06/2002
ATA7603
10 Gb/s High Overload TIA
PRELIMINARY DATA SHEET - Rev 1.0
D1
Die
FEATURES
1800
Differential Transimpedance
3 mApp Maximum Input Current
14 pA/
Hz Input Noise Current Density
Single 5.2 V Power Supply
Low Group Delay
Outputs DC or AC Coupled
APPLICATIONS
SONET/SDH OC-192 /STM-64 VSR,
Short-Reach, Intermediate-Reach, and
Long-Reach Receivers
10 Gb/s Ethernet
Fiber optic receivers, transceivers, and
transponders
PRODUCT DESCRIPTION
The ANADIGICS ATA7603 is a 5.2 V high-speed
transimpedance amplifier (TIA) designed for
10 Gb/s optical receiver applications available in
bare die form and manufactured using an InGaP
based HBT process. The device is used in
conjunction with a photodetector to convert an
optical signal into a differential output voltage that
can be AC or DC coupled to a post amplifier. The
ATA7603 has an internal overload support circuit and
can accept optical inputs as high as +3 dBm. With
its low noise and high optical overload capability,
the device is well suited for 10 Gb/s Ethernet and
OC-192 Very Short-Reach (VSR), Short-Reach,
Intermediate-Reach and Long-Reach optical
receivers, transceivers and transponders.
Figure 1: Circuit Block Diagram
V
BIAS
I
IN
V
REF
DC
Offset
Control
Low Pass
Filter
C
EXT
V
EE
V
OUT
V
OUT
I
IN
V
OUT
C
EXT
V
EE
GND
GND
GND
GND
V
EE
V
OUT
GND
2
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
286
mm
170
mm
140
mm
303
mm
I
IN
V
OUT
C
EXT
V
EE
GND
GND
GND
GND
ATA7603
Die Size: 1000 m x 910 m
m
m
Die Thickness: 178 m
Backside metal thickness: 5 m
m
m
Pad Opening: 100
m
m
m x 100 m
unless otherwise noted
Pad Pitch 150 m unless otherwise
noted
m
GND
286
mm
V
EE
V
OUT
Figure 2: Die Size and Layout
Table 1: Pad Description
D
A
P
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L
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
3
ELECTRICAL CHARACTERISTICS
Table 2: Absolute Minimum and Maximum Ratings
Stresses in excess of the absolute ratings may cause permanent
damage. Functional operation is not implied under these conditions.
Exposure to absolute ratings for extended periods of time may
adversely affect reliability.
Table 3: Recommended Operating Conditions
The device may be operated safely over these conditions; however, parametric
performance is guaranteed only over the conditions defined in the electrical
specifications.
R
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n
4
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
Table 4: DC Electrical Specifications
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Table 5: AC Electrical Specifications
(1)
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d
Notes:
(1) The specifications are based upon the use of a PIN photodiode with a responsivity of 0.92 A/W and a
capacitance of C
DIODE
+ C
STRAY
= 0.3 pF max connected to I
IN
via a 1.0 nH bond wire.
(2) With the use of an external 10 nF capacitor.
(3) Maximum value - minimum value
(4) Measured at 10
-10
BER with a 2
23
-1 PRBS at 10 Gb/s
(5) Bandwidth = 9 GHz
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
5
PERFORMANCE DATA
3 dB Bandwidth = 9.9 GHz
15.2
18.2
21.2
24.2
27.2
0
2
4
6
8
10
12
Frequency(GHz)
R
esponse(
dB
)
Figure 3: Typical Small Signal Frequency
Response
Figure 4: Typical Small Signal Group Delay
180
200
220
240
260
280
300
320
0
2
4
6
8
10
12
Frequency(GHz)
Gr
oup
Delay
(
ps)
55
56
57
58
59
60
61
62
63
64
65
0
2
4
6
8
10
12
Frequency (GHz)
Gain
(dB)
Lin = 30mils, BW = 9.3GHz
Lin = 35mils, BW = 9.6GHz
Lin = 40mils, BW = 9.9GHz
Lin = 45mils, BW = 10.6GHz
Lin = 50mils, BW = 10.9GHz
Lin = 55mils, BW = 11.1GHz
Lin = 60mils, BW = 11.1GHz
Figure 5: Bandwidth vs. Input Inductance
Figure 6: Differential Transimpedance vs.
Input Current
0.000
0.500
1.000
1.500
2.000
2.500
3.000
10
100
1000
10000
Input Current (uApp)
Tz
(
K
ohm
s
)
Vee=-5.2V
VEE=-4.9V
VEE=-5.5V
0
100
200
300
400
500
600
700
800
900
0
200
400
600
800
1000
Input Current (uApp)
Output
V
o
ltage
(
mVpp)
VEE=-5.2V
VEE=-4.9V
VEE=-5.5V
Figure 7: Differential Output Voltage vs.
Input Current up to 1000 App
m
0
100
200
300
400
500
600
700
800
900
0
500
1000
1500
2000
2500
3000
3500
4000
Input Current (uApp)
O
u
t
put
V
o
l
t
age
(
m
V
pp)
VEE=-5.2V
VEE=-4.9V
VEE=-5.5V
Figure 8: Differential Output Voltage vs.
