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Электронный компонент: FLM7785-18F

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Edition 1.2
August 2004
FLM7785-18F
C-Band Internally Matched FET
Item
Drain-Source Voltage
Gate-Source Voltage
Total Power Dissipation
Storage Temperature
Channel Temperature
Symbol
VDS
VGS
15
-5
83.3
-65 to +175
175
Tc = 25C
V
V
W
C
C
PT
Tstg
Tch
Condition
Unit
Rating
ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25
C)
Fujitsu recommends the following conditions for the reliable operation of GaAs FETs:
1. The drain-source operating voltage (VDS) should not exceed 10 volts.
2. The forward and reverse gate currents should not exceed 18.0 and -8.4 mA respectively with
gate resistance of 25
.
Item
Saturated Drain Current
Transconductance
Pinch-off Voltage
Gate Source Breakdown Voltage
Power-added Efficiency
3rd Order Intermodulation
Distortion
Output Power at 1dB G.C.P.
Power Gain at 1dB G.C.P.
Symbol
IDSS
-
8.1
12.75
-
4350
-
-1.0
-2.0
-3.5
-5
-
-
6.0
7.0
-
-
29
-
41.5
42.5
-
VDS = 5V, IDS = 450mA
VDS = 5V, IDS = 5100mA
VDS = 5V, VGS = 0V
IGS = -450A
VDS = 10V,
IDS = 0.55 IDSS (Typ.),
f = 7.7 ~ 8.5 GHz,
ZS=ZL= 50 ohm
f = 8.5 GHz,
f = 10 MHz
2-Tone Test
Pout = 31.5dBm S.C.L.
A
mS
V
dB
%
-42
-45
-
dBc
dBm
V
gm
Vp
VGSO
P1dB
G1dB
Drain Current
-
4700
5800
mA
Idsr
IM3
add
Gain Flatness
-
-
0.6
dB
G
Test Conditions
Unit
Limit
Typ.
Max.
Min.
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25
C)
Channel to Case
Thermal Resistance
-
1.6
1.8
C/W
Rth
10V x Idsr x Rth
Channel Temperature Rise
-
-
80
C
Tch
G.C.P.: Gain Compression Point, S.C.L.: Single Carrier Level
CASE STYLE: IK
DESCRIPTION
The FLM7785-18F is a power GaAs FET that is internally matched for
standard communication bands to provide optimum power and gain in a
50 ohm system.
Eudyna's stringent Quality Assurance Program assures the highest
reliability and consistent performance.
FEATURES
High Output Power: P1dB = 42.5dBm (Typ.)
High Gain: G1dB = 7.0dB (Typ.)
High PAE:
add = 29% (Typ.)
Low IM3 = -45dBc@Po = 31.5dBm
Broad Band: 7.7 ~ 8.5GHz
Impedance Matched Zin/Zout = 50
Hermetically Sealed
2
FLM7785-18F
C-Band Internally Matched FET
OUTPUT POWER vs. FREQUENCY
7.7
Pin=36dBm
34dBm
30dBm
32dBm
28dBm
8.1
8.5
Frequency (GHz)
39
41
43
37
Output Power (dBm)
VDS=10V
P1dB
VDS=10V
f = 8.5 GHz
OUTPUT POWER vs. INPUT POWER
29
31
33
35
Input Power (dBm)
41
43
39
37
40
20
Output Power (dBm)
add
Pout
add
(%)
OUTPUT POWER & IM3 vs. INPUT POWER
VDS=10V
f1 = 8.5 GHz
f2 = 8.51 GHz
2-tone test
22
24
26
28
30
32
Input Power (S.C.L.) (dBm)
S.C.L.: Single Carrier Level
27
29
31
33
35
37
39
-45
-35
-25
-15
Output Power (S.C.L.) (dBm)
IM3
Pout
IM
3
(dBc)
POWER DERATING CURVE
50
0
100
150
200
Case Temperature (
C)
100
80
60
40
20
Total Power Dissipation (W)
3
FLM7785-18F
C-Band Internally Matched FET
