32 Megabit CMOS DRAM
DPnnD2MX16PY5
PRELIMINARY
DESCRIPTION:
The DPnnD2MX16PY5 is the 2 Meg x 16 Dynamic RAM module
that utilize the new and innovative space saving TSOP stacking
technology. The module is constructed of two 1 Meg x 16
Dynamic RAM's that are configured as 2 banks of 1 Meg x 16.
The DPnnD2MX16PY5 provides for a compatible upgrade path
to higher density compatible modules. The module features
high speed access times, common data inputs and outputs, and
three standard refresh modes.
FEATURES:
Access Times: 50, 60, 70ns (max.)
5.0V or 3.3V Supply
Common Data Inputs and Outputs
EDO or Fast Page Mode Capability
4K 64ms / 1K 16ms Refresh
3 Variations of Refresh:
- RAS only Refresh
- CAS before RAS Refresh
- Hidden Refresh
Package: TSOP Leadless Stack
PIN-OUT DIAGRAM
NOTE: Pin 43 and Pin 46 are connected together,
Pin 42 and Pin 45 are connected together.
FUNCTIONAL BLOCK DIAGRAM
NOTE: LCAS controls DQ0-DQ7, UCAS controlls DQ8-DQ15.
2Mx16, 50 - 70ns, TSTACK
30A164-12
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This document contains information on a product presently under
development at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.
PIN NAMES
A0 - A11
Row Address:
A0 - A11
Column Address: A0 - A7
Refresh Address: A0 - A11
A0 - A9
Row Address:
A0 - A9
Column Address: A0 - A9
Refresh Address: A0 - A9
DQ0 - DQ15
Data In / Data Out
UCAS
Upper Column Addres Strobe
LCAS
Lower Column Addres Stobe
RAS0 - RAS1
Row Address Enables
WE0 - WE1
Data Write Enables
OE0 - OE1
Data Output Enables
V
DD
Power Supply (+5V)
V
SS
Ground
N.C.
No Connect
4K 64ms refresh.
1K 16ms refresh.
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DPnnD2MX16PY5
Dense-Pac Microsystems, Inc.
PRELIMINARY
MECHANICAL DRAWING
Dense-Pac Microsystems, Inc.
7321 Lincoln Way Garden Grove , California 92841-1431
(714) 898-0007 (800) 642-4477
(Outside CA)
FAX: (714) 897-1772 http://www.dense-pac.com
ORDERING INFORMATION
30A164-12
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