ABB Semiconductors AG reserves the right to change specifications without notice.
V
RRM
=
6000 V
I
FAVM
=
250 A
I
FSM
=
3.6 kA
V
F0
=
2.5 V
r
F
=
2.5 m
V
DClink
=
3000 V
Doc. No. 5SYA1108-02 Sep. 01
Patented free-floating silicon technology
Low switching losses
Optimized for use as snubber diode in high-voltage GTO converters
Standard press-pack ceramic housing, hermetically cold-welded
Cosmic radiation withstand rating
Blocking
V
RRM
Repetitive peak reverse voltage
6000 V
Half sine wave, t
P
= 10 ms, f = 50 Hz
I
RRM
Repetitive peak reverse current
50 mA
V
R
= V
RRM,
T
j
= 125C
V
DClink
Permanent DC voltage for 100 FIT
failure rate
3000 V
100% Duty
V
DClink
Permanent DC voltage for 100 FIT
failure rate
3800 V
5% Duty
Ambient cosmic radiation at
sea level in open air.
Mechanical data
(see Fig. 7)
min.
10 kN
F
m
Mounting force
max.
12 kN
a
Acceleration:
Device unclamped
Device clamped
50
200
m/s
2
m/s
2
m
Weight
0.25 kg
D
S
Surface creepage distance
30 mm
D
a
Air strike distance
20 mm
Fast Recovery Diode
5SDF 02D6002
PRELIMINARY
5SDF 02D6002
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA1108-02 Sep. 01
page 2 of 5
On-state
(see Fig. 2, 3)
I
FAVM
Max. average on-state current
250 A
I
FRMS
Max. RMS on-state current
400 A
Half sine wave, T
c
= 85C
I
FSM
Max. peak non-repetitive
3.6 kA
tp
=
10 ms
Before surge:
surge current
11.4 kA
tp =
1 ms
T
c
= T
j
= 125C
65
10
3
A
2
s
tp =
10 ms
After surge:
I
2
dt
Max. surge current integral
65
10
3
A
2
s
tp =
1 ms
V
R
0 V
V
F
Forward voltage drop
5 V
I
F
=
1000 A
V
F0
Threshold voltage
2.5 V
Approximation for
r
F
Slope resistance
2.5 m
I
F
= 200...4000
A
T
j
= 125C
Turn-on
(see Fig. 4, 5)
V
fr
Peak forward recovery voltage
370 V
di/dt = 1000 A/s, T
j
= 125C
Turn-off
(see Fig. 6)
I
rr
Reverse recovery current
260 A
Q
rr
Reverse recovery charge
2000 C
E
rr
Turn-off energy
-- J
di/dt = 100 A/s,
T
j
= 125 C,
I
F
= 1000 A,
V
RM
= 6000 V,
R
S
= 22
,
C
S
= 0.22 F
Thermal
(see Fig. 01)
T
j
Operating junction temperature range
-40...125C
T
stg
Storage temperature range
-40...125C
R
thJC
Thermal resistance junction to case
80 K/kW
Anode side cooled
80 K/kW
Cathode side cooled
40 K/kW
Double side cooled
R
thCH
Thermal resistance case to heatsink
16 K/kW
Single side cooled
F
m
=
10... 12 kN
8 K/kW
Double side cooled
Analytical function for transient thermal impedance.
i
1
2
3
4
R
i
(K/kW)
20.95
10.57
7.15
1.33
i
(s)
0.396
0.072
0.009
0.0044
)
e
-
(1
R
=
(t)
Z
n
1
i
/
t
-
i
thJC
=
i
F
m
= 10... 12 kN Double side cooled
5SDF 02D6002
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA1108-02 Sep. 01
page 3 of 5
Fig. 1
Transient thermal impedance (junction to case) vs. time in analytical and graphical form (max. values).
Fig. 2
Forward current vs. forward voltage (typ.
and max. values).
Fig. 3
Surge current and fusing integral vs. pulse
width (max. values) for non repetitive, half-
sinusoidal surge current pulses.
5SDF 02D6002
ABB Semiconductors AG reserves the right to change specifications without notice.
Doc. No. 5SYA1108-02 Sep. 01
page 4 of 5
Fig. 4
Typical forward voltage waveform when the
diode is turned on with a high di/dt.
Fig. 5
Forward recovery voltage vs. turn-on di/dt
(max. values).
Fig. 6
Typical current and voltage waveforms at
turn-off with conventional RC snubber circuit
5SDF 02D6002
ABB Semiconductors AG reserves the right to change specifications without notice.
ABB Semiconductors AG
Doc. No. 5SYA1108-02 Sep. 01
Fabrikstrasse 3
CH-5600 Lenzburg, Switzerland
Telephone +41 (0)62 888 6419
Fax
+41 (0)62 888 6306
Email
abbsem@ch.abb.com
Internet
www.abbsem.com
Fig. 7
Outline drawing. All dimensions are in millimeters and represent nominal values unless stated otherwise.
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