ChipFind - документация

Электронный компонент: B69812N1967E360

Скачать:  PDF   ZIP
Microwave Ceramics and Modules
Filter
2-Pole Filter for PCS RX
B69812N1967E360
Data Sheet
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
1/4
Features
SMD filter consisting of coupled resonators with stepped impedances
(NdBa)TiO3 (
r
= 88 / TCf =010 ppm/K) with a coating of copper (10
m) and tin (>5
m)
Excellent reflow solderability, no migration effect due to copper/tin metallization
Index
Page 2
Component drawing
Recommended footprint
Page 3
Characteristics
Maximum ratings
Typical passband characteristic
Page 4
Processing information
Soldering requirements
Delivery mode
Microwave Ceramics and Modules
Filter
2-Pole Filter for PCS RX
B69812N1967E360
Data Sheet
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
2/4
Component drawing
Recommended footprint
G I/O
G
G
I/O
View from below onto the solder terminals and view from beside
Microwave Ceramics and Modules
Filter
2-Pole Filter for PCS RX
B69812N1967E360
Data Sheet
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
3/4
Characteristics
min.
typ.
max.
Center frequency
fc -
1960.0
-
MHz
Insertion loss
IL
1.1
1.5
dB
Passband
B 60
MHz
Amplitude ripple (peak - peak)
0.3
0.5
dB
Standing wave ratio
SWR
1.5
2.0
Impedance
Power
Z
P
50
1.0
W
Attenuation
at DC to 1600 MHz
at 1600 to 1830 MHz
at 1830 to 1910 MHz
at 2030 to 2090 MHz
at 2090 to 3200 MHz
32
15
2.5
2.5
10
35
17
3
3
12
dB
dB
dB
dB
dB
Maximum ratings
IEC climatic category (IEC 68-1)
- 40/+ 90/56
Operating temperature
T
op
- 20 / + 80
C
Typical passband characteristic
-60
-50
-40
-30
-20
-10
0
1.6 1.64 1.68 1.72 1.76 1.8 1.84 1.88 1.92 1.96 2 2.04 2.08 2.12 2.16 2.2 2.24 2.28 2.32 2.36 2.4
frequency [GHz]
attenuation [dB]
DB[S11]
DB[S21]
Microwave Ceramics and Modules
Filter
2-Pole Filter for PCS RX
B69812N1967E360
Data Sheet
ISSUE DATE
12.03.04
ISSUE
B
PUBLISHER
SAW MWC PD
PAGE
4/4
Processing information
Wettability acc. to IEC 68-2-58:
75% (after aging)
Soldering Requirements
Profile for eutectic
SnPb solder paste
Profile for leadfree
solder paste
Soldering type
reflow
reflow
Maximum soldering temperature
235 (max. 2 sec.)
260 (max. 2 sec.)
C
(measuring point on top surface of the component) 225 (max. 10 sec.)
250 (max. 10 sec.) C
Recommended soldering conditions (infrared):
20-40 sec.
40-80 sec.
within 10 sec.
Time [sec.]
Temp. [C]
215C10C
30 sec.
2-3 min.
within 10 sec.
Time [sec.]
Temp. [C]
245C5C
2.5 C/s
> - 5 C/s
Delivery mode
Blister tape acc. to IEC 286-3, polyester, grey
Pieces/tape: 3000
EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics.
Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry
recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed.
A
A
B
B
Profile B-B:
Profile A-A:
direction of unreeling
Reel: diameter - 330 mm