Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358

www.ddc-web.com

FOR MORE INFORMATION CONTACT:

Technical Support:
1-800-DDC-5757 ext. 7771

FEATURES

5 Volt Only

Fully Integrated MIL-STD-1553 A/B
STANAG 3838 Compliant Terminals

One-Square-Inch Package

Smallest BC/RT/MT In The Industry

Hardware and Software
Compatible with BU-61580 ACE
Series

Flexible Processor/Memory
Interface

Bootable RT* Option

4K x 16 or 64K x 16* Shared RAM

Automatic BC Retries

Programmable BC Gap Times

Programmable Illegalization

Simultaneous RT/Monitor Mode

Operates From 10*/12 /16 / 20* MHz
Clock

DESCRIPTION

The BU-61588 Mini-ACE and BU-61688 Mini-ACE Plus* integrates two
5-volt-only transceivers, protocol, memory management, processor interface
logic, and 4K x 16, or 64K x 16* words of RAM in a choice of pin grid array
(PGA), quad flat pack or gull lead packages. The Mini-ACE is packaged in a
1.0 square inch, low profile, cofired ceramic multi-chip-module (MCM) pack-
age making it the smallest integrated MIL-STD-1553 BC/RT/MT in the indus-
try.

The Mini-ACE provides full compatibility to DDC's BU-61580 and BU-65170
Advanced Communication Engine (ACE). As such, the Mini-ACE includes all
the hardware and software architectural features of the ACE.

The Mini-ACE contains internal address latches and bidirectional data buffers
to provide a direct interface to a host processor bus. The memory manage-
ment scheme for RT mode provides three data structures for buffering data.
These structures, combined with the Mini-ACE's extensive interrupt capabili-
ty, serve to ensure data consistency while off-loading the host processor.

The Mini-ACE Plus* can optionally boot-up as a RT with the Busy bit set for
1760 applications. The Mini-ACE BC mode implements several features
aimed at providing an efficient real-time software interface to the host proces-
sor including automatic retries, programmable intermessage gap times, auto-
matic frame repetition, and flexible interrupt generation.

The advanced architectural features of the Mini-ACE, combined with its small size
and high reliability, make it an ideal choice for demanding military and industrial
processor-to-1553 applications.

BU-65178/65179*/61588/61688*/61689*

MINIATURE ADVANCED
COMMUNICATION ENGINE
(MINI-ACE) AND MINI-ACE PLUS*

Make sure the next
Card you purchase
has...

1998, 1999 Data Device Corporation

All trademarks are the property of their respective owners.

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

FIGURE 1.

U-65178/65179*/61588/61688*/61689*

TRANSCEIVER

CH. A

TRANSCEIVER

CH. B

DUAL

ENCODER/DECODER,

MULTIPROTOCOL

AND

MEMORY

MANAGEMENT

RT ADDRESS

4K X 16

64K X 16

SHARED

RAM

ADDRESS BUS

PROCESSOR

AND

MEMORY

INTERFACE

LOGIC

DATA BUS

D15-D0

A15-A0

DATA

BUFFERS

ADDRESS

BUFFERS

PROCESSOR

DATA BUS

PROCESSOR

ADDRESS BUS

MISCELLANEOUS

CLK_IN,

MSTCLR,SSFLAG/EXT_TRG

RTAD4-RTAD0, RTADP

IOEN, READYD

ADDR_LAT/MEMOE, ZERO_WAIT/MEMWR,

8/16-BIT/DTREQ, POLARITY_SEL/DTACK

INT

TRANSPARENT/BUFFERED, STRBD, SELECT,

RD/WR, MEM/REG, TRIGGER_SEL/MEMENA-IN,

MSB/LSB/DTGRT

PROCESSOR

AND

MEMORY

CONTROL

INTERRUPT

REQUEST

TX/RX_A

TX/RX_B

RT_AD_LAT

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

kohm

Vp-p

Vpeak

0.860

2.5

0.20

V
V

6.0
7.0

Vcc+0.3

-0.3
-0.3

-0.3

ABSOLUTE MAXIMUM RATING

Supply Voltage

Logic +5 V

Transceiver +5 V (Note 12)

Logic

Voltage Input Range

TABLE 1. BU-65178/65179*/61588/61688*/61689*

SPECIFICATIONS

UNITS

MAX

TYP

MIN

PARAMETER

RECEIVER

Differential Input Resistance

(Notes 1-7)

