50mA, IB=-5mA
*VBE(sat)1
-
-
-1
V
IC=-10mA, IB=-1mA
*VBE(sat)2
-
-
-1
V
IC=-50mA, IB=-5mA
*hFE1
50
-
-
VCE=-5V, IC=-1mA
*hFE2
60
-
240
VCE=-5V, IC=-10mA
*hFE3
50
-
-
VCE=-5V, IC=-50mA
fT
100
-
300
MHz
VCE=-10V, IC=-10mA, f=100MHz
Cob
-
-
6
pF
VCB=-10V, f=1MHZ
*Pulse Test: Pulse Width
380us, Duty Cycle
2%
SOT-23
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 2/3
HMBT5401
HSMC Product Specification
Characteristics Curve
Current Gain & Collector Current
1
10
100
1000
1
10
100
1000
Collector Current-I
C
(mA)
hFE
hFE @ V
CE
=5V
25
o
C
75
o
C
125
o
C
Saturation Voltage & Collector Current
10
100
1000
10000
100000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
S
a
tu
r
a
ti
o
n
V
o
l
t
a
g
e
(
m
V
)
V
CE(sat)
@ I
C
=10I
B
25
o
C
75
o
C
125
o
C
Saturation Voltage & Collector Current
100
1000
0.1
1
10
100
1000
Collector Current-I
C
(mA)
S
a
t
u
r
a
t
i
on V
o
l
t
a
ge (
m
V
)
V
BE(sat)
@ I
C
=10I
B
25
o
C
75
o
C
125
o
C
Capacitance & Reverse-Biased Voltage
1
10
100
0.1
1
10
100
Reverse Biased Voltage (V)
C
a
pac
i
t
a
n
c
e
(
p
F
)
Cob
`
Cutoff Frequency & Collector Current
10
100
1000
1
10
100
Collector Current (mA)
C
u
t
o
f
f
Fr
eque
nc
y
(
M
H
z
)
...
V
CE
=10V
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6819
Issued Date : 1993.06.30
Revised Date : 2002.10.25
Page No. : 3/3
HMBT5401
HSMC Product Specification
SOT-23 Dimension
*: Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1102
0.1204
2.80
3.04
J
0.0034
0.0070
0.085
0.177
B
0.0472
0.0630
1.20
1.60
K
0.0128
0.0266
0.32
0.67
C
0.0335
0.0512
0.89
1.30
L
0.0335
0.0453
0.85
1.15
D
0.0118
0.0197
0.30
0.50
S
0.0830
0.1083
2.10
2.75
G
0.0669
0.0910
1.70
2.30
V
0.0098
0.0256
0.25
0.65
H
0.0005
0.0040
0.013
0.10
Notes:
1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
Style: Pin 1.Base 2.Emitter 3.Collector
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
Marking:
Rank Code
2 L
Control Code
H
J
K
D
A
L
G
V
C
B
3
2
1
S