HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :HE9526-A
Issued Date : 1998.07.01
Revised Date : 2000.10.01
Page No. : 1/2
HSMC Product Specification
HM3019
NPN EPITAXIAL PLANAR TRANSISTOR
Description
This device is designed for use as general purpose amplifier and
switching requiring collector currents 1A
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ............................................................................................ -55 ~ +150
C
Junction Temperature ................................................................................... +150
C Maximum
Maximum Power Dissipation
Total Power Dissipation (Ta=25
C) ................................................................................... 1.2 W
Maximum Voltages and Currents (Ta=25
C)
VCBO Collector to Base Voltage ...................................................................................... 140 V
VCEO Collector to Emitter Voltage ..................................................................................... 80 V
VEBO Emitter to Base Voltage ............................................................................................. 7 V
IC Collector Current .............................................................................................................. 1 A
Characteristics
(Ta=25
C)
Symbol
Min.
Typ.
Max.
Unit
Test Conditions
BVCBO
140
-
-
V
IC=100uA
BVCEO
80
-
-
V
IC=30mA
BVEBO
7
-
-
V
IE=100uA
ICBO
-
-
50
nA
VCB=90V
IEBO
-
-
50
nA
VEB=5V
*VCE(sat)
-
-
0.2
V
IC=150mA, IB=15mA
*VBE(sat)
-
-
1.1
V
IC=150mA, IB=15mA
*hFE1
50
-
-
IC=0.1mA, VCE=10V
*hFE2
90
-
-
IC=10mA, VCE=10V
*hFE3
100
-
300
IC=150mA, VCE=10V
*hFE4
50
-
-
IC=500mA, VCE=10V
*hFE5
15
-
-
IC=1000mA, VCE=10V
fT
100
-
-
MHz
IC=50mA, VCE=10V, f=100MHz
Cob
-
-
12
pF
VCE=10V, f=1MHz, IE=0
*Pulse Test : Pulse Width
380us, Duty Cycle
2%
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. :HE9526-A
Issued Date : 1998.07.01
Revised Date : 2000.10.01
Page No. : 2/2
HSMC Product Specification
SOT-89 Dimension
*:Typical
Inches
Millimeters
Inches
Millimeters
DIM
Min.
Max.
Min.
Max.
DIM
Min.
Max.
Min.
Max.
A
0.1732
0.1811
4.40
4.60
F
0.0583
0.0598
1.48
1.52
B
0.1594
0.1673
4.05
4.25
G
0.1165
0.1197
2.96
3.04
C
0.0591
0.0663
1.50
1.70
H
0.0551
0.0630
1.40
1.60
D
0.0945
0.1024
2.40
2.60
I
0.0138
0.0161
0.35
0.41
E
0.0141
0.0201
0.36
0.51
Notes :
1.Dimension and tolerance based on our Spec. dated May. 05,1996.
2.Controlling dimension : millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
Lead : 42 Alloy ; solder plating
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454
Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5983621~5 Fax : 886-3-5982931
Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel : 886-3-5977061 Fax : 886-3-5979220
3
2
1
A
B
C
D
E
F
G
H
I
Style : Pin 1.Base 2.Collector 3.Emitter
Marking :
Part Number
Date Code
HSMC Logo
Package Code
3-Lead SOT-89 Plastic Surface Mounted Package
HSMC Package Code : M
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