Differential Input Capacitance

(Notes 1-7)

Threshold Voltage, Transformer
Coupled, Measured on Stub
Common Mode Voltage (Note 7)

Vp-p

Vp-p
Vp-p

mVp-p,

diff

nsec

27
27

250

300

21
22

150

18
20

-250

100

TRANSMITTER

Differential Output Voltage

Direct Coupled Across 35

Measured on Bus
Transformer Coupled Across
70

, Measured on Bus:

· Standard Product = XX0
· 1760 Amplitude Compliant

Product = XX2
( Note 13 and Ordering
Information Test Criteria)

Output Noise, Differential (Direct
Coupled)
Output Offset Voltage, Transformer
Coupled Across 70 ohms
Rise/Fall Time

V
V

µA

pF
pF

0.8

-84
-42

-100

-50

0.4

-6.4

-3.2

50
50

2.0

-10

-692
-346

-794
-397

2.4

6.4

3.2

LOGIC

VIH
VIL
IIH (Vcc = 5.5 V, VIN = Vcc)
IIH (Vcc = 5.5 V, VIN = 2.7 V)

SSFLAG/EXT_TRIG
All Other Inputs

IIL (Vcc = 5.5 V, VIN = 0.4 V)

SSFLAG/EXT_TRIG
All Other Inputs

VOH (Vcc = 4.5 V, VIH = 2.7 V,

VIL = 0.2 V, IOH = max)

VOL (Vcc = 4.5 V, VIH = 2.7 V,

VIL = 0.2 V, IOL = max)

IOL

DB15-DB0

A15-A0
MEMOE/ADDR_LAT
MEMWR/ZEROWAIT
DTREQ/16/8
DTACK/POLARITY_SEL

INT

READYD
IOEN

IOH

DB15-DB0

A15-A0
MEMOE/ADDR_LAT
MEMWR/ZEROWAIT
DTREQ/16/8
DTACK/POLARITY_SEL

INT

READYD
IOEN

CI (Input Capacitance)
CIO (Bi-directional signal input

capacitance)

TABLE 1. BU-65178/65179*/61588/61688*/61689*

SPECIFICATIONS (CONT.)

UNITS

MAX

TYP

MIN

PARAMETER

W
W
W
W

V
V

mA
mA
mA
mA

µs

5.5

5.25

100

160
265
370
580

200

180
285
390
600

19.5
23.5
51.5

131

2.5
9.5

18.5
22.5
50.5

129.5

668

4.5

4.75

17.5
21.5
49.5

127

1553 MESSAGE TIMING

Completion of CPU Write (BC
Start)- to-Start of Next Message
BC Intermessage Gap (Note 8)
BC/RT/MT Response Timeout

(Note 9)

18.5 nominal
22.5 nominal
50.5 nominal
128.0 nominal

T Response Time (Note 11)
Transmitter Watchdog Timeout

0.115

0.64
0.93
1.22
1.81

0.230

0.64
0.93
1.22
1.80

0.18
0.42
0.66
1.14

0.5

0.88
1.11
1.33
1.97

1.0

0.99
1.22
1.45
1.90

0.28
0.51
0.75
1.22

POWER SUPPLY REQUIREMENTS

Voltages/Tolerances

BU-65178/61588X3

· +5 V (Logic)
· +5 V (Ch. A, Ch. B)

Current Drain (Total Hybrid)

BU-65178/65179/61588X0

· +5 V (Logic)

BU-65178/65179/61588X3

· +5 V (Logic, Ch. A, Ch. B)

· Idle
· 25% Transmitter Duty Cycle
· 50% Transmitter Duty Cycle
· 100% Transmitter Duty Cycle

BU-61688*/61689X0*

· +5 V (Logic)

BU-61688*/61689X3*

· +5 V (Logic, Ch. A, Ch. B)

· Idle
· 25% Transmitter Duty Cycle
· 50% Transmitter Duty Cycle
· 100% Transmitter Duty Cycle

5.0
5.0

116
222
328
540

116
217
318
519

POWER DISSIPATION

Total Hybrid

BU-65178/65179/61588X0

· +5 V (Logic)

BU-65178/61588/65179X3

· Idle
· 25% Duty Cycle
· 50% Duty Cycle
· 100% Duty Cycle

BU-61688*/61689X0*

· +5 V (Logic)

BU-61688*/61689X3*

· Idle
· 25% Duty Cycle
· 50% Duty Cycle
· 100% Duty Cycle

Hottest Die

BU-65178/61588X3/65179X3*/

BU-61688*/61689X3*

· Idle
· 25% Duty Cycle
· 50% Duty Cycle
· 100% Duty Cycle

* Mini-ACE PLUS with 64K Words of RAM. RAM impact to Power

Supply is based on Host Processor activity; subtract 140 mA if Host
is idle.

