ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise

customers to obtain the latest version of relevant information to verify before placing orders.

··
··
·

Able to Drive Both Windings of Bipolar Stepper

Motor

··
··
·

Up to 750 mA Continuous Output Current for

Each Winding

··
··
·

Up to 28V

Output Sustaining Voltage

··
··
·

Internal PWM Current Control

··
··
·

Built-in Protection Diode

··
··
·

Low Output Saturation Voltage

··
··
·

Internal Thermal Shutdown

Lead Free Available (RoHS Compliant)

Features

General Description

The APX6219 is designed to drive both winding of a

two-phase bipolar stepper motor or bidirectionally

control 2 DC motors. APX6219 includes two H-

bridges capable of continuous output current of ±750

mA with peak start up to 1A and operating voltages

up to 28V. Motor winding current can be controlled

by the internal fixed-frequency, pulse-width modulated

(PWM), current-control circuitry. Wide range current

control is controlled by means of two logic inputs with

a external reference voltage for each bridge. The peak

load current limit is set by the user's selection of a

reference voltage and current-sensing resistor. Two

logic-level select output current limits of 0%,33%,

67%, or 100% of the maximum level. A phase input

to each bridge determines load current direction. A

thermal shutdown protection circuit disables the out-

puts if the chip temperature over the safe operation

limit. The APX6219 come in SOP-24 package.

Applications

Scanner

Stepping Motor Control

Thermal Printer

Pin Configuration

SOP-24 (Top View)

OUT1A

OUT2A

SENSE2

GND

COMP.INPUT1

l01

GND

OUT2B

COMP.INPUT2

l02

I12

OUT1B

GND

l11

PHASE1

RC1

(LOAD SUPPLY)

(LOGIC SUPPLY)

VREF1

SENSE1

GND

PHASE2

VREF2

RC2

PWM Stepper Motor Driver

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

A P X 6 2 1 9

P a c k a g e C o d e
K : S O P - 2 4

T e m p . R a n g e
I : -4 0 C to 8 5 C
H a n d lin g C o d e
T U : T u b e T R : T a p e & R e e l
L e a d F re e C o d e

L : L e a d F re e B la n k : O rig in a l D e v ic e

H a n d lin g C o d e

T e m p . R a n g e

P a c k a g e C o d e

A P X 6 2 1 9 K :

A P X 6 2 1 9
X X X X X

X X X X X - D a t e C o d e

L e a d F re e C o d e

Pin Description

PIN

NO. Name

I/O Description

1,2 OUTPUT

H- bridge Output connection. The output stage is a "H" bridge formed by four
transistors and four-protection diode for switching applications.

3,23

Sense

Resistor

Connection to lower emitters of output stage for insertion of current sensor
resistor to check the peak value of output current

4,22

Comparator

Input

The voltage across the sense resistor is feedback to this input through the
low pass filter R

. The higher power transistors are disabled when the

sense voltage exceeds the reference voltage of selected comparator. The
current decays for a time set by R

when this happen

5,21

OUTPUT B

O See pins 1,2

6,7,18,19 Ground

Ground

connection

These pins are logic inputs which select the outputs of the comparators to set
the output current level. Current also depends on the sensing resistor and
reference voltage.

I0 I1

Current

level

H H

L H

H L

8,9 I02/I12

L L

No current
Low current 1/3 I

max

Medium current 2/3 I

max

Maximum current I

max

20,17

I01/I11

See pins 8,9; current level control for channel2

10,16 PHASE I

This TTL-compatible logic input sets the current flow direction through load.
A schmitt trigger with this input provides the noise immunity and a delay
circuit prevents output stage short circuits during switching

11,15

Reference

Voltage

A voltage apply this pin sets the input of a comparator to control the output
current

12,14 R

connection to this pin sets the off time of higher power transistor

13 V

Logic supply voltage

24 V

Load supply voltage

Ordering and Marking Information

Notes: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termi-

nation finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.

ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classifica-

tion at lead-free peak reflow temperature.

