S2A THRU S2M
SURFACE MOUNT GLASS PASSIVATED SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.5 Amperes
FEATURES
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
For surface mounted applications
Low profile package
Built-in strain relief,
ideal for automated placement
Glass passivated chip junction
High temperature soldering:
250C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AA molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.003 ounce, 0.093 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
S2A
S2B
S2D
S2G
S2J
S2K
S2M
UNITS
Device marking code
SA
SB
SD
SG
SJ
SK
SM
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at T
L
=100C
I
(AV)
1.5
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load (JEDEC Method) T
L
=100C
I
FSM
50.0
Amps
Maximum instantaneous forward voltage at 1.5 A
V
F
1.15
Volts
Maximum DC reverse current
T
A
=25C 1.0
at Rated DC blocking voltage
T
A
=125C
I
R
125.0
A
Typical reverse recovery time
(NOTE 1)
t
rr
2.0
s
Typical junction capacitance
(NOTE 2)
C
J
30.0
pF
Typical thermal resistance
(NOTE 3)
R
JA
53.0
R
JL
16.0
C/W
Operating and storage temperature range
T
J
, T
STG
-55 to +150
C
NOTES:
(1) Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
rr
=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and junction to lead
P.C.B. mounted on 0.27 x 0.27" (7.0 x 7.0mm) copper pad areas
4/98
0.160 (4.06)
0.180 (4.57)
0.006 (0.152)
0.012 (0.305)
0.030 (0.76)
0.060 (1.52)
0.008 (0.203)
0.205 (5.21)
0.220 (5.59)
0.084 (2.13)
0.096 (2.44)
0.077 (1.95)
0.086 (2.20)
0.130 (3.30)
0.155 (3.94)
MAX.
DO-214AA
MODIFIED J-BEND
Dimensions in inches and (millimeters)
1.5
50
60
70
80
90 100 110 120 130 140 150
0
0.5
1.0
0
10
30
40
50
1
10
100
20
0.4
0.6
0.8
1
1.2
1.4
1.6
0.01
0.1
1
10
0.1
1
10
100
10
100
1
0
20
40
60
80
100
0.01
0.1
1
10
RATINGS AND CHARACTERISTIC CURVES S2A THRU S2M
FIG. 1 - FORWARD CURRENT DERATING CURVE
LEAD TEMPERATURE, C
A
VERA
GE FOR
W
ARD CURRENT
,
AMPERES
FIG. 2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
NUMBER OF CYCLES AT 60 H
Z
PEAK FOR
W
ARD SURGE CURRENT
,
MICR
O
AMPERES
FIG. 3 - TYPICAL INSTANTANEOUS FORWARD
CHARACTERISTICS
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
INST
ANT
ANEOUS FOR
W
ARD CURRENT
,
AMPERES
INST
ANT
ANEOUS REVERSE CURRENT
,
MICR
O
AMPERES
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
JUNCTION CAP
A
CIT
ANCE, pF
REVERSE VOLTAGE, VOLTS
T
L
=100C
8.3ms SINGLE HALF SINE-WAVE
(JEDEC Method)
T
J
=25C
T
J
=25C
PULSE WIDTH=300
s
1% DUTY CYCLE
T
J
=25C
f=1.0 MH
Z
Vsig=50mVp-p
T
J
=125C
PERCENT OF RATED PEAK REVERSE
VOLTAGE, %
T
J
=100C
60 H
Z
RESISTIVE OR
INDUCTIVE LOAD
P.C.B. MOUNTED
0.27 x 0.27" (7.0 x 7.0mm)
COPPER PAD AREAS
60 H
Z
RESISTIVE OR
INDUCTIVE LOAD
1.0
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