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

TABLE 1. BU-65178/65179*/61588/61688*/61689*

SPECIFICATIONS (CONT.)

UNITS

MAX

TYP

MIN

PARAMETER

Frequency

BU-61588/61688*/65178

· Default Mode 16
· Software Programmable Option 12

BU-61689*

· Default Mode 20
· Software Programmable Option 10

BU-65179*

· Pin Programmable Option

10/12/16/20

MHz
MHz

MHz

Long Term Tolerance

· 1553A Mode
· 1553B Mode

Short Term Tolerance, 1 second

· 1553A Mode
· 1553B Mode

Duty Cycle

· 16 MHz
· 12 MHz
· 10 MHz*
· 20 MHz

%
%

%
%
%
%

0.01
0.1

0.001
0.01

67
60
60
60

33
40
40
40

THERMAL

Thermal Resistance, Junction-to-
Case, Hottest Die (

JC)

BU-65178/61588X3*

Operating Junction Temperature
Storage Temperature
Lead Temperature (soldering, 10
sec.)

°C/W

°C
°C
°C

6.8

150
150

+300

-55
-65

PHYSICAL CHARACTERISTICS

Size

BU-65178/61588 P

BU-65179*/61688*/61689*

BU-65178/61588 F/G

BU-65179*/61688*/61689*

Weight

BU-65178/61588 F/P/G

BU-65179*/61688*/61689*

in.

(mm)

in.

(mm)

0.3

(9)

1.0 X 1.0 X 0.150

(25.4 x 25.4 x 3.81)

1.0 X 1.0 X 0.155

(25.4 x 25.4 x 3.94)

(g)

Notes: Notes 1 through 6 are applicable to the Receiver Differential

Resistance and Differential Capacitance specifications:

(1) Specifications include both transmitter and receiver (tied together internally).
(2) Measurement of impedance is directly between pins TX/RX A(B)

and TX/RX A(B) of the BU-65178/61588X3 hybrid.

(3) Assuming the connection of all power and ground inputs to the hybrid.
(4) The specifications are applicable for both unpowered and powered conditions.
(5) The specifications assume a 2 volt rms balanced, differential, sinu-

soidal input. The applicable frequency range is 75 kHz to 1 MHz.

(6) Minimum resistance and maximum capacitance parameters are

guaranteed, but not tested, over the operating range.

(7) Assumes a common mode voltage within the frequency range of dc to 2

MHz, applied to pins of the isolation transformer on the stub side (either direct
or transformer coupled), referenced to hybrid ground. Use a DDC recom-
mended transformer or other transformer that provides an equivalent CMRR.

Table 1 Notes (Cont.):

(8) Typical value for minimum intermessage gap time. Under software

control, may be lengthened to (65,535

µs minus message time), in

increments of 1

µs.

(9) Software programmable (4 options). Includes RT-to-RT Timeout (Mid-

Parity of Transmit Command to Mid-Sync of Transmitting RT Status).

(10) For both +5 V logic and transceiver. +5 V for channels A and B.
(11) Measured from mid-parity crossing of Command Word to mid-sync

crossing of RT's Status Word.

(12) External 10

µF Tantalum and 0.1 µF capacitors should be located

as close as possible to Pins 20 and 72 on the Flat Package
and Pins A9 and J3 on the PGA package, and 0.1

µF at Pin 37/D3.

(13) MIL-STD1760 requires that the Mini-ACE produce a 20 Vp-p min-

imum output on the stub connection.

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

NOTES
** Note that the Test Output pins on the flat pack are pads located on

the bottom of the package.

1. BU-65179*, A15/A14 pins are actually CLK SEL 1 / CLK SEL 0 respectively.
2. BU-65179*, A12 pin selects the RT_BOOT_L OPTIONAL MODE.
3. BU-65179*, A13 pin has no connection.

