UC1606
65x132 Matrix LCD Controller-Drivers
Version 1.32
1
UC1606
Single-Chip, Ultra-Low Power
Passive Matrix LCD Controller-Driver
I
NTRODUCTION
UC1606 is an advanced high-voltage mixed-
signal CMOS IC, especially designed for the
display needs of ultra-low power hand-held
devices.
This chip employs UltraChip's unique DCC
(Direct Capacitor Coupling) driver architecture to
achieve near crosstalk free images.
In addition to low power COM and SEG drivers,
UC1606 contain all necessary circuits for high-V
LCD power supply, bias voltage generation,
timing generation and graphics data memory.
Advanced circuit design techniques are
employed to minimize external component counts
and reduce connector size while achieving
extremely low power consumption.
M
AIN
A
PPLICATIONS
Cellular Phones, Smart Phones, and other
battery operated devices and/or portable
Instruments
F
EATURE
H
IGHLIGHTS
Single chip controller-driver supports
65 COM x 132 SEG LCD.
Support industry standard 8-bit parallel
interface (8080 or 6800), 4-wire SPI (S8),
and 3-wire SPI (S9) serial interface.
Support four multiplexing rates (25, 33, 49,
65).
Self-configuring 6x charge pump with on-
chip pumping capacitor requires only 3
external capacitors to operate.
Flexible data addressing/mapping schemes
to support wide ranges of software models
and LCD layout placements.
Software programmable 4 temperature
compensation coefficients.
On-chip bypass capacitor for V
LCD
makes
V
LCD
bypass capacitor optional for small
LCD panels.
On-chip Power-ON Reset and Software
RESET commands, make RST pin optional.
V
DD
(digital) range: 2.4V ~ 5V
V
DD
(analog) range: 2.4V ~ 5V
LCD V
OP
range:
6.5V ~ 12.5V
Available in gold bump dies
Bump pitch: 70uM min.
Bump gap: 24uM min.
U
LTRA
C
HIP
High-Voltage Mixed-Signal IC
1999-2003
2
Product
Specifications
O
RDERING
I
NFORMATION
Product ID
Description
UC1606xGAF
65 COM x 132 SEG LCD driver
General Notes
A
PPLICATION
I
NFORMATION
For improved readability, the specification contains many application data points. When application information is given, it
is advisory and does not form part of the specification for the device.
B
ARE
D
IE
D
ISCLAIMER
All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of
ninety (90) days from the date of UltraChip's delivery. There is no post waffle saw/pack testing performed on individual die.
Although the latest modern processes are utilized for wafer sawing and die pick-&-place into waffle pack carriers,
UltraChip has no control of third party procedures in the handling, packing or assembly of the die. Accordingly, it is the
responsibility of the customer to test and quality their application in which the die is to be used. UltraChip assumes no
liability for device functionality or performance of the die or systems after handling, packing or assembly of the die.
L
IFE
S
UPPORT
A
PPLICATIONS
These devices are not designed for use in life support appliances, or systems where malfunction of these products can
reasonably be expected to result in personal injuries. Customer using or selling these products for use in such
applications do so at their own risk.
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