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Электронный компонент: PA60

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APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
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FEATURES
RoHS COMPLIANT
LOW COST
WIDE BANDWIDTH - 1.1 Mhz
HIGH OUTPUT CURRENT - 1A per amplifier
WIDE COMMON MODE RANGE Includes negative supply
WIDE SUPPLY VOLTAGE RANGE Single supply: 5V to
40V Split supplies: 2.5V to 20V
LOW QUIESCIENT CURRENT
VERY LOW DISTORTION
APPLICATIONS
HALF AND FULL BRIDGE MOTOR DRIVERS
AUDIO POWER AMPLIFIER
Stereo - 15.91W RMS per channel
Bridge - 31.82W RMS per 2 channels
IDEAL FOR SINGLE SUPPLY SYSTEMS
5V
- Peripherals
12V
- Automotive
28V
- Avionic
PACKAGING OPTIONS
20-Pin PSOP, JEDEC MO-166-AB (PA60DK)
12-Pin Molded Plastic SIP (PA60EU)
DESCRIPTION
The amplifier design is a dual power op amp on a single
monolithic die. This approach provides a cost-effective solu-
tion to applications where multiple amplifiers are required or
a bridge configuration is needed. Very low harmonic distortion
of 0.02% THD and low I
Q
makes the PA60 a good solution for
low power audio applications such as laptops and computer
speakers.
FIGURE 1. Equivalent schematic (one channel)
The dual output PA60 is available in two industry-standard
packages. The through hole version of the PA60, the PA60EU,
is available in a 12-Pin Molded Plastic SIP with standard 100
mil spacing. The heat tab of EU package is tied to -VS. The
surface mount version of the PA60, the PA60DK, is available
in a 20-Pin PSOP, JEDEC MO-166-AB package. The heat
slug of the DK package is tied to -VS.
FIGURE 2. Bi-directional speed control from a single supply
TYPICAL APPLICATION
R1 and R2 set up Amplifier A as non-inverting. Amplifier
B is set up as a unity gain inverter driven from the output of
Amplifier A. Note that Amplifier B inverts the signals about
the reference node, which is set at mid-supply by R5 and
R6. When the command input is midrange, so is the output
of Amplifier A. Since this is also equivalent to the reference
node voltage, the output of Amplifier B is the same resulting
in 0V across the motor. Inputs more positive than 5V result in
motor current flow from left to right (see Figure 2). Inputs less
than 5V drive the motor in the opposite direction.
The amplifiers are especially well-suited for applications such
as this. The extended common mode range allows command
inputs as low as 0V. The output swing lets it drive within 2V
of the supply at an output of 1A. This means that a command
input that ranges from 0 to 10V will drive a 24V motor from
full scale CCW to full scale CW at 1A.
FIGURE 3. External connections
20-PIN PSOP
PACKAGE STYLE DK
12-PIN SIP
PACKAGE STYLE EU
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
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PARAMETER
TEST CONDITIONS
1,2
MIN
TYP
MAX
UNTS
INPUT
OFFSET VOLTAGE, initial
1
15
mV
OFFSET VOLTAGE, vs. temperature
Full temp range
20
V/C
BIAS CURRENT, initial
100
500
nA
COMMON MODE RANGE
Full temp range
-Vs
+Vs - 1.3
V
COMMON MODE REJECTION, DC
60
90
dB
POWER SUPPLY REJECTION
Full temp range
60
90
dB
CHANNEL SEPARATION
I
OUT
= 500mA, = 1kHz
50
68
dB
INPUT NOISE VOLTAGE
R
S
= 100, = 1 to 100kHz
22
nV/Hz
GAIN
OPEN LOOP GAIN
V
O
= 10V, R
L
= 2.0K
89
100
dB
GAIN BANDWIDTH PRODUCT
= 100kHz, C
L
= 100pF, R
L
= 2.0K
0.9
1.4
MHz
PHASE MARGIN
Full temp range, C
L
= 100pF, R
L
= 2K
65
C
POWER BANDWIDTH
V
O
(P-P) = 28V
13.6
kHz
OUTPUT
CURRENT, peak (PA60DK)
1.0
A
CURRENT, peak (PA60EU)
1.5
A
SLEW RATE
1.0
1.4
V/S
VOLTAGE SWING
Full temp range, I
O
= 100mA
|Vs| -1.1
|Vs| -0.8
V
VOLTAGE SWING
Full temp range, I
O
= 1A
|Vs| -1.8
|Vs| -1.4
V
HARMONIC DISTORTION
A
V
= 1, R
L
= 50,
.02
%
V
O
= .5VRMS, = 1kHz
POWER SUPPLY
VOLTAGE, Vss
3
5
30
40
V
CURRENT, quiescent total
8
10
mA
THERMAL
RESISTANCE, junction to case
DC, 1 amplifier, (PA60EU)
5.71
6.29
C/W
DC, 1 amplifier, (PA60DK)
6.51
7.16
C/W
DC, 2 amplifiers, (PA60EU)
4
3.57
3.93
C/W
DC, 2 amplifiers, (PA60DK)
4
4.44
4.88
C/W
AC, 1 amplifier, (PA60EU)
4.29
4.71
C/W
AC, 1 amplifier, (PA60DK)
4.88
5.37
C/W
AC, 2 amplifiers, (PA60EU)
4
2.68
2.95
C/W
AC, 2 amplifiers, (PA60DK)
4
3.33
3.66
C/W
RESISTANCE, junction to air (PA60EU)
30
C/W
RESISTANCE, junction to air (PA60DK)
6
25
C/W
ABSOLUTE MAXIMUM RATINGS
SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
PA60
Notes:
1. Long term operation at the maximum junction temperature will result in reduced product life. Derate internal power dissipation
to achieve high MTTF.