RTAD4

MEM/REG

D00

MSTCLR

D02

A11

D03

A10

D05

TX/RX-A

D08

A08

D07

TX/RX-A

D13

A14, See NOTE 1

D12

A04

D14

A03

D09

A07

D11

A02

D15

TX/RX-B

D10

MEMOE/ADDR_LAT

TRANSPARENT/
BUFFERED

A00

READYD

TX/RX-B

INT

LOGIC GND

IOEN

LOGIC GND

TX_INH_A

LOGIC GND

TX_INH_B

+5V V

CC2

SELECT

RTAD2

STRBD

A06

RD/WR

MEMWR/
ZEROWAIT

DTGRT/MSB/LSB

DTREQ/16/8

Test Output (RX-A)

Test Output (RX-B)

A15, See NOTE 1

Test Output (RX-B)

Test Output (RX-A)

A01

A05

MEMENA_IN/
TRIGGER_SEL

A09

DTACK/
POLARITY_SEL

A12, See NOTE 2

CLOCK_IN

A13, See NOTE 3

RT_AD_LAT

+5V V

CC1

SSFLAG/EXT_TRIG

TestOutput(A_RExt)

RTAD0

Test Output
(A_Test1)

RTAD3

Test Output
(AB_Test4)

TestOutput(B_RExt)

D06

TestOutput
(AB_Tstck)

+5V V

TestOutput
(AB_Test2)

D01

TestOutput
(AB_Test3)

D04

TestOutput
(B_Test1)

RTADP

N/A

No Connect

RTAD1

TABLE 2. BU-65178/65179*/61588/61688*/61689* PIN

LISTINGS (QFP QUAD FLAT PACK, PGA-PIN GRID

ARRAY AND GULL LEAD)

NAME

PGA

QFP

NAME

PGA

QFP

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

FIGURE 2. BU-65178F / 65179F* /61588F /61688F*/61689F* MECHANICAL OUTLINE (QUAD FLAT PACK - QFP)

1.000 SQ

±0.010

(25.400

±0.254)

VIEW "B"

0.018

±0.002

(0.457

±0.051)

0.050

±0.005

(1.270

±0.127)

Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL

)

3) Lead Material: Kovar, Plated by 50

µ in. minimum nickel under 60µ in. minimum gold.

4) There are 8 test pads located on the bottom of the package. These pads are recessed
so as not to interfere when mounting the hybrid.

VIEW "B"

2.000

±0.015

(50.800

±0.381)

0.500

±0.005

(12.70

±0.127)

0.200

±0.005

(5.080

±0.127)

0.850

±0.008

(21.590

±0.203)

0.010

±0.002

(0.254

±0.051)

0.035

±0.005

(0.889

±0.127)

0.040

±0.004

(1.016

±0.102)

0.050

±0.005

(1.270

±0.127)

0.090

±0.010

(2.286

±0.254)

0.130 MAX

(3.31)

BOTTOM VIEW

SIDE VIEW

VIEW "A"

INDEX DENOTES
PIN NO. 1

0.100 DIA.

(2.540) (see note 4)

1.024 ±0.014 NOM.

(26.010 ±0.356)

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

FIGURE 3. BU-65178P / 65179P* /61588P /61688P*/61689P* MECHANICAL OUTLINE (PIN GRID ARRAY - PGA)

FIGURE 4. BU-65178G / 65179G* /61588G /61688G*/61689G* MECHANICAL OUTLINE (GULL LEAD)

9
8
7
6
5
4
3
2
1

0.800 ±0.005

(20.320 ±0.127)

0.100 ±0.005

(2.540 ±0.127)

TOP VIEW

Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL

)

3) Lead Material: Kovar, Plated by 50

µ in. minimum nickel under 60µ in. minimum gold.

J H G F E D C B A

BOTTOM VIEW

1.000 SQ ±0.010

(25.400 ±0.254)

0.180 ±0.008

(4.572 ±0.203)

0.018 ±0.002

(0.457 ±0.051)

0.155 MAX

(3.810)

SIDE VIEW

0.070 ±0.005

(1.778 ±0.127)

0.070 ±0.005

(1.778 ±0.127)

Indicates
Pin A1

1.00 SQ

±0.01

(25.40

±0.25)

VIEW "B"

Notes:
1) Dimensions are in inches (mm).
2) Package Material: Alumina (AL

)

3) Lead Material: Kovar, Plated by 50

µ in. minimum nickel

under 60

µ in. minimum gold.

4) There are 8 test pads located on the bottom of the package.
These pads are recessed so as not to interfere when
mounting the hybrid.

