NTC thermistors for
temperature measurement
Probe assemblies, water sensor
Series/Type:
B58100
Date:
March 2006
EPCOS AG 2006. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
Applications
Temperature measurement in
heating water and used water
heating systems
water boilers
Features
Sealing with O-ring
Brass housing CuZn36Pb2As/CZ132
Short response time
Withstand voltage 500 V
FASTON plug terminals with Rast 5 housing
Options
Alternative resistance ratings,
rated temperatures and resistance tolerances
available on request.
Delivery mode
Bulk
Dimensional drawing
Dimensions in mm
Approx. weight 13 g
General technical data
Climatic category
(IEC 60068-1)
5/100/21
Max. power
(at 25
C)
P
25
60
mW
Resistance tolerance
R
R
/R
R
2
%
Rated temperature
T
R
85
C
Thermal time constant
(in water)
a
<5
s
Heat capacity
C
th
250
mJ/K
Insulation resistance
(V = 100 VDC, t = 1 s) R
ins
>10
M
Test voltage
(t = 1 min)
V
test
500
VAC
Electrical specification and ordering codes
R
25
R
85
No. of R/T
characteristic
B
25/100
K
Ordering code
11991
1465
2901
3760
0.5%
B58100A0414A000
Temperature measurement
B58100
Probe assemblies
Z81
Page 2 of 7
Please read Important notes and
Cautions and warnings at the end of this document.
Reliability data
Test
Standard
Test conditions
R
25
/R
25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
Storage at upper
category temperature
T: 100
C
t: 500 h
< 3%
No visible
damage
Storage in damp
heat, steady state
IEC
60068-2-78
Temperature of air: 85
C
Relative humidity of air: 85%
Duration: 21 days
< 3%
No visible
damage
Rapid temperature
cycling (in fluid)
IEC
60068-2-14
Lower test temperature: 5
C
Upper test temperature: 85
C
Time to change from lower to
upper temperature: <30 s
Number of cycles: 1000
Medium: oil
< 3%
No visible
damage
Long-term stability
(empirical value)
Temperature: 100
C
t: 10000 h
< 3%
No visible
damage
Thermal overload
Short time overload: 125
C
t: 10 h
< 3%
No visible
damage
Temperature measurement
B58100
Probe assemblies
Z81
Page 3 of 7
Please read Important notes and
Cautions and warnings at the end of this document.
R/T characteristics
B58100A0414A000
R/T No.
2901
T (
C)
B
25/100
= 3760 K, R
25
= 11991
, T
R
= 80
C,
R
R
/R
R
=
2%
R
nom
[
]
R
min
[
]
R
max
[
]
R
R
/R
R
[
%]
T[
C]
(%/K)
5.0
28540
27524
29556
3.6
0.8
4.6
10.0
22782
21999
23566
3.4
0.8
4.5
15.0
18294
17686
18903
3.3
0.8
4.3
20.0
14785
14310
15260
3.2
0.8
4.2
25.0
11991
11619
12363
3.1
0.8
4.1
30.0
9794
9500
10088
3.0
0.8
4.0
35.0
8054
7820
8288
2.9
0.7
3.9
40.0
6658
6472
6845
2.8
0.7
3.8
45.0
5527
5378
5677
2.7
0.7
3.7
50.0
4612
4491
4732
2.6
0.7
3.6
55.0
3859
3762
3957
2.5
0.7
3.5
60.0
3246
3166
3325
2.4
0.7
3.4
65.0
2747
2682
2812
2.4
0.7
3.3
70.0
2334
2281
2388
2.3
0.7
3.2
75.0
1991
1948
2035
2.2
0.7
3.2
80.0
1705
1669
1741
2.1
0.7
3.1
85.0
1465
1436
1494
2.0
0.7
3.0
90.0
1263
1236
1290
2.1
0.7
2.9
95.0
1094
1070
1118
2.2
0.8
2.9
100.0
950.7
929.2
972.2
2.3
0.8
2.8
Temperature measurement
B58100
Probe assemblies
Z81
Page 4 of 7
Please read Important notes and
Cautions and warnings at the end of this document.
Cautions and warnings
General
See "Important notes" at the end of this document.
Storage
Store thermistors only in original packaging. Do not open the package before storage.
Storage conditions in original packaging: storage temperature
25
C ... +45
C, relative
humidity
75% annual mean, maximum 95%, dew precipitation is inadmissible.
Do not store SMDs where they are exposed to heat or direct sunlight. Otherwise, the packing
material may be deformed or SMDs may stick together, causing problems during mounting.
Avoid contamination of thermistors surface during storage, handling and processing.
Avoid storage of thermistor in harmful environments like corrosive gases (SOx, Cl etc).
After opening the factory seals, such as polyvinyl-sealed packages, use the SMDs as soon as
possible.
Solder thermistors after shipment from EPCOS within the time specified:
SMDs: 12 months
Leaded components: 24 months
Handling
NTC thermistors must not be dropped. Chip-offs must not be caused during handling of NTCs.
Components must not be touched with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Mounting
When NTC thermistors are encapsulated with sealing material or overmolded with plastic
material, the precautions given in chapter "Mounting instructions", "Sealing, potting and
overmolding" must be observed.
Electrode must not be scratched before/during/after the mounting process.
Contacts and housings used for assembly with thermistor have to be clean before mounting.
During operation, the thermistor's surface temperature can be very high (ICL). Ensure that
adjacent components are placed at a sufficient distance from the thermistor to allow for proper
cooling ot the thermistors.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand this temperature.
Make sure that thermistors (ICLs) are adequately ventilated to avoid overheating.
Avoid contamination of thermistor surface during processing.
Temperature measurement
B58100
Probe assemblies
Z81
Page 5 of 7
Please read Important notes and
Cautions and warnings at the end of this document.
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