Filtronic
2-18 GHz MESFET Amplifier
Solid State
LMA183
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Features
5.5dB Typical Noise Figure
7.5dB Typical Gain
15dBm Saturated Output Power
12dB
Input/Output Return Loss Typical
2-18GHz Frequency Bandwidth
+4 Volts Dual Bias Supply
DC Decoupled RF Output
Chip Size : 1.62
mm
X2.38
mm
(.064"X.094")
Chip Thickness : 100
m
Pad Dimension : 100
m
2
.
Description
The Filtronic LMA183 is a GaAs monolithic distributive amplifier which operates from 2 to 18GHz. This LMA183 amplifier produces a typical
gain of 7.5dB and a noise figure of less than 5.5dB. The LMA183 is suitable for gain block, low noise and driver amplifier applications. DC
decoupled output RF port. Ground is provided to the circuitry through vias to the backside metallization.
Electrical Specifications at T
a
=25
C
(V
DD
=+4.0V, Zin=Zout=50
)
Absolute Maximum Ratings
Notes
:
1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices.
2. Specifications subject to change without notice.
DSS 007 WC
Limit
Symbol
Parameter
Test Conditions
Min.
Typ.
Max.
Units
BW
Operating Bandwidth
2
18
GHz
S21
Small Signal Gain
V
D
=4V, Ids=.5Idss
6
7.5
dB
Idss
Drain Current at Saturation
60
100
200
mA
S21
Small Signal Gain Flatness
.5
1
dB
NF
Noise Figure
@ .5Idss
5.5
7
dB
RLin
Input Return Loss
-14
-10
dB
RLout
Output Return Loss
-14
-10
dB
S12
Reverse Isolation
-13
-16
dB
P-1dB
1-dB Gain Compression Power
10
12
dBm
Symbol
Parameter/ Conditions
Min.
Max.
Units
Vdd
Drain Supply Voltage
8
Volts
Idd
Total Drain Current
200
mA
Pin
RF Input Power
20
dBm
Pt
Power Dissipation
1.6
W
Tch
Operating Channel Temperature
150
C
Tstg
Storage Temperature
-65
165
C
Tmax.
Max. Assembly Temp.
(1 min. max.)
300
C
Filtronic
2-18 GHz MESFET Amplifier
Solid State
LMA183
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Assembly Diagram
Notes:
1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond
tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended.
Ultrasonic bonding is not recommended.
2.) The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150C for 45 minutes.
3.) Bond on bond or stitch bond acceptable.
4.) Conductor over conductor acceptable. Conductors must not short.
DSS 007 WC
Filtronic
2-18 GHz MESFET Amplifier
Solid State
LMA183
Phone:
(408) 988-1845
Internet:
http://www.FiltronicSolidState.com
Fax:
(408) 970-9950
Mechanical Outline
Notes:
1.) Unless Otherwise specified.
2.) All units are in micron (m).
3.) All bond pads are 100 X 100 m
2
.
4.) Bias pad (V
DD
) size is 100 X 121.5 m
2
.
DSS 007 WC
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