2. Unless otherwise noted, the following conditions apply: V
S
= 15V, T
C
=25C.
3. +V
S
and -V
S
denote the positive and negative rail respectively. V
SS
denotes total rail-to-rail supply.
4. Rating applies when power dissipation is equal in each of the amplifiers.
5. If -V
S
is disconnected before +V
S
, a diode between -V
s
and ground is recommended to avoid damage.
6. Rating applies when the hesatslug of the DK package is soldered to a minimum of 1 square inch foil area of a printed circuit
board.
SUPPLY VOLTAGE, total
5V to 40V
OUTPUT CURRENT
SOA
POWER DISSIPATION, internal (PA60EU, 1 amplifier)
19.89W
POWER DISSIPATION, internal (PA60DK, 1 amplifier)
17.46W
POWER DISSIPATION, internal (PA60EU, 2 amplifiers)
4
31.82W
POWER DISSIPATION, internal (PA60DK, 2 amplifiers)
4
25.60W
INPUT VOLTAGE, differential
Vs
INPUT VOLTAGE, common mode
+Vs,-Vs-.5V
JUNCTION TEMPERATURE, max.
1
150C
TEMPERATURE, pin solder - 10 secs max.
220C
TEMP RANGE STORAGE
-55C to 150C
OPERATING TEMP RANGE, case
1
-40C to 125C
SPECIFICATIONS (PER AMPLIFIER)
APEX MICROTECHNOLOGY CORPORATION TELEPHONE (520) 690-8600 FAX (520) 888-3329 ORDERS (520) 690-8601 EMAIL prodlit@apexmicrotech.com
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TYPICAL PERFORMANCE
GRAPHS
PA60
APEX MICROTECHNOLOGY CORPORATION 5980 NORTH SHANNON ROAD TUCSON, ARIZONA 85741 USA APPLICATIONS HOTLINE: 1 (800) 546-2739
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This data sheet has been carefully checked and is believed to be reliable, however, no responsibility is assumed for possible inaccuracies or omissions. All specifications are subject to change without notice.
PA60U REV F MARCH 2006 2006 Apex Microtechnology Corp.
GENERAL
Please read Application Note 1 "General Operating Consider-
ations" which covers stability, supplies, heatsinking, mounting,
SOA interpretation, and specification interpretation. Visit www.
apexmicrotech.com for design tools that help automate tasks
such as calculations for stability, internal power dissipation,
heatsink selection; Apex's complete Application Notes library;
Technical Seminar Workbook; and Evaluation Kits.
STABILITY CONSIDERATIONS
All monolithic power op amps use output stage topologies
that present special stability problems. This is primarily due to
non-complementary (both devices are NPN) output stages with
a mismatch in gain and phase response for different polarities
of output current. It is difficult for the op amp manufacturer to
optimize compensation for all operating conditions.
SAFE OPERATING AREA (SOA)
The SOA curves combine the effect of all limits for this power
op amp. For a given application, the direction and magnitude
of the output current should be calculated or measured and
checked against the SOA curves. This is simple for resistive
loads but more complex for reactive and EMF generating
loads. The following guidelines may save extensive analyti-
cal efforts.
GENERAL
CONSIDERATIONS
PA60
THERMAL CONSIDERATIONS
The PA60EU has a large exposed copper heat tab to which
the monolithic is directly attached. The PA60EU may require
a thermal washer, which is electrically insulating since the tab
is directly tied to -VS. This can result in a thermal impedance
RCS of up to 1C/W or greater.
The PA60DK has a large exposed integrated copper heatslug
to which the monolithic is directly attached. The solder connec-
tion of the heatslug to a minimum of 1 square inch foil area of
the printed circuit board will result in thermal performance of
25C/W junction to air rating of the PA60DK. Solder connec-
tion to an area of 1 to 2 square inches of foil is required for
minimal power applications
Where the PA60DK is used in higher power applications,
it is necessary to use surface mount techniques of heatsink-
ing. Surface mount techniques include the use of a surface
mount fan in combination with a surface mount heatsink on
the backside of the FR4/ PC board with through hole thermal
vias. Other highly thermal conductive substrate board materials
are available for maximum heat sinking.
MOUNTING PRECAUTIONS
1. Always use a heat sink. Even unloaded the PA60DK and
PA60EU can dissipate up to .4 watts.
2. Avoid bending the leads. Such action can lead to internal
damage.
3. Always fasten the tab of the EU package to the heat sink
before the leads are soldered to fixed terminals.
4. Strain relief must be provided if there is any probability of
axial stress to the leads.