VIEW "B"

1.38

±0.02

(35.05

±0.51)

0.19 Ref

(4.83 Ref)

0.850

±0.008

(21.590

±0.203)

0.08 MIN FLAT

(2.03)

0.130 MAX

(3.31)

0.018

±0.002

(0.457

±0.051)

0.050

±0.005

(1.270

±0.127)

BOTTOM VIEW

SIDE VIEW

VIEW "A"

INDEX DENOTES
PIN NO. 1

0.100 DIA.

(2.540) (see note 4)

0.010

±0.002

(0.254

±0.051)

0.012 R. MAX

(0.305 R.)

0.05 MIN FLAT

(1.27)

0.075 MAX FLAT

(1.91)

1.024 ±0.014 NOM.

(26.010 ±0.356)

VIEW "A"

0.006 -0.004,+0.010

(0.152

-0.100,+ 0.254)

0.050 ±0.005
(1.27 ±0.127)

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

TRANSFORMERS

In selecting isolation transformers to be used with the Mini-ACE,
there is a limitation on the maximum amount of leakage induc-
tance. If this limit is exceeded, the transmitter rise and fall times
may increase, possibly causing the bus amplitude to fall below
the minimum level required by MIL-STD-1553. In addition, an
excessive leakage imbalance may result in a transformer dynam-
ic offset that exceeds 1553 specifications.

The maximum allowable leakage inductance is 6.0 µH, and
is measured as follows:

The side of the transformer that connects to the
Mini-ACE is defined as the "primary" winding. If one side of the
primary is shorted to the primary center-tap, the inductance
should be measured across the "secondary" (stub side) winding.

This inductance must be less than 6.0 µH. Similarly, if the other
side of the primary is shorted to the primary center-tap, the
inductance measured across the "secondary" (stub side) wind-
ing must also be less than 6.0 µH.

The difference between these two measurements is the
"differential" leakage inductance. This value must be less than
1.0 µH.

Beta Transformer Technology Corporation (BTTC), a subsidiary
of DDC, manufactures transformers in a variety of mechanical
configurations with the required turns ratios of 1:2.5 direct cou-
pled, and 1:1.79 transformer coupled. TABLE 3 provides a listing
of many of these transformers. For further information, contact
BTTC at 631-244-7393 or at www.bttc-beta.com.

DLP-7014
SLP-8007
SLP-8024

NOT RECOMMENDED

LPB-5015

TLP-1005

HLP-6015

Dual epoxy transformer, side by side, surface mount, 0.930" X 0.630", 0.155" max height

DLP-7115 (see note1)

Dual epoxy transformer, side by side, surface mount, 1.410" X 0.750", 0.130" max height

Single metal transformer, hermetically sealed, surface mount, 0.630" X 0.630", 0.175" max height

TLP-1105

HLP-6014

Dual epoxy transformer, side by side, flat pack, 0.930" X 0.630", 0.155" max height

Single metal transformer, hermetically sealed, flat pack, 0.630" X 0.630", 0.175" max height

TLP-1205

Dual epoxy transformer, side by side, through-hole, 0.930" X 0.630", 0.155" max height

TST-9027

Dual epoxy transformer, twin stacked, flat pack, 0.625" X 0.625", 0.280" max height

TST-9017

Dual epoxy transformer, twin stacked, surface mount, 0.625" X 0.625", 0.280" max height

TST-9007

Dual epoxy transformer, twin stacked, 0.625" X 0.625", 0.280" max height

B-3819

LPB-5014

Single epoxy transformer, surface mount, hi-temp solder, 0.625" X 0.625", 0.220" max height.

Single epoxy transformer, flat pack, 0.625" X 0.625", 0.150" max height

B-3227

Single epoxy transformer, surface mount, 0.625" X 0.625", 0.275" max height

B-3231

Single epoxy transformer, flat pack, 0.625" X 0.625", 0.275" max height

B-3818

B-3067
B-3226

Single epoxy transformer, through-hole, 0.625" X 0.625", 0.220" max height.

Single epoxy transformer, through-hole, 0.625" X 0.625", 0.250" max height

BTTC PART NO.

TRANSFORMER CONFIGURATION

Single epoxy transformer, surface mount, 0.625" X 0.625", 0.150" max height

B-3229

Single epoxy transformer, through hole, transformer coupled only, 0.500" X 0.350", 0.250" max height

TABLE 3. BTTC TRANSFORMERS FOR USE WITH MINI-ACE

Notes:
1. DLP-7115 operates to +85°C max. All other transformers listed operate to +130°C max.

