Document Outline
- Features
- Applications
- Description
- Ordering Information
- HCPL-3180 Standard DIP Package
- HCPL-3180 Gull Wing Surface Mount Option 300
- Solder Reflow Temperature Profile
- Regulatory Information
- DIN EN 60747-5-2 Insulation Characteristics (HCPL-3180 Option 060)
- Insulation and Safety Related Specifications
- Absolute Maximum Ratings
- Recommended Operating Conditions
- Electrical Specifications (DC)
- Switching Specifications (AC)
- Package Characteristics
- Figure 1. VOH Vs Temperature
- Figure 2. IOH Vs Temperature
- Figure 3. VOH Vs IOH
- Figure 4. VOL Vs Temperature
- Figure 5. IOL Vs Temperature
- Figure 6. VOL Vs IOL
- Figure 7. ICC Vs Temperature
- Figure 8. ICC Vs VCC
- Figure 9. IFLH Vs Temperature
- Figure 10. Propagation Delay Vs VCC ICC - SUPPLY CURRENT - mA mA TP - PROPAGATION DELAY - nS
- Figure 11. Propagation Delay Vs IF
- Figure 12. Propagation Delay Vs Temperature
- Figure 13. Propagation Delay Vs Rg
- Figure 14. Propagation Delay Vs Cg
- Figure 15. Transfer Characteristics
- Figure 16. Input Current Vs Forward Voltage
- Figure 17. IOH Test Circuit
- Figure 18. IOL Test Circuit
- Figure 19. VOH Test Circuit
- Figure 20. VOL Test Circuit
- Figure 21. IFLH Test Circuit
- Figure 22. UVLO Test Circuit
- Figure 23. TPLH, TPHL, Tr and Tf Test Circuit and Waveform
- Figure 24. CMR Test Circuit and Waveform
- Applications Information Eliminating Negative IGBT Gate Drive
- Selecting the Gate Resistor (Rg) for HCPL-3180
- Figure 27. Energy Dissipated in the HCPL-3180 for each IGBT
- Thermal Model (Discussion applies to HCPL-3180)
- LED Drive Circuit Considerations for Ultra High CMR Performance
- CMR with the LED On (CMRH)
- CMR with the LED Off (CMRL)
- Figure 31.
- Figure 32.
- Figure 33.
- Under Voltage Lockout Feature
- IPM Dead Time and Propagation Delay Specifications
Agilent HCPL-3180 2 Amp Output
Current, High Speed IGBT/MOSFET Gate
Drive Optocoupler
Data Sheet
Description
This family of devices consists of
a GaAsP LED. The LED is
optically coupled to an
integrated circuit with a power
stage. These optocouplers are
ideally suited for high frequency
driving of power IGBT and
MOSFETs used in Plasma
Display Panels, high
performance DC/DC convertors
and motor control invertor
applications.
Ordering Information
Specify part number followed by
option number (if desired):
Example : HCPL-3180-XXX
Features
2 A minimum peak output current
250 KHz maximum switching
speed
High speed response: 200 ns max
Propagation delay over
temperature range
10 KV/us minimum common mode
rejection (CMR) at V
CM
=1500 V
Under voltage lockout protection
(UVLO) with hysteresis
Wide operating temperature
range: -40 C to +100
C
Wide V
CC
operating range:
10 V to 20 V
20 ns typ pulse width distortion
Safety Approvals:
UL approval pending
3750 V
RMS
for 1 minute.
CSA approval
DIN EN 60747-5-2 approval
pending
Applications
Plasma Display Panel (PDP)
Distributed power architecture
(DPA)
Switch mode rectifier (SMR)
High performance DC/DC
convertor
High performance switch mode
power supply (SMPS)
High performance uninterruptible
power supply (UPS)
Isolated IGBT/Power MOSFET
gate drive
No option = Standard DIP
package, 50 per tube.
300 = Gull Wing Surface Mount
Option, 50 per tube.
500 = Tape and Reel Packaging
Option.
060 = DIN EN 60747-5-2 Option,
VIORM=630 Vpeak (pending
approval)
N/C
ANODE
CATHODE
N/C
V
CC
V
O
V
EE
1
6
3
4
2
7
8
5
V
O
Functional Diagram
A 0.1 uF bypass capacitor must be connected between pins 5 and 8.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/
or degradation which may be induced by ESD.
2
HCPL-3180 Standard DIP Package
HCPL-3180 Gull Wing Surface Mount Option 300
3
0
TIME (SECONDS)
TEMPERATURE (C)
200
100
50
150
100
200
250
300
0
30
SEC.