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Block Diagram

LOGIC

SURRENT

SELECT

POWER
BRIDGE

LOGIC

SURRENT

SELECT

THERMAL

SHUTDOWN

POWER
BRIDGE

(22)

COMPARATOR

INPUT1

(14)

RC1

(13)

¡)

LOGIC

SUPPLY

(24)

LOAD

SUPPLY

(1)

OUT1A

(21)

OUT1B

WINDING1

(2)

OUT2A

(5)

OUT2B

WINDING2

(20)

I01

¡]

¡^

I11

(16)

PHASE1

(15)

VREF1

(11)

VREF2

(8)

I02

(9)

I12

(10)

PHASE2

(6,7,18,19)

GND

(4)

COMPARATOR

INPUT2

(12)

RC2

(23)

SENSE1
R

SENSE1

(3)

SENSE2
R

SENSE2

Absolute Maximum Ratings

Symbol Parameter Rating

Unit

Load

Supply

Voltage

Output Current (Peak)

Output Current (Continuous)

750

Logic

Supply

Voltage

Logic

Input

Voltage

-0.3 to

+0.3

SENSE

Driver Output Sense Voltage

1.5

TH,JA

Thermal Resistance Junction to Ambient*
SOP-24

C/W

TH,JC

Thermal Resistance Junction to Case
SOP-24

C/W

Power

Dissipation

Internally

Limited

Junction Temperature

0 to 150

Operating Temperature Range

0 to 70

STG

Storage Temperature Range

-65 to +150

°C

Lead Temperature (Soldering, 10 second)

260

(*) With minimized copper area.

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Electrical Characteristics

APX6219

Symbol Parameter

Test

Conditions

Min. Typ. Max.

Unit

Output drivers (OUTA or OUTB)

Motor

Supply

Voltage

10 28 V

LEAK

Output

Leakage

Current

OUT

<-1

-50

(sat) Output

Saturation

Voltage

Sink driver, I

OUT

=+500mA

Sink driver, I

OUT

=+750mA

Source driver, I

OUT

=-500mA

Source driver, I

OUT

=-750mA

0.4
0.8
1.1
1.4

0.7
1.1
1.4
1.7

Clamp Diode Leakage Current

=28V

Clamp Diode Forward Voltage

Sink diode
Source diode I

=750mA

1.6
1.6

2
2

(on)

Driver Supply Current

Both bridges ON, no load

(off)

Driver Supply Current

Both bridges OFF

Control logic

Voltage

Input

All

inputs

2.4

Voltage

Input

All

inputs

0.8 V

Input

Current

=2.4V

Input

Current

=0.8V

-5

-50

REF

Reference

Voltage

1.5 7.5 V

(on) Logic Supply Current

I0=I1=0.8V, no load

(off) Logic Supply Current

I0=I1=2.4V, no load

REF

SENSE

Current Limit Threshold (at trip
point)

I0=I1=0.8V
I0=2.4V,I1=0.8V
I0=0.8V,I1=2.4V

9.5

13.5
25.5

10
15
30

10.5
16.5
34.5

OFF

Cutoff

Time

=56K

, C

=820pF

Turn

off

Delay

Protection

Over Temperature Shutdown

150

OTS

Over Temperature Shutdown
Hystersis

Hystersis

Unless otherwise noted these specifications apply over full temperature, V

=28V, V

=4.75 to 5.25V, V

REF

=5V,

=0 to 125

C . Typical values refer to T

=25

C .

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

1 2

1 0

1 1

2 4

2 3

2 2

1 3

2 1

2 0

1 9

1 8

1 7

1 6

1 5

1 4

C C

R E F 1

B B

S T E P P E R

M O T O R

R E F 2

F o m

= 5 6 K

, C

= 8 2 0 p F

= 1 K

, C

= 8 2 0 p F

= 1

0 .1

1 0 0

Typical Application Circuit

RE F

1 0

C M P

O ne
sho t

5 6 k

8 2 0 p f

O U TA

m o to r

S e nse

S o urce
D isa b le

O U TB

2 0 k

4 0 k

1 0 k

B B

C O M P IN

RE F

1 0

C M P

O ne
sho t

5 6 k

8 2 0 p f

O U TA

m o to r

S e nse

S o urce
D isa b le

O U TB

2 0 k

4 0 k

1 0 k

B B

C O M P IN

OU TB

OU TA

P has e

OU TB

OU TA

P has e

True Table

PWM Current-Control Circuitry

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

100

200

300

400

500

600

700

800

900

0.25

0.5

0.75

1.25

1.5

1.75

100

110

90 100

Typical Characteristics

(V)

