D1 Package
FEATURES
10 Gb/s Differential Output TIA
+5V Power Supply
Low Group Delay
Small Size: 0.85mm x 0.914mm
325mW (typ) power dissipation
APPLICATIONS
SONET OC-192
10 Gb/s DWDM
10 Gb/s Ethernet
Product Description
ATA7601
5.0V 10 Gb/s TIA
Preliminary Data Sheet - Rev 1
The ANADIGICS ATA7601D1 is a 5V high-speed
transimpedance amplifier (TIA) for 10 Gb/s
applications available in bare die form and
manufactured using an InGaP HBT process.
The device is used in conjunction with a photodetector
Figure 1: Circuit Block Diagram
V
OUT
V
OUT
V
CC
C
EXT
V
BIAS
I
IN
GND
GND
GND
GND
GND
V
CC
V
OUT
V
OUT
C
EXT
I
IN
to convert an optical signal into a differential voltage
that must be AC coupled to a post amplifier. With its
low input noise, a sensitivity of better than -19dBm
(BER <10
-10
) can be achieved with the ATA7601D1.
2
Preliminary Data Sheet - Revision 1
03/01
ATA7601
V
C
C
V
0
.
7
I
N
I
p
p
A
m
4
T
S
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1
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t
C
5
6
-
p
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T
e
g
a
r
o
t
S
Absolute Maximum Ratings
Recommended Operating Conditions
R
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AC Characteristics
(2)
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m
DC Characteristics
2. The specifications are based upon the use of a PIN photodetector with a responsivity
at 1550nm of 0.85A/W and a capacitance of C
DIODE
+ C
STRAY
= 0.3pF max connected
to I
IN
via a 0.8nH bond wire.
3. With the use of an external capacitor.
4. Measured at 10
-10
BER with a 2
23
-1 PRBS at 10Gb/s.
5. 11GHz bandwidth.
6. Defined as 80% of the maximum output voltage.
1. Defined at the interface between the die and the substrate.
W
R
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M
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3
Preliminary Data Sheet - Revision 1
03/01
ATA7601
Pad Description
GND
GND
GND
GND
GND
V
CC
V
OUT
V
OUT
C
EXT
I
IN
Die Size: 850
m x 914
m
Pad Size: 114
m x 114
m
unless otherwise noted
Pad Pitch: 150
m
unless otherwise noted
353
m
183
m
225
m
189
m
292
m
245
m
Figure 2: Die Size and Layout
D
A
P
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T
P
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4
Preliminary Data Sheet - Revision 1
03/01
ATA7601
Figure 3: External Capacitor Required for Low Frequency Cutoff
10
100
1000
10000
0
50
100
150
200
250
300
350
400
Low Frequency Cutoff (kHz)
Cext (pF)
10mV/Div. 25ps/Div.
Figure 4: Eye Diagram with an Optical Input Power of -19dBm
40mV/Div. 25ps/Div.
Figure 5: Eye Diagram with an Optical Input Power of -9dBm
5
Preliminary Data Sheet - Revision 1
03/01
ATA7601
70mV/Div. 25ps/Div.
Figure 6: Eye Diagram with an Optical Input Power of -4dBm
0
50
100
150
200
250
300
350
400
0
100
200
300
400
500
600
700
800
Input Current (uApp)
O
u
tput Voltage (
m
Vpp)
Figure 7: Differential Output Voltage vs. Input Current
6
Preliminary Data Sheet - Revision 1
03/01
ATA7601
GND
GND
GND
GND
GND
V
CC
V
OUT
C
EXT
I
IN
1nF
ATA7601D1
1nF
+5V
50
50
50
transmission lines
V
OUT
V
BIAS
*
* This ground bond can be omitted if it interferes with the
placement of the photodetector.
Figure 8: Typical Bonding Diagram
Application Information
7
Preliminary Data Sheet - Revision 1
03/01
Packaging
The ATA7601D1 is provided as bare die. For optimum performance, the die should be packaged in a
hermetic enclosure and a low inductance ground plane should be made available for power supply
bypassing and ground bonds. The bond wire from the photodetector to I
IN
should be made as short as
possible. As the inductance of this connection increases beyond 1nH, more gain peaking will occur
and the group delay performance will degrade.
Output Connections
The ATA7601D1 provides a differential output that must be AC coupled to the next stage of the receiver
as the output buffer is not designed to drive a DC coupled 50W load. For single-ended applications,
one output of the ATA7601D1 must be AC terminated to a 50W load.
C
EXT
Connection
In order to achieve the desired low frequency cutoff, an external capacitor is required. A low inductance
surface mount chip capacitor or MIM capacitor is recommended.
Sensitivity Measurement
The typical sensitivity, as specified in the AC characteristics, is 19.5dBm. This was measured at a
BER of 10
-10
with a 10Gb/s, 2
23
-1 PRBS, using a lensed single mode fiber with the photodetector and
TIA in an open test fixture under the following conditions:
Photodetector active area: 32mm
Photodetector capacitance: 0.2pF
Photodetector responsivity: 0.85A/W
Lensed fiber beam width: 13mm (86.5% of contained power)
Lensed fiber focal distance: 3mm
When the photodetector and TIA are packaged in a hermetic enclosure, with the fiber optimally aligned
to the active area of the photodiode, an improvement in sensitivity should be observed.
Device Modeling and Simulation
S-parameter files of the TIA are available on the Anadigics web site (
http://www.anadigics.com
) or upon
request. Also included on the web-site is a virtual sample. This is an encrypted model of the TIA that
can be downloaded into the ADS simulation environment.
ATA7601
8
IMPORTANT NOTICE
ANADIGICS, Inc. reserves the right to make changes to its products or discontinue any product at any time without notice.
The Advanced Product data sheets and product specifications contained in this data sheet are subject to change prior to
a products formal introduction. The information in this data sheet has been carefully checked and is assumed to be reliable.
However, ANADIGICS assumes no responsibility for inaccuracies. ANADIGICS strongly urges customers to verify that the
information they are using is current before placing orders.
WARNING
ANADIGICS products are not intended for use in life support appliances, devices, or systems. Use of an ANADIGICS
product in any such application without written consent is prohibited.
ANADIGICS, Inc.
141 Mount Bethel Road
Warren, New Jersey 07059, U.S.A
Tel: +1 (908) 668-5000
Fax: +1 (908) 668-5132
http://www.anadigics.com
Mktg@anadigics.com
Preliminary Data Sheet - Revision 1
03/01
ATA7601
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