S-PARAMETERS
VDS = 10V, IDS = 4800mA
FREQUENCY
S11
S21
S12
S22
(MHZ)
MAG
ANG
MAG
ANG
MAG
ANG
MAG
ANG
7500
.449
-50.2
2.408
150.2
.077
106.1
.445
44.2
7600
.416
-63.9
2.448
138.5
.079
95.1
.430
33.6
7700
.382
-81.0
2.503
125.5
.082
82.3
.411
21.5
7800
.353
-102.3
2.565
111.1
.084
68.2
.387
8.0
7900
.337
-126.5
2.629
96.2
.085
53.7
.359
-5.7
8000
.337
-151.2
2.669
81.6
.086
39.7
.334
-18.8
8100
.356
-177.4
2.694
65.5
.087
24.5
.302
-32.6
8200
.389
157.9
2.689
49.2
.087
9.0
.268
-46.0
8300
.426
137.0
2.654
33.5
.086
-5.4
.236
-58.2
8400
.466
117.2
2.580
17.1
.084
-20.6
.203
-70.4
8500
.501
99.4
2.488
0.9
.083
-35.6
.171
-81.2
8600
.526
84.1
2.386
-13.7
.081
-49.4
.143
-89.7
8700
.546
71.6
2.302
-26.7
.079
-61.3
.118
-95.7
+j250
+j100
+j50
+j25
+j10
0
-j10
-j25
-j50
-j100
-j250
S11
S22
180
+90
0
-90
S21
S12
0.2
0.1
SCALE FOR |S12|
25
50
250
SCALE FOR |S
21
|
1
2
3
4
7.9
7.9
7.5
7.5
7.7
7.7
8.1
8.1
8.3
8.3
8.5
8.5
8.7 GHz
8.7 GHz
8.4
8.3
8.3
8.2
8.1
8.1
8.0
7.9
7.9
7.8
7.7
7.7
7.6
7.5
7.5
8.5
8.5
8.6
8.7 GHz
8.7 GHz
4
FLM7785-18F
C-Band Internally Matched FET
4-R 1.3
0.15
(0.051)
0.6
(0.024)
14.9
(0.587)
20.4
0.3
(0.803)
24
0.5
(0.945)
5.5 Max.
(0.217)
2.4
0.15
(0.094)
0.1
(0.004)
1.4
(0.055)
17.4
0.3
(0.685)
8.0
0.2
(0.315)
2.0 Min.
(0.079)
2.0 Min.
(0.079)
Case Style "IK"
Metal-Ceramic Hermetic Package
Unit: mm(inches)
1. Gate
2. Source (Flange)
3. Drain
1
3
2
Eudyna Devices Inc. products contain gallium arsenide
(GaAs)
which can be hazardous to the human body and the environment.
For safety, observe the following procedures:
CAUTION
Do not put this product into the mouth.
Do not alter the form of this product into a gas, powder, or liquid
through burning, crushing, or chemical processing as these by-products
are dangerous to the human body if inhaled, ingested, or swallowed.
Observe government laws and company regulations when discarding this
product. This product must be discarded in accordance with methods
specified by applicable hazardous waste procedures.
For further information please contact:
Eudyna Devices USA Inc.
2355 Zanker Rd.
San Jose, CA 95131-1138, U.S.A.
TEL: (408) 232-9500
FAX: (408) 428-9111
www.us.eudyna.com
Eudyna Devices Europe Ltd.
Network House
Norreys Drive
Maidenhead, Berkshire SL6 4FJ
United Kingdom
TEL: +44 (0) 1628 504800
FAX: +44 (0) 1628 504888
Eudyna Devices Asia Pte Ltd.
Hong Kong Branch
Rm. 1101, Ocean Centre, 5 Canton Rd.
Tsim Sha Tsui, Kowloon, Hong Kong
TEL: +852-2377-0227
FAX: +852-2377-3921
Eudyna Devices Inc.
Sales Division
1, Kanai-cho, Sakae-ku
Yokohama, 244-0845, Japan
TEL: +81-45-853-8156
FAX: +81-45-853-8170
Eudyna Devices Inc. reserves the right to change products and specifications
without notice. The information does not convey any license under rights of
Eudyna Devices Inc. or others.
2004 Eudyna Devices USA Inc.
Printed in U.S.A.