(mA)

Sink

Output Saturation Voltage

Source

vs. Cut Off Time

)

Cut Off Time(

=470pF

820pF

1000pF

Operating Waveform1

Time (1ms/div)

Time (0.1ms/div)

PHASE1

(5V/div)

(500mA~-500mA)

OUT1A

(10V/div)

=56k

=820pF,

=1k

=820pF

OUT1B

(10V/div)

Operating Waveform2

(300mA~-300mA)

COMP INPUT1

RC1

(1.6V~4.2V)

OUT1A

(10A/div)

=56k

=820pF,

=1k

=820pF

=5V

=12V

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Application Information

PWM Current Control

The APX6219 dual bridge is designed to drive both

windings of a bipolar stepper motor. Output current is

sensed and controlled independently in each bridge

by an external sense resistor (R

), internal comparator,

and monostable multivibrator. When the bridge is

turned on, current increases in the motor winding and

it is sensed by the external sense resistor until the

sense voltage (V

COMPIN

) reaches the level set at the

comparator's input:

TRIP

= V

REF

/10 R

The comparator then triggers the monostable which

turns off the source driver of the bridge. The actual

load current peak will be slightly higher than the trip

point (especially for low-inductance loads) because of

the internal logic and switching delays. This delay (T

)

is typically 2

s. After turn-off, the motor current

decays, going through the ground-clamp diode and

sink transistor (source off). The source driver's off time

is determined by the external RC timing components,

where T

OFF

= R

within the range of 30k

to 100k

and 470pF to 1000pF.When VRC drop to certain

voltage, the source driver will be re-enabled automati-

cally (bridge on), the winding current is again limited

at the desired level.

Loads with high V

, low L , high-frequency and low

current will may result in high turn-on current peaks.

This peak (appearing across R

) will attempt to trip

the comparator, resulting in erroneous current control

or high-frequency oscillations. An external R

time

delay should be used to form low pass filter to reduce

noise to avoid the comparator's fault operation. The

locations of R

, C

, R

components should be as close

to the APX6219 as possible.

Logic Control Of Output Current

Two logic level inputs (l0 and I1) allow digital selection

of the motor winding current at 100%, 67%, 33%, or

0% of the maximum level per the table. The 0% out-

put current condition turns off all drivers in the bridge

and can be used as an OUTPUT Disable/Enable

function.

During half-step operations, the l0 and l1 allow the

to control the motor at a constant torque between all

positions in an eight-step sequence. This is accom-

plished by digitally selecting 67% drive current when

two phases are on. When all drivers are turn off will

make rapid current decay when phases be changed.

This helps to ensure proper motor operation at high

step rates.

The logic control inputs can also be used to select a

reduced current level (and reduced power dissipation)

for `hold' conditions and/or increased current (and avail-

able torque) for start-up conditions.

General

The PHASE input to each bridge determines the di-

rection motor winding current flows. An internally gen-

erated deadtime (approximately 2

s) prevents shoot

through that can occur when switching the PHASE

input. Thermal protection circuitry turns off all drivers

when the junction temperature reaches +150°C. It is

only intended to protect the device from failures due

to excessive junction temperature and should not im-

ply that output short circuits are permitted. The out-

put drivers are re-enabled when the junction tempera-

ture cools to +130°C.

The APX6219 output drivers are optimized for low out-

put saturation, less than 2V (source plus sink) at load-

ing 500mA.Under normal operating conditions, this

allows continuous operation of both bridges simulta-

neously at 750mA (such as Typical Application).

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Package Information

SO 300mil ( Reference JEDEC Registration MS-013)

Millimeters

Variations- D

Inches

Variations- D

Dim

Min.

Max.

Variations

Min.

Max.

Dim

Min.

Max.

Variations

Min.

Max.

2.35

2.65

SO-16

10.10

10.50

0.093

0.1043

SO-16

0.398

0.413

0.10

0.30

SO-18

11.35

11.76

0.004

0.0120

SO-18

0.447

0.463

0.33

0.51

SO-20

12.60

0.013

0.020

SO-20

0.496

0.512

See variations

SO-24

15.20

15.60

See variations

SO-24

0.599

0.614

7.40

7.60

SO-28

17.70

18.11

0.2914

0.2992

SO-28

0.697

0.713

1.27BSC

SO-14

8.80

9.20

0.050BSC

SO-14

0.347

0.362

10.65

0.394

0.419

0.40

1.27

0.016

0.050

See variations

1 2 3

G A U G E

P L A N E

A 1

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

t 25 C to P ea k

R am p-up

R am p-do w n

P reheat

T sm ax

T sm in

Tem

T im e

C ritical Z one

to T

Physical Specifications

Terminal Material

Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn

Lead Solderability

Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.

Reflow Condition

(IR/Convection or VPR Reflow)

Classificatin Reflow Profiles

Profile Feature

Sn-Pb Eutectic Assembly

Pb-Free Assembly

Average ramp-up rate
(T

to T

)

C/second max.

Preheat

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (min to max) (ts)

100

150

60-120 seconds

150

200

60-180 seconds

Time maintained above:

Temperature (T

)

Time (t

)

183

60-150 seconds

217

60-150 seconds

Peak/Classificatioon Temperature (Tp)

See table 1

See table 2

Time within 5

C of actual

Peak Temperature (tp)

10-30 seconds

20-40 seconds

Ramp-down Rate

C/second max.

Time 25

C to Peak Temperature

6 minutes max.

8 minutes max.

Notes: All temperatures refer to topside of the package .Measured on the body surface.

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Reliability test program

Test item

Method

Description

SOLDERABILITY

MIL-STD-883D-2003

245

C , 5 SEC

HOLT

MIL-STD-883D-1005.7

1000 Hrs Bias @ 125

PCT

JESD-22-B, A102

168 Hrs, 100 % RH , 121

TST

MIL-STD-883D-1011.9

-65

C ~ 150

C, 200 Cycles

ESD

MIL-STD-883D-3015.7

VHBM > 2KV, VMM > 200V

Latch-Up

JESD 78

10ms , I

> 100mA

Carrier Tape

A o

P o

K o

B o

D 1

P 1

Table 2. Pb-free Process Package Classification Reflow Tem peratures

Package Thickness

Volum e m m

<350

Volum e m m

350-2000

Volum e m m

>2000

<1.6 m m

260 +0

C* 260

1.6 m m 2.5 m m

260 +0

C* 250

C* 245

2.5 m m

250 +0

C* 245

*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and

including the stated classification tem perature (this m eans Peak reflow tem perature +0

For exam ple 260

C+0

C) at the rated M SL level.

Table 1. SnPb Entectic Process Package Peak Reflow Tem peratures

Package Thickness

Volum e m m

<350

Volum e m m

350

<2.5 m m

240 +0/-5

C 225

+0/-5

2.5 m m

225 +0/-5

C 225

+0/-5

Classificatin Reflow Profiles(Cont.)

ANPEC Electronics Corp.

Rev. A.4 - Apr., 2005

APX6219

www.anpec.com.tw

Application

Carrier Width

Cover Tape Width

Devices Per Reel

SOP- 24

24 21.3

1000

Application

330

1.5

12.75

0.15

0.6 24.4

0.2 2

0.2

0.3 12

0.1

.75

0.1

SOP- 24

11.5

0.1 1.55 +0.1 1.5+ 0.25 4.0

0.1 2.0

0.1 10.9

0.1 15.9

0.1 3.1

0.1 .35

0.05

(mm)

Anpec Electronics Corp.
Head Office :

5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050

Taipei Branch :

7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369

Customer Service

Cover Tape Dimensions

Carrier Tape(Cont.)

T 2

T 1

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