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

INTERFACE TO MIL-STD-1553 BUS

FIGURE 5 illustrates the interface between the various versions
of the Mini-ACE and a MIL-STD-1553 bus. Connections for both
direct (short stub) and transformer (long stub) coupling, as well

as the nominal peak-to-peak voltage levels at various points
(when transmitting), are indicated in the diagram.

Mini-ACE

DATA

BUS

TX/RX

(1:2.5)

11.2 Vpp

28 Vpp

1 FT MAX

(1:1.79)

11.2 Vpp

20 Vpp

(1:1.41)

COUPLING

TRANSFORMER

0.75 Z

LONG STUB

(TRANSFORMER

COUPLED)

20 FT MAX

28 Vpp

SHORT STUB

(DIRECT COUPLED)

NOTES: 1. Z

= 70 TO 85 OHMS

ISOLATION

TRANSFORMER

ISOLATION

TRANSFORMER

7 Vpp

2. NOMINAL VOLTAGE
LEVELS SHOWN

Mini-ACE

FIGURE 5. MINIATURE ADVANCED COMMUNICATIONS ENGINE INTERFACE TO MIL-STD-1553 BUS

Data Device Corporation

www.ddc-web.com

BU-65178/65179*/61688*/61689*

K-04/05-0

ORDERING INFORMATION

BU-61588F3-11XX

Supplemental Process Requirements:

S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Source Inspection
K = One Lot Date Code
W = One Lot Date Code and Pre-Cap Source Inspection
Y = One Lot Date Code and 100% Pull Test
Z = One Lot Date Code, Pre-Cap Source Inspection and 100% Pull Test
Blank = None of the Above

Test Criteria:

0 = Standard Testing
2 = MIL-STD-1760 Amplitude Compliant - Applies to +5 Volt Transceiver Option Only

Process Requirements:

0 = Standard DDC processing, no Burn-In (See table on next page)
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (See table on next page)

Temperature Range/Data Requirements:

1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data

Voltage/Transceiver Option:

0 = No Transceivers
3 = +5 Volts, rise/fall times=100 to 300 ns (-1553B) (See Test Criteria - 1760 Compliant with option -XX2)

Package Type:

F = 72-Pin Quad Flat Pack
P = 81-Pin PGA
G = 72-Pin Gull Lead (Contact factory.)

Product Type:

65178 = RT Only, 16/12 MHz, 4K RAM
61588 = BC/RT/MT, 16/12 MHz, 4K RAM
65179 = RT/RT_BOOT, 10/12/16/20 MHz, 4K RAM
61688 = BC/RT/MT, 12/16 MHz, 64K RAM
61689 = BC/RT/MT, 10/20 MHz, 64K RAM

*Standard DDC Processing with burn-in and full temperature test, see table on next page.

K-04/05-0

PRINTED IN THE U.S.A.

The information in this data sheet is believed to be accurate; however, no responsibility is

assumed by Data Device Corporation for its use, and no license or rights are

granted by implication or otherwise in connection therewith.

Specifications are subject to change without notice.

Please visit our Web site at www.ddc-web.com for the latest information.

105 Wilbur Place, Bohemia, New York, U.S.A. 11716-2482

For Technical Support - 1-800-DDC-5757 ext. 7771

Headquarters, N.Y., U.S.A. - Tel: (631) 567-5600, Fax: (631) 567-7358
Southeast, U.S.A. - Tel: (703) 450-7900, Fax: (703) 450-6610
West Coast, U.S.A. - Tel: (714) 895-9777, Fax: (714) 895-4988
United Kingdom - Tel: +44-(0)1635-811140, Fax: +44-(0)1635-32264
Ireland - Tel: +353-21-341065, Fax: +353-21-341568
France - Tel: +33-(0)1-41-16-3424, Fax: +33-(0)1-41-16-3425
Germany - Tel: +49-(0)89-15 00 12-11, Fax: +49-(0)89-15 00 12-22
Japan - Tel: +81-(0)3-3814-7688, Fax: +81-(0)3-3814-7689
World Wide Web - http://www.ddc-web.com

DATA DEVICE CORPORATION
REGISTERED TO ISO 9001:2000

FILE NO. A5976

T ERED

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