50 SEC.
30
SEC.
160C
140C
150C
PEAK
TEMP.
245C
PEAK
TEMP.
240C
PEAK
TEMP.
230C
SOLDERING
TIME
200C
PREHEATING TIME
150C, 90 + 30 SEC.
2.5C 0.5C/SEC.
3C + 1C/0.5C
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
PREHEATING RATE 3C + 1C/0.5C/SEC.
REFLOW HEATING RATE 2.5C 0.5C/SEC.
Solder Reflow Temperature Profile
Regulatory Information
The HCPL-3180 is pending
approval by the following
organizations:
DIN EN 60747-5-2
Pending approval under DIN
EN-60747-5-2 with V
IORM
= 630
V
PEAK
UL
Approval under UL 1577,
component recognition program
up to V
ISO
= 2500 V
RMS.
Pending
3750 V
RMS.
CSA
Approval under CSA
Component.
4
DIN EN 60747-5-2 Insulation Characteristics (HCPL-3180 Option 060)
*
Refer to the optocoupler section of the Isolation and Control Components Designer's Catalog, under Product Safety Regulations section, (DIN) for a
detailed description of Method A and Method B partial discharge test profiles.
** Refer to the following figure for dependence of P
S
and I
S
on ambient temperature.
Description
Symbol
HCPL-3180
Unit
Installation classification per DIN EN 0110 1997-04
for rated mains voltage 150 Vrms
I - IV
for rated mains voltage 300 Vrms
I - III
for rated mains voltage 600 Vrms
I - II
Climatic Classification
55/100/21
Pollution Degree (DIN EN 0110 1997 -04)
2
Maximum Working Insulation Voltage
V
IORM
630
Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875=VPR, 100% Production Test withtm=1 sec, Partial discharge < 5 pC
V
PR
1181
Vpeak
Input to Output Test Voltage, Method a*
VIORM x 1.5=VPR, Type and Sample Test, tm=60 sec,Partial discharge < 5 pC
V
PR
945
Vpeak
Highest Allowable Overvoltage (Transient Overvoltage tini = 10 sec)
V
IOTM
6000
Vpeak
Safety-limiting values - maximum values allowed in the event of a failure.
Case Temperature
T
S
175
C
Input Current**
I
S, INPUT
230
mA
Output Power**
P
S, OUTPUT
600
mW
Insulation Resistance at TS, VIO = 500 V
R
S
>10
9
W
OUTPUT POWER P
S
, INPUT CURRENT I
S
0
0
T S CASE TEMPERATURE C
200
600
400
25
800
50
75
100
200
150 175
PS (mW)
125
100
300
500
700
IS (mA)
5
Insulation and Safety Related Specifications
Absolute Maximum Ratings
Recommended Operating Conditions
Parameter
Symbol
HCPL-3180
Units
Conditions
Minimum External Air Gap (Clearance)
L(101)
7.1
mm
Measured from input terminals to output terminals, shortest
distance through air.
Minimum External Tracking (Creepage)
L(102)
7.4
mm
Measured from input terminals to output terminals, shortest
distance path along body.
Minimum Internal Plastic Gap
(Internal Clearance)
0.08
mm
Through insulation distance conductor to conductor, usually
the straight line distance thickness between the emitter and
detector.
Tracking Resistance
(Comparative Tracking Index)
CTI
>175
V
DIN IEC 112/VDE 0303 Part 1
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Parameter
Symbol
Min
Max
Units
Note
Storage Temperature
T
S
-55
+125
C
Junction Temperature
Tj
-40
+125
C
Average Input Current
I
F(AVG)
25
mA
1
Peak Transient Input Current (<1s pulse width, 300 pps)
I
F(TRAN)
1.0
A
Reverse Input Voltage
V
R
5
V
"High" Peak Output Current
I
OH(PEAK)
2.5
A
2
"Low" Peak Output Current
I
OL(PEAK)
2.5
A
2
Supply Voltage
V
CC
- V
EE
-0.5
25
V
Output Voltage
V
O(PEAK)
0
V
CC
V
Output Power Dissipation
P
O
250
mW
3
Total Power Dissipation
P
T
295
mW
4
Lead Solder Temperature
+260 C for 10 sec., 1.6 mm below seating plane
Solder Reflow Temperature Profile
See Package Outline Drawings section
Parameter
Symbol
Min
Max
Units
Note
Power Supply
V
CC
- V
EE
10
20
V
Input Current (ON)
I
F(ON)
10
16
mA
Input Voltage (OFF)
V
F(OFF)
- 3.0
0.8
V
Operating Temperature
T
A
- 40
100
C
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