Input Current up to 4000 App
m
6
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
-40
-35
-30
-25
-20
-15
-10
-5
0
0
2
4
6
8
10
12
14
16
18
20
Frequency (GHz)
S2
2
(
d
B
)
Figure 14: S22 from Evaluation Test Fixture
Figure 9: Eye Diagram with an Optical Input
Power of -18 dBm
Figure 10: Eye Diagram with an Optical
Input Power of -10 dBm
Figure 11: Eye Diagram with an Optical
Input Power of 0 dBm
Figure 12: Eye Diagram with an Optical
Input Power of +3 dBm
Figure 13: Eye Diagram with an Optical
Input Power of +4 dBm
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
7
APPLICATION INFORMATION
Ceramic substrate
Ground pads
C
10nF
EXT
2 nH
typical
1.0 nH
typical
Kovar
pedestal
Photo-
diode
ATA7603
470 pF
470 pF
10 nF
V
BIAS
V
EE
V
(50
)
OUT
W
220 pF V
bypass
MIM capacitor
EE
V
(50
)
OUT
W
All die bonds are 0.5 nH
typical unless otherwise
noted
Figure 15: Bonding Diagram
8
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
PACKAGING
The ATA7603 is provided as bare die. For optimum
performance, the die should be packaged in a
hermetic enclosure and a low inductance ground
plane should be made available for power supply
bypassing and ground bonds. When packaging the
ATA7603, the temperature of the die must be kept
below 260 C to ensure device reliability. The
ATA7603 has backside metal but no ground vias are
connected to the backside of the die, so it is critical
to bond all of the ground pads to reduce ground
inductance. The die can be attached to the substrate
using epoxy or solder. A good thermally conductive,
silver-filled epoxy is recommended for epoxy
mounting. If solder is used for die attach, exposure
to temperatures at or above 260 C must be limited
to ensure the device reliability. A soft silicon/rubber
tip collet should be used for die mounting, although
tweezers can be used with extreme care.
Thermosonic ball bonding, at a stage temperature
of 150 to 175 C, with 1 to 1.3 mil gold wire, is the
recommended interconnect technique. The bond
force, time, and ultrasonic power are all critical
parameters and should be optimized to achieve the
best bonding performance. The recommended
bonding parameters are:
Stage Temperature: 175 C
Bond Time: 15 ms
Bond Ultrasonic Power: 70 mW
Bond Force: 70 g
Bond Velocity: 60 mils/ms
I
IN
Connection
For optimal performance, the bond wire from the
photodetector to I
IN
should be around 1nH. As the
inductance of this connection increases beyond
1nH, more gain peaking will occur and the group
delay performance will degrade.
V
EE
Connections
In order to achieve optimal performance, the V
EE
supply pads must be bypassed as close to the chip
as possible with one or two high resonant
frequency, low value capacitance, MIM capacitors.
In either case, both V
EE
bond pads need to be
connected to reduce the supply bond wire
inductance.
V
OUT
and V
OUT
Connections
The ATA7603 provides a differential output that can
be AC or DC coupled to the next stage of the receiver.
The output bond wires should be kept below 1 nH
for the best performance. If the device is being used
in a single-ended configuration, the unused output
port must be terminated into 50
.
C
EXT
Connection
In order to achieve the desired low frequency cutoff,
an external capacitor is required. A low inductance
multilayer chip capacitor of value 10 nF is
recommended.
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
9
TYPICAL APPLICATION CIRCUITS
V
BIAS
V
EE
W
50
V
OUT
ATA7603
10 nF
V
EE
V
OUT
I
IN
C
EXT
V
OUT
V
OUT
DC
OUT
DC
OUT
V
EE
V
EE
V
EE
V OS
EE
ALA7606
V
IN
V
IN
100 nF
W
50
(1)
(1)
V
BIAS
V
EE
W
50
V
OUT
ATA7603
10 nF
V
EE
V
OUT
I
IN
C
EXT
V
OUT
V
OUT
DC
OUT
DC
OUT
V
EE
V
EE
V
EE
V OS
EE
ALA7606
V
IN
V
IN
100 nF
W
50
(1)
(1)
Figure 16: ATA7603 DC Coupled to the ALA7606
Figure 17: ATA7603 AC Coupled to the ALA7606
Notes:
(1) The ALA7606 is a non-inverting amplifier and V
IN
and V
IN
can be interchanged.
10
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
NOTES
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
ATA7603
11
NOTES
WARNING
ANADIGICS products are not intended for use in life support appliances, devices or systems. Use of an ANADIGICS
product in any such application without written consent is prohibited.
IMPORTANT NOTICE
ANADIGICS, Inc.
141 Mount Bethel Road
Warren, New Jersey 07059, U.S.A.
Tel: +1 (908) 668-5000
Fax: +1 (908) 668-5132
URL: http://www.anadigics.com
E-mail: Mktg@anadigics.com
ANADIGICS, Inc. reserves the right to make changes to its products or to discontinue any product at any time without
notice. The product specifications contained in Advanced Product Information sheets and Preliminary Data Sheets are
subject to change prior to a product's formal introduction. Information in Data Sheets have been carefully checked and are
assumed to be reliable; however, ANADIGICS assumes no responsibilities for inaccuracies. ANADIGICS strongly urges
customers to verify that the information they are using is current before placing orders.
PRELIMINARY DATA SHEET - Rev 1.0
06/2002
12
ATA7603
ORDERING INFORMATION
R
E
B
M
U
N
R
E
D
R
O
E
R
U
T
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3
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7
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T
A
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